COM-HPC Product Overview

High performance Computer on Module formfactor

Details about the COM-HPC Specification

Products

conga-HPC/cRX1

  • AMD Ryzen™ AI Embedded X100 
  • TDP Range from 45W to 120W
  • NPU with 50 TOPS
  • Up to 128 GB LPDDR5x
  • Industrial Temp. Range

conga-HPC/cPTL

  • Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
  • Up to 16 CPU cores
  • Integrated NPU with up to 50 TOPS
  • Up to 96 GB LPDDR5x memory
  • Up to PCI Express Gen5

conga-HPC/mPTL

  • Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
  • Up to 16 CPU cores
  • Integrated NPU with up to 50 TOPS
  • Up to 96 GB LPDDR5x
  • Industrial temperature range

conga-HPC/mIQ-X

  • Qualcomm® Dragonwing IQ-X processors
  • Up to 12 Oryon™ CPU cores
  • Hexagon™ NPU with 45 TOPS
  • Up to 64 GB LPDDR5x
  • Industrial Temp. Range

conga-sdIL

  • Intel® Xeon® D-1700 / D-1800 processors
  • Up to 10 cores
  • Up to 64GB soldered RAM | ECC support
  • Ext. temp. options
  • 100 Gb max. Ethernet bandwidth

conga-HPC/cBLS

  • 13th Gen Intel® Core™ 2xx series processors (Bartlett Lake-S)
  • Up to 24 CPU cores
  • AI acceleration with Intel® Deep Learning Boost (VNNI)
  • Up to 192 GB DDR5 memory
  • PCI Express Gen 5 and USB 3.2 Gen 2x2

conga-HPC/mRLP

  • 13th Generation Intel® Core™
  • Intel® Xe graphics engine
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4

conga-HPC/cRLS

  • 13th/14th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Performance-optimized design
  • Up to 24 cores
  • PCIe Gen 5

conga-HPC/cRLP

  • 13th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 5

conga-HPC/sILH

  • Intel® Xeon® D2700 processors
  • Up to 20 cores
  • Up to 1 TB RAM
  • Ext. temp. options
  • 100 Gb max. Ethernet bandwidth

conga-HPC/sILL

  • Intel® Xeon® D1700 processors
  • Up to 10 cores
  • Up to 256 GB RAM
  • Ext. temp. options
  • 100 Gb max. Ethernet bandwidth

conga-HPC/cTLH

  • 11th Generation Intel® Core™
  • Intel® Xe graphics engine
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4

conga-HPC/cTLU​

  • 11th Generation Intel® Core™
  • Power- and size-optimized design
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4

conga-HPC/EVAL-Server

  • Evaluation carrier board for Size D & E
  • 7x PCIe connectors for 52 lanes
  • 10 GbE RJ45 through module
  • GbE RJ45 through ASPEED AST2600

conga-HPC/EVAL-Client

  • Evaluation carrier board for sizes A, B, C
  • 5x PCIe connectors for 48 lanes
  • 2x MIPI Camera Serial Interface
  • KR connector to connect LAN mezzanine cards

aReady.COM is congatec’s pre-validated and pre-configured platform that combines modular hardware and software building blocks to accelerate embedded development. It includes Computer-on-Modules, virtualization by Hypervisor, and pre-installed, licensed OS like ctrlX OS or Ubuntu Pro. Whether for edge computing or IIoT, aReady.COM simplifies integration, enhances security, and shortens time to market.


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