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conga-sdID

COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family

Ausgewählte Modulvariante

    Ausgewählte Ecosystem Parts

    Carrierboards

      Cooling Solutions

        Zusätzliche Ecosystem Parts


        Carrierboards

        Cooling Solutions

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        conga-sdID

        formerly JUMPtec COMh-sdID
        COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family 
         

        Learn all about COMs - download the guide

        • Up to 20 cores, processor TDP up to 125W
        • 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
        • Max 512GB DDR4-DIMM with 4x DIMM sockets
        • Optional onboard storage NVMe
        • Industrial temperature versions
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        Wollen Sie noch weitere Produkte aus unserem Ecosystem (zB. Carrierboards oder Arbeitsspeicher) zu Ihrer Anfrage hinzufügen?

        Zusätzliche Ecosystem Parts

        Carrierboards

        Cooling Solutions

        Spezifikation

        Formfactor
        COM-HPC
        CPU
        Intel® Xeon® D-2752TER (12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)
        Intel® Xeon® D-2775TE (16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)
        Intel® Xeon® D-2796NT (20 x 2.0 GHz, 30 MB cache, 120W)
        Intel® Xeon® D-2776NT (16 x 2.1 GHz, 25 MB cache, 117W)
        Intel® Xeon® D-2753NT (12 x 2.0 GHz, 20 MB cache, 87W)
        Intel® Xeon® D-2796TE (20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)
        DRAM
        4x DDR4 DIMM sockets for up to 128GB LRDIMM
        Ethernet
        1/2.5 Gb Ethernet
        8x Ethernet ports supporting versatile configurations:
        100GbE/2x 50GbE/4x 25GbE/2x 25GbE + 4x 10GbE/8x 10GbE
        I/O Interfaces
        32x PCIe Gen4 (2 x16, 4 x8, 8 x4)
        16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
        4 x USB 3.0 / USB 2.0
        2 x serial interface (RX/TX only)
        SPI
        eSPI
        SM-Bus
        RTC
        Mass storage
        2xSATA 6Gb/s
        embedded BIOS Features
        AMI UEFI
        Security
        Trusted Platform Module (TPM 2.0)
        Power Management
        ACPI 6.0
        Operating Systems
        Linux
        Windows®10
        Microsoft® Windows 11
        Windows Server 2022
        Temperature
        Commercial temperature: 0 °C to +60 °C operating, -30 °C to +80 °C non-operating
        Industrial temperature: -40 °C to +80 °C operating, -40 °C to +80 °C non-operating
        Humidity
        93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
        Features
        Staged Watchdog
        Size
        160 x 160 mm

        Dokumente

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        Data Sheet

        Data sheet for conga-sdID
        15.12.2025

        Whitepaper

        The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

        Produktvarianten

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            conga-sdID/D-2796NT (P/N HSD01-0000-96-2)

            COM-HPC® Server Size D module with Intel® Xeon® D-2796NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

            conga-sdID/D-2776NT (P/N HSD01-0000-76-2)

            COM-HPC® Server Size D module with Intel® Xeon® D-2776NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

            conga-sdID/D-2753NT (P/N HSD01-0000-53-2)

            COM-HPC® Server Size D module with Intel® Xeon® D-2753NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

            conga-sdID/D-2796TE (P/N HSD02-0000-96-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-2796TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

            conga-sdID/D-2775TE (P/N HSD02-0000-75-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-2775TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

            conga-sdID/D-2752TER (P/N HSD02-0000-52-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-2752TER SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

            Ecosystem Details

            Carrierboards

            COM-HPC/SERVER EVAL-CARRIER (P/N HST01-0001-10-0)

            Evaluation Carrier with 10-mm stack-up connector

            Cooling Solutions

            COMh-sdID (E2) HSP THREADED (P/N HSD01-0000-99-0)

            COMh-sdID (E2) heatspreader theaded

            COMh-sdID (E2) HSP THROUGH HOLE (P/N HSD01-0000-99-1)

            COMh-sdID (E2) heatspreader through hole

            COMh SIZE D ACTIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-0)

            COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

            COMh SIZE D PASSIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-1)

            COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

            COOLING COMh-sdID (E2): ADAPTER (P/N HSD01-0000-99-A)

            Cooling Solution for COMh-sdID (E2), adapter for a standard LGA115x cooling solution.
            To be used with HSD01-0000-99-B & HSD01-0000-99-C

            COOLING COMh-sdID (E2): BACKPLATE (P/N HSD01-0000-99-B)

            Cooling Solution for COMh-sdID (E2), backplate
            To be used with HSD01-0000-99-A & HSD01-0000-99-C

            COOLING COMh-sdID (E2): COOLER (P/N HSD01-0000-99-C)

            Cooling Solution for COMh-sdID (E2), LGA115x cooler
            To be used with HSD01-0000-99-A & HSD01-0000-99-B

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