COM-HPC Product Overview
High performance Computer on Module formfactor
There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
- AMD Ryzen™ AI Embedded X100
- TDP Range from 45W to 120W
- NPU with 50 TOPS
- Up to 128 GB LPDDR5x
- Industrial Temp. Range
- Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
- Up to 16 CPU cores
- Integrated NPU with up to 50 TOPS
- Up to 96 GB LPDDR5x memory
- Up to PCI Express Gen5
- Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
- Up to 16 CPU cores
- Integrated NPU with up to 50 TOPS
- Up to 96 GB LPDDR5x
- Industrial temperature range
- Qualcomm® Dragonwing IQ-X processors
- Up to 12 Oryon™ CPU cores
- Hexagon™ NPU with 45 TOPS
- Up to 64 GB LPDDR5x
- Industrial Temp. Range
conga-sdIL
- Intel® Xeon® D-1700 / D-1800 processors
- Up to 10 cores
- Up to 64GB soldered RAM | ECC support
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
- 13th Gen Intel® Core™ 2xx series processors (Bartlett Lake-S)
- Up to 24 CPU cores
- AI acceleration with Intel® Deep Learning Boost (VNNI)
- Up to 192 GB DDR5 memory
- PCI Express Gen 5 and USB 3.2 Gen 2x2
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- 13th/14th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
- Intel® Xeon® D2700 processors
- Up to 20 cores
- Up to 1 TB RAM
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
- Intel® Xeon® D1700 processors
- Up to 10 cores
- Up to 256 GB RAM
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/EVAL-Server
- Evaluation carrier board for Size D & E
- 7x PCIe connectors for 52 lanes
- 10 GbE RJ45 through module
- GbE RJ45 through ASPEED AST2600
conga-HPC/EVAL-Client
- Evaluation carrier board for sizes A, B, C
- 5x PCIe connectors for 48 lanes
- 2x MIPI Camera Serial Interface
- KR connector to connect LAN mezzanine cards
No results found. Please widen your search.