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conga-HPC/EVAL-Client

Evaluation Carrier Board for COM-HPC Client Type Modules

  • Evaluation Carrier Board for COM-HPC Client Type Modules
  • Routing of the entire signals provided by COM-HPC Module Base Specification R1.0 to standard interface connectors

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    Specification


    Formfactor

    Extended ATX 
     

    Board Variant

    Evaluation Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C)
     

    Internal Connectors and Features

    • 2x PCIe Gen4 x16
    • 3x PCIe Gen4 x4
    • 1x BMC PCIe x1
    • 2x USB4
    • 1x M.2 Key B 2242 (USB2, 2x PCIe)
    • 1x M.2 Key E 2230 (USB2, 2x PCIe)
    • 1x two-lane KR connector to connect Mezzanine Cards for LAN options 1x eDP (with option for LVDS)
    • 1x DMIC header
    • 1x I2S SNDW header
    • 2x MIPI CSI
    • 2x SATA
    • 1x SATA Power
    • 1x Disk Drive Power
    • 4x COM (2x via SIO)
    • 1x GPSPI header
    • 1x I2C header
    • 1x SMB header
    • 1x GPIO header
    • 1x Feature header
    • 1x System Fan
    • 1x CPU Fan

    External Connectors

    • 1x Dual USB 2
    • 3x DP++
    • 2x 10GbE RJ45 
    • 4x USB 4
    • 1x Audio Jack 4-pin with SNDW CODEC

    Postcode

    4x 7-Segment Postcode LEDs connected to PD I2C
     

    Power Input

    • 1x ATX standard power input 24pin
    • 1x ATX power 12V power input 4pin
    • 1x AT power input DC In 8-21Vmax (via 4x banana jacks)
       

    Operating Temperature

    Operating Temp.: 0°C … +60°C | Storage Temp.: -20°C … +70°C
     

    Humidity

    Operating Hum.: 10% … 90% r. H. non cond. | Storage Hum.: 5% … 95% r. H. non cond.
     

    Size

    304.8 x 330.2 mm (approx. 12 x 13 inches)

    Documents

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