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conga-sdID (EOL)

COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family

Selected product variant

Selected ecosystem parts

Carrierboards

Cooling Solutions

Value adding ecosystem offerings

Carrierboards

COM-HPC/SERVER EVAL-CARRIER

Cooling Solutions

COMh-sdID (E2) HSP THREADED
COMh-sdID (E2) HSP THROUGH HOLE
COMh SIZE D ACTIVE UNI COOLER (W/O HSP)
COMh SIZE D PASSIVE UNI COOLER (W/O HSP)
COOLING COMh-sdID (E2): ADAPTER
COOLING COMh-sdID (E2): BACKPLATE
COOLING COMh-sdID (E2): COOLER

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conga-sdID (EOL)

formerly JUMPtec COMh-sdID

COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family

Learn all about COMs - download the guide

Intel Xeon D-2700 / D-2800 Server platform
Up to 20 cores, processor TDP up to 125W
32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
Max 512GB DDR4-DIMM with 4x DIMM sockets
Optional onboard storage NVMe
Industrial temperature versions

What is aReady.COM?
Technical Details
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Specification

Formfactor: COM-HPC
CPU: Intel® Xeon® D-2752TER – 12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W

Intel® Xeon® D-2775TE – 16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W

Intel® Xeon® D-2796NT – 20 x 2.0 GHz, 30 MB cache, 120W

Intel® Xeon® D-2776NT – 16 x 2.1 GHz, 25 MB cache, 117W

Intel® Xeon® D-2753NT – 12 x 2.0 GHz, 20 MB cache, 87W

Intel® Xeon® D-2796TE – 20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W
DRAM: 4x DDR4 DIMM sockets for up to 128GB LRDIMM
Ethernet: 1/2.5 Gb Ethernet

8x Ethernet ports supporting versatile configurations:
100GbE/2x 50GbE/4x 25GbE/2x 25GbE + 4x 10GbE/8x 10GbE
I/O Interfaces: 32x PCIe Gen4 (2 x16, 4 x8, 8 x4)

16x PCIe Gen3 (2 x8, 4 x4, 8 x2)

4 x USB 3.0 / USB 2.0

2 x serial interface (RX/TX only)

SPI

eSPI

SM-Bus

RTC
Mass storage: 2xSATA 6Gb/s
embedded BIOS Features: AMI UEFI
Security: Trusted Platform Module (TPM 2.0)
Power Management: ACPI 6.0
Operating Systems: Linux

Windows®10

Microsoft® Windows 11

Windows Server 2022
Temperature: Commercial temperature: 0 °C to +60 °C operating, -30 °C to +80 °C non-operating
Industrial temperature: -40 °C to +80 °C operating, -40 °C to +80 °C non-operating
Humidity: 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
Features: Staged Watchdog
Size: 160 x 160 mm

Documents

All documents found on this page are updated without notification. Always check this page for the latest version.

Data Sheet: Data sheet for conga-sdID 05.11.2026
Manual: User's Guide for conga-sdID 22.01.2026
Whitepaper: The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

Software

Windows 11

Windows 11: README_AIODP_WIN11_ADL_RPL_v1.2.0.0 11.06.2026 / 2.87 KB
README Windows 11 – 64bit Driver Package for COMe-mRP10, COMe-cAP6, COMe-cRP6, COMe-bRP6, COMh-m7RP, COMh-caAP, COMh-caRP, COMh-ccAS

Product Variants

conga-sdID/D-2796NT (P/N 810452 / HSD01-0000-96-2)

COM-HPC® Server Size D module with Intel® Xeon® D-2796NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

conga-sdID/D-2776NT (P/N 810453 / HSD01-0000-76-2)

COM-HPC® Server Size D module with Intel® Xeon® D-2776NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

conga-sdID/D-2753NT (P/N 810454 / HSD01-0000-53-2)

COM-HPC® Server Size D module with Intel® Xeon® D-2753NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

conga-sdID/D-2796TE (P/N 810449 / HSD02-0000-96-1)

COM-HPC® Server Size D module with Intel® Xeon® D-2796TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

conga-sdID/D-2775TE (P/N 810450 / HSD02-0000-75-1)

COM-HPC® Server Size D module with Intel® Xeon® D-2775TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

conga-sdID/D-2752TER (P/N 810451 / HSD02-0000-52-1)

COM-HPC® Server Size D module with Intel® Xeon® D-2752TER SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

Ecosystem Details

Carrierboards

COM-HPC/SERVER EVAL-CARRIER (P/N 810769 / HST01-0001-10-0)

Evaluation Carrier with 10-mm stack-up connector

Cooling Solutions

COMh-sdID (E2) HSP THREADED (P/N 810513 / HSD01-0000-99-0)

COMh-sdID (E2) heatspreader theaded

COMh-sdID (E2) HSP THROUGH HOLE (P/N 810512 / HSD01-0000-99-1)

COMh-sdID (E2) heatspreader through hole

COMh SIZE D ACTIVE UNI COOLER (W/O HSP) (P/N 810505 / HSD99-0000-99-0)

COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

COMh SIZE D PASSIVE UNI COOLER (W/O HSP) (P/N 810504 / HSD99-0000-99-1)

COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

COOLING COMh-sdID (E2): ADAPTER (P/N 810511 / HSD01-0000-99-A)

Cooling Solution for COMh-sdID (E2), adapter for a standard LGA115x cooling solution.
To be used with HSD01-0000-99-B & HSD01-0000-99-C

COOLING COMh-sdID (E2): BACKPLATE (P/N 810510 / HSD01-0000-99-B)

Cooling Solution for COMh-sdID (E2), backplate
To be used with HSD01-0000-99-A & HSD01-0000-99-C

COOLING COMh-sdID (E2): COOLER (P/N HSD01-0000-99-C)

Cooling Solution for COMh-sdID (E2), LGA115x cooler
To be used with HSD01-0000-99-A & HSD01-0000-99-B