conga-sdID/D-2796NT (P/N HSD01-0000-96-2)
COM-HPC® Server Size D module with Intel® Xeon® D-2796NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.
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conga-sdID
COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family
Selected module variant
Selected ecosystem parts
Carrierboards
Cooling Solutions
Value adding ecosystem offerings
Carrierboards
Cooling Solutions
conga-sdID
formerly JUMPtec COMh-sdID
COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family
Learn all about COMs - download the guide
- Intel Xeon D-2700 / D-2800 Server platform
- Up to 20 cores, processor TDP up to 125W
- 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
- Max 512GB DDR4-DIMM with 4x DIMM sockets
- Optional onboard storage NVMe
- Industrial temperature versions
Specification
Formfactor
COM-HPC
CPU
Intel® Xeon® D-2752TER
(12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)
Intel® Xeon® D-2775TE
(16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)
Intel® Xeon® D-2796NT
(20 x 2.0 GHz, 30 MB cache, 120W)
Intel® Xeon® D-2776NT
(16 x 2.1 GHz, 25 MB cache, 117W)
Intel® Xeon® D-2753NT
(12 x 2.0 GHz, 20 MB cache, 87W)
Intel® Xeon® D-2796TE
(20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)
DRAM
4x DDR4 DIMM sockets for up to 128GB LRDIMM
Ethernet
1/2.5 Gb Ethernet
8x Ethernet ports supporting versatile configurations:
100GbE/2x 50GbE/4x 25GbE/2x 25GbE + 4x 10GbE/8x 10GbE
100GbE/2x 50GbE/4x 25GbE/2x 25GbE + 4x 10GbE/8x 10GbE
I/O Interfaces
32x PCIe Gen4 (2 x16, 4 x8, 8 x4)
16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
4 x USB 3.0 / USB 2.0
2 x serial interface (RX/TX only)
SPI
eSPI
SM-Bus
RTC
Mass storage
2xSATA 6Gb/s
embedded BIOS Features
AMI UEFI
Security
Trusted Platform Module (TPM 2.0)
Power Management
ACPI 6.0
Temperature
Commercial temperature: 0 °C to +60 °C operating, -30 °C to +80 °C non-operating
Industrial temperature: -40 °C to +80 °C operating, -40 °C to +80 °C non-operating
Industrial temperature: -40 °C to +80 °C operating, -40 °C to +80 °C non-operating
Humidity
93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
Features
Staged Watchdