COM-HPC Product Overview
High performance Computer on Module formfactor
There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
- AMD Ryzen™ AI Embedded X100
- TDP Range from 45W to 120W
- NPU with 50 TOPS
- Up to 128 GB LPDDR5x
- Industrial Temp. Range
- Intel® performance hybrid design with up to 16 cores
- Onboard LPDDR5x with in-band ECC on selected product variants
- Integrated NPU for dedicated AI acceleration
- Up to PCI Express Gen5
- Intel® performance hybrid design with up to 16 cores
- Integrated NPU for dedicated AI acceleration
- Onboard LPDDR5x with in-band ECC on selected
- product variants Onboard NVMe SSD with 128GB
- Qualcomm® Dragonwing IQ-X processors
- Up to 12 Oryon™ CPU cores
- Hexagon™ NPU with 45 TOPS
- Up to 64 GB LPDDR5x
- Industrial Temp. Range
conga-sdIL
- Intel® Xeon® D-1700 / D-1800 processors
- Up to 10 cores
- Up to 64GB soldered RAM | ECC support
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
- Product variants based on Intel® hybrid design and Intel® P-core only
- Up to Intel® UHD Graphics 770 driven by Xe Architecture
- PCI Express Gen 4 and 5 | USB 3.2 Gen 2x2
- AI Acceleration based on Intel® Deep Learning Boost (VNNI)
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- 13th/14th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/EVAL-Server
- Evaluation carrier board for Size D & E
- 7x PCIe connectors for 52 lanes
- 10 GbE RJ45 through module
- GbE RJ45 through ASPEED AST2600
conga-HPC/EVAL-Client
- Evaluation carrier board for sizes A, B, C
- 5x PCIe connectors for 48 lanes
- 2x MIPI Camera Serial Interface
- KR connector to connect LAN mezzanine cards
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