Computer-On-Module for High Performance Computing

Why a new standard?


  • Support for fastest I/O i.e. PCIe Gen5, USB4 25G Ethernet
  • More I/O Interfaces i.e. 64x PCIe, 8x 25G Ethernet
  • More DRAM, up to 1 TByte (8x full size DIMM)
  • Server CPU performance, up to 300 Watt power consumption for a Server-On-Module

COM-HPC target


  • PCIe 5.0 (32 Gb/s) with 64 lanes
  • 100 Gb Ethernet
  • USB4 / Thunderbolt up to 40 Gb/s
  • DisplayPort 2.0 up to 80 Gb/s
  • Light weight System Management

COM-HPC will not replace COM Express.
It extends the Computer-On-Module concept to a full featured Server-On-Module.

More about conga-HPC/cALS


COM-HPC Client Size C module based on 12th Gen Intel® Core™ processor series (code name "Alder Lake")

More about conga-HPC/cALP


COM-HPC high performance module based on 12th Gen Intel® Core™ processor series (code name "Alder Lake")

More about conga-HPC/cTLH


COM-HPC high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake-H")

More about conga-HPC/cTLU​


COM-HPC high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake")



COM-HPC Types and Sizes


  • Up to 65 PCI Express Gen 5 Lanes
  • Up to 8x 25 Gb Ethernet
  • Up to 2x USB 4
  • Headless
  • Sizes
         ►Size D: 160x160 mm
         ►Size E: 160x200 mm


  • Up to 49 PCI Express Gen5 Lanes
  • Up to 2x 25 Gb Ethernet
  • Up to 4x USB 4
  • Up to 4x Video Interfaces
  • Sizes
         ►Size A: 95x120 mm
         ►Size B: 120x120 mm
         ►Size C: 120x160 mm




COM-HPC Types Overview


Supporting companies

Adlink, Kontron, congatec



25 Members
Acromag, Adlink, Advantech, AMI, Amphenol, congatec, Elma Electronic, Emerson Machine Automation Solutions, Ept, Eurotech, Fastwel, GE Automation, HEITEC, Intel, Kontron, MEN, MSC Technologies, N.A.T., nVent, Samtec, Seco, TE Connectivity, Trenz Electronic, University Bielefeld, VersaLogic Corp.

Official Positions:
► Chairman: Christian Eder, congatec
► Editor:       Stefan Milnor, Kontron
► Secretary:  Dylan Lang, Samtec


PICMG workgroup officially started Oct 23, 2018
► Pre release of Mechanics and Pinout Oct 2019
► Main Hardware Specification PICMG release Jan/2021
► EEEP Specification Q1/2021
► System Management Specification Q1/2021
► Design Guide Mid 2021


COM-HPC Connector

COM-HPC Interconnect Targets

  • Signal Integrity
         ►PCIe Gen4/Gen5 Compliant
         ►10G/25G Ethernet Compliant
  • High pin count
  • 5 & 10mm stack height
  • Up to 300W at 11.4 - 12.6V
  • Multi vendor availability


COM-HPC Preview Specification

A preview version of the hardware specification is available for free at:

The complete specification is available for purchase at


COM-HPC Webinars

This COM-HPC webinar puts engineers in the fast lane to leveraging the latest technology for hosting powerful AI applications together with mission critical real-time tasks on one single platform. 

This webinar will give you an overview of the technology, applications, requirements and capabilities of this new PICMG standard.


COM-HPC video


Do you want to learn more about COM-HPC?

Download our whitepapers!


COM-HPC™ is the new and coming PICMG standard for high-performance Computer-on-Modules. The pinout and therefore also the functionality were recently officially approved. Elektronik is revealing further- details.

Download Whitepaper

COM-HPC: What developers and users need to know

The embedded computing industry is about to launch COM-HPC as the next-generation standard for modular system designs. Since COM-HPC is complex and sometimes
misunderstood, there is a need for clear information.

Download Whitepaper

COM HPC Server – the new Server-on-Module standard

What are the most important markets and applications for the new high-end Server-on-Modules and what are the limits?

Download Whitepaper

COM-HPC carrier board designs

COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?

Download Whitepaper