Designed for high-performance embedded and edge computing applications, our performance-class modules integrate latest multicore CPUs as well as GPUs for immersive graphics and/or accelerating AI inference workloads. They offer extremely high scalability for applications ranging from powerful PLCs, HMIs and shop-floor systems to immersive digital signage systems and high-performance medical equipment.
COM-HPC Client
Is ideal for next-generation high-end embedded and edge computing applications
Vergleichen
conga-HPC/cRLS
13th Generation Intel® Core™
Intel® performance hybrid architecture
Performance-optimized design
Up to 24 cores
PCIe Gen 5
Vergleichen
conga-HPC/cRLP
13th Generation Intel® Core™
Intel® performance hybrid architecture
Rugged soldered processor
Industrial temperature support
PCIe Gen 5
Vergleichen
conga-HPC/cTLH
11th Generation Intel® Core™
Intel® Xe graphics engine
Rugged soldered processor
Industrial temperature support
PCIe Gen 4
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COM-HPC Mini
Offers extraordinary performance and I/O density for space- and power-restricted applications
Vergleichen
conga-HPC/mRLP
13th Generation Intel® Core™
Intel® Xe graphics engine
Rugged soldered processor
Industrial temperature support
PCIe Gen 4
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COM Express Type 6
Is the most elaborated high-performance ecosystem for the entire range of embedded computing applications
Vergleichen
conga-TC675
13th Generation Intel® Core™
Intel® Performance Hybrid Architecture
Extended temperature range options
Up to 14 cores
PCIe Gen 4
Vergleichen
conga-TS570
11th Generation Intel® Core™
Performance-optimized design
Up to 8 cores
Extended temperature range options
PCIe Gen 4
Vergleichen
conga-TCV2
AMD Embedded Ryzen V2000 processor series
High-performance Vega 7 GPU
Superior cost/performance ratio
Up to 8 cores
Wide TDP range from 10-54 W
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