congatec Whitepapers

The integration of Intel Xeon D processors on COM-HPC Server-on-Modules from manufacturers such as congatec allows edge server installations to break free from the tight thermal constraints of air-conditioned server rooms. 

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The 12th generation Intel Core mobile and desktop processors have recently arrived in the embedded computing space, with implementations on the high-performance Computer-on-Module standards COM-HPC and COM Express.

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congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.

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PICMG launched a COM-HPC interface specification for the management of embedded systems platforms. The goal is to help edge server engineers manage systems remotely. For example, if a system is hung up, an IT administrator can hit reset with the same effect as if he had gone to a factory floor or other site.

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The new Intel Xeon, Core, and Celeron processors (code name “Tiger Lake-H”) can develop their full performance potential on COM-HPC modules. Their availability from module market leader congatec also marks a new era of computer-on-module–based system development.

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The new Intel Atom® x6000E Series, Intel Celeron® and Pentium® N & J processors impress with twice the graphics speed of their predecessors and 50% more multi-thread performance on up to 4 cores. 


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congatec’s COM-HPC module delivers the design flexibility and high performance needed to power AI, graphics, and other data-intensive applications driving modern healthcare systems.

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The way in which embedded integration is realized determines the success of AI-based systems in biomedical engineering applications – whether for diagnoses, defibrillators, or live images from minimally invasive surgery. Preconfigured embedded modules help developers find specific solutions for medical applications faster.

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The integration of embedded vision is crucial to the success of AI-accelerated systems whether they are deployed in self-driving vehicles, video surveillance cameras or collaborative robotics. Preconfigured embedded vision building blocks make it easier for developers to create custom solutions fast.

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Built on 11th Gen Intel® Core™ processors, congatec’s conga-TS570 COM Express Type 6 and conga-HPC/cTLH COM-HPC Client modules bring near real- time performance, scalability, security, and resilience to a new class of edge computing applications.

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Embedded edge servers and microservers need high performance. Anyone wanting to develop such high-performance systems scalably with server-on-modules for harsh environments needs an ecosystem based on COM Express Type 7 with fanless support for TDPs of up to 100 W
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Three-dimensional machine vision is admittedly not the simplest of technologies to recognize things. However, because it is closest to the human eye, 3D vision has a wide range of applications and is increasingly being used alongside machine learning.

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It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.
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congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible.

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Tasks at the embedded edge are getting more and more complex. Supporting up to 8 cores and 16 threads, the recently launched AMD Ryzen Embedded V2000 processors are paving the way for x86-based embedded designs with unprecedented compute density and performance per watt. 

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The growing need to lower latency and reduce energy-hungry data traffic over long distances is leading to rapidly rising deployment of server technology and data centers at the edge. Server-on-Modules based on the COM-HPC and COM Express standards offer a highly efficient design basis for this.

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Industrial edge server designs must be highly flexible to integrate the ability to perform diverse tasks. Increasingly, virtual machines are being used to consolidate a variety of
Industry 4.0 workloads. Learn more about hardware consolidation and modular edge computing

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With the emergence of 5G technologies and the arrival of 10+ GbE networks in the industrial sector, real-time processing leveraging time-sensitive networking in tactile Internet environments is becoming an important new application area. What are the requirements for TSN-enabled edge computers?

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In parallel with the launch of the 11th Intel® Core™ processor generation (codenamed
Tiger Lake), congatec has made the new processors available on COM-HPC Size A and COM Express Compact Computer-on-Modules.

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The new COM Express® Type 7 specification defines high-end Server-on-Modules that support multiple 10 GbE connections. The modules simplify and optimize the design of infrastructure equipment in rugged environments, in particular with regards to the specific size, weight and power restraints of these applications.

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Color video technology paired with artificial intelligence is a large development field for the future optimization of patient care. Mobile systems have an important role to play in this context, and OEMs need solutions that integrate embedded vision and embedded computer technology.

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The embedded computing industry is about to launch COM-HPC as the next-generation standard for modular system designs. Since COM-HPC is complex and sometimes
misunderstood, there is a need for clear information.

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What are the most important markets and applications for the new high-end Server-on-Modules and what are the limits?

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COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?

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congatec uses Intel Atom® x6000E Series processors plus Intel® Pentium® and Celeron® N and J series processors to bring full-featured computing and IoT services to their SMARC 2.0, Qseven, COMe Mini, COMe compact modules, and Pico-ITX boards

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congatec COM-HPC modules use “Enhanced for IoT” 11th Gen Intel® Core™ processors to meet demand for more lanes and more processing power that can scale

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Computer-based vision is growing more and more important in robotic systems. But how do you fuse hard real-time applications and time-sensitive networking (TSN) with vision systems and artificial intelligence (AI)?

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Sparse Modeling featuring slim but powerful artificial intelligence for embedded systems

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COM-HPC™ is the new and coming PICMG standard for high-performance Computer-on-Modules. The pinout and therefore also the functionality were recently officially approved. Elektronik is revealing further- details.

