conga-sdID Preview image
  • conga-sdID Image 1
  • conga-sdID Image 2

Your item has been added to the inquiry

conga-sdID Image

conga-sdID

COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 プロセッサー・ファミリー

Selected module variant

    Selected ecosystem parts

    Carrierboards

      Cooling Solutions

        Value adding ecosystem offerings


        Carrierboards

        Cooling Solutions

        見積りを依頼 + Add more articles

        conga-sdID

        旧JUMPtec型番：COMh-sdID
        インテル® Xeon® D-2700 / D-2800 プロセッサー シリーズ搭載 COM-HPC® Server
         

        COMについて学ぶ  - 解説書をダウンロード

        • インテル Xeon D-2700 / D-2800 サーバープラットフォーム
        • 最大20コア、プロセッサーTDP最大125W
        • 32x PCIe Gen 4.0レーン + 16x PCIe Gen 3.0レーン
        • 最大512GB DDR4-DIMM（DIMMソケット x4）
        • オプションのオンボードストレージ NVMe
        • 産業用温度範囲バージョン

        Specification

        Formfactor
        COM-HPC
        CPU
        Intel® Xeon® D-2752TER (12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)
        Intel® Xeon® D-2775TE (16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)
        Intel® Xeon® D-2796NT (20 x 2.0 GHz, 30 MB cache, 120W)
        Intel® Xeon® D-2776NT (16 x 2.1 GHz, 25 MB cache, 117W)
        Intel® Xeon® D-2753NT (12 x 2.0 GHz, 20 MB cache, 87W)
        Intel® Xeon® D-2796TE (20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)
        DRAM
        4x DDR4 DIMM sockets for up to 128GB LRDIMM
        Ethernet
        1/2.5 Gb Ethernet
        8x Ethernet ports supporting versatile configurations:
        100GbE/2x 50GbE/4x 25GbE/2x 25GbE + 4x 10GbE/8x 10GbE
        I/O Interfaces
        32x PCIe Gen4 (2 x16, 4 x8, 8 x4)
        16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
        4 x USB 3.0 / USB 2.0
        2 x serial interface (RX/TX only)
        SPI
        eSPI
        SM-Bus
        RTC
        Mass storage
        2xSATA 6Gb/s
        embedded BIOS Features
        AMI UEFI
        Security
        Trusted Platform Module (TPM 2.0)
        Power Management
        ACPI 6.0
        Operating Systems
        Linux
        Windows®10
        Microsoft® Windows 11
        Windows Server 2022
        Temperature
        Commercial temperature: 0 °C to +60 °C operating, -30 °C to +80 °C non-operating
        Industrial temperature: -40 °C to +80 °C operating, -40 °C to +80 °C non-operating
        Humidity
        93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
        Features
        Staged Watchdog
        Size
        160 x 160 mm

        Documents

        All documents found on this page are updated without notification. Always check this page for the latest version.

        Data Sheet

        Data sheet for conga-sdID
        15.12.2025

        Manual

        User's Guide for conga-sdID
        22.01.2026

        Whitepaper

        The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

        Product Variants

        conga-sdID/D-2796NT (P/N HSD01-0000-96-2)

        COM-HPC® Server Size D module with Intel® Xeon® D-2796NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

        conga-sdID/D-2776NT (P/N HSD01-0000-76-2)

        COM-HPC® Server Size D module with Intel® Xeon® D-2776NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

        conga-sdID/D-2753NT (P/N HSD01-0000-53-2)

        COM-HPC® Server Size D module with Intel® Xeon® D-2753NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

        conga-sdID/D-2796TE (P/N HSD02-0000-96-1)

        COM-HPC® Server Size D module with Intel® Xeon® D-2796TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

        conga-sdID/D-2775TE (P/N HSD02-0000-75-1)

        COM-HPC® Server Size D module with Intel® Xeon® D-2775TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

        conga-sdID/D-2752TER (P/N HSD02-0000-52-1)

        COM-HPC® Server Size D module with Intel® Xeon® D-2752TER SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

        Ecosystem Details

        Carrierboards

        COM-HPC/SERVER EVAL-CARRIER (P/N HST01-0001-10-0)

        Evaluation Carrier with 10-mm stack-up connector

        Cooling Solutions

        COMh-sdID (E2) HSP THREADED (P/N HSD01-0000-99-0)

        COMh-sdID (E2) heatspreader theaded

        COMh-sdID (E2) HSP THROUGH HOLE (P/N HSD01-0000-99-1)

        COMh-sdID (E2) heatspreader through hole

        COMh SIZE D ACTIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-0)

        COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

        COMh SIZE D PASSIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-1)

        COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

        COOLING COMh-sdID (E2): ADAPTER (P/N HSD01-0000-99-A)

        Cooling Solution for COMh-sdID (E2), adapter for a standard LGA115x cooling solution.
        To be used with HSD01-0000-99-B & HSD01-0000-99-C

        COOLING COMh-sdID (E2): BACKPLATE (P/N HSD01-0000-99-B)

        Cooling Solution for COMh-sdID (E2), backplate
        To be used with HSD01-0000-99-A & HSD01-0000-99-C

        COOLING COMh-sdID (E2): COOLER (P/N HSD01-0000-99-C)

        Cooling Solution for COMh-sdID (E2), LGA115x cooler
        To be used with HSD01-0000-99-A & HSD01-0000-99-B

        製品比較