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The x86 rivalry has once again been rekindled. With the introduction of the AMD Ryzen™
Embedded processors, AMD has set a new benchmark that extends the company’s existing
lead in graphics with 108% more performance, and increases overall computing performance
by 144%. 

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congatec simplifies IoT with embedded form factors based on 8th Gen Intel® Core™ U-series processors.

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congatec, Basler and NXP Semiconductors have developed a function toolkit for deep learning applications in retail. The platform is a proof-of-concept, using artificial intelligence (AI) to fully automate the retail checkout process.
 

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The path to plug and play cloud solutions leads via cloud API standardization.

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The Service Robotics Research Center of Ulm University of Applied Sciences is developing
a modular software framework to make it easier to program robots. The goal is to provide
software components that can be used universally, for instance to swap robotic gripping
arms from different manufacturers as required to generate new robotics solutions via
plug and play.

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The Computer-on-Module industry is about to launch a new product lifecycle that will create a new performance class after ETX/XTX and COM Express. Called COM-HPC, the new form factor standard is currently primed for PICMG certification by companies such as congatec.

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More manufacturers of computer technology for harsh environments are expanding their
hardware offerings with the right ‘glue logic’ to develop IoT solutions. congatec advocates
vendor-independent standardization to ensure that these solutions remain scalable in
line with requirements.

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Connecting their fleets to the clouds is a must for transport operators today. The Spanish
solution provider Datik is specialized in such cloud-based solutions for public transport.

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New benchmark modules for high-end embedded computing. congatec COM Express Type 6 modules with AMD Ryzen™ Embedded processors

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congatec has launched the new low-power Intel Atom® x6000 Series, Celeron® and Pentium®
processors (code name Elkhart Lake) on five embedded form factors: SMARC, Qseven, COM
Express Compact and Mini, and Pico-ITX single board computers (SBCs).

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Medical imaging vendors want to improve their services for medical professionals by adding Artificial Intelligence (AI) and Augmented Reality (AR) to their devices. For small form factor devices, AMD embedded processor based Computer-on-Modules are a good choice to balance the performance needs of their AI inference engines under space and power restricted conditions.

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The 8X version of the NXP i.MX 8 processor has an extremely low power consumption, is robust and comes with many functional safety features. congatec now supports it on the SMARC 2.0 and Qseven module standards.
 

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As industrial manufacturers look to capitalize on the efficiency and insights of Industry 4.0 they must transition their electronics infrastructure to support intelligence at the edge of operational networks. 

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Server processors are getting more and more energy efficient. Embedded application developers use them to boost performance, which also opens up completely new application fields for them. congatec supports such OEM designs with application-ready COM Express Type 7 modules and platforms. 

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High-end industrial applications demand continuous performance upgrades. In times when new embedded processor generations offer significant performance gains each year, modular designs present a distinct advantage.

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COM Express is heading towards “Server-on-Module”

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Want to use USB-C for Embedded? Do it right!
Advantages and Pitfalls of USB-C Implementations

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Next generation Intel^® low-power "Apollo Lake"  processors and their benefits

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SMARC 2.0 - A New Standard to Bridge the Gap between Qseven and COM Express

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10 GbE in real time. COM Express Type 7 for fog and Industry 4.0 servers

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congatec explains what really counts if you want to deploy motherboards outside your cozy home and office.

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congatec and Intel accelerate Time to Market for Small, Smart Cameras

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Computer-on-Modules are world-leading platforms for embedded system designs.

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The future of Industry 4.0 systems across all sectors lies in the combination of fog server and real time technology.

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Real-Time Systems and Intel take industrial embedded systems to the next level
Innovative hypervisor and partitioning software increases flexibility and functionality for industry

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The 8th generation Intel Core Mobile processors deliver up to 40% more performance than the
predecessor generation. congatec now offers the new cores on extremely compact 3.5-inch
single-board computers (SBCs).

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In the past, electronic components were tailored to specific automotive platforms in order to reduce costs in series production. But in the cockpits of tomorrow, the days of proprietary controller platforms for dedicated functions are over; the future lies in clustering individual mobility functions by using universally applicable computing cores.

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SMARC 2.0 modules stand out with their rich choice of graphics, camera, sound, network and optional wireless interfaces. The updated specification SMARC 2.1 extends this feature set even further. Two PCI Express lanes can be used alternatively as additional Ethernet ports. Extra two MIPI CSI interfaces and additional GPIOs also extends the possibilities of SMARC modules.

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With the coming of 5G technology and the implementation of 10+ GbE networks in factories, real-time data processing for OPC UA and other tactile Internet applications is emerging as an important new area of use.

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congatec is presenting a 3.5 inch board for the first time at Embedded World 2019.
Like the new COM Express Type 6 module that provides the technology base for the new board,
it is equipped with 8th Generation Intel Core i7 Mobile processors. What can the embedded market expect from this?

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SMARC 2.0 is the great new Computer-on-Modules standard for the efficient design of powerful and feature-rich small form factor (SFF) applications.

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The 8th generation of Intel Core Mobile processors offers a mighty 40% increase in performance over that of the predecessor generation. However, there are even more reasons that speak in favor of the new Intel Core Mobile processors, which are a perfect fit for many different embedded industries.

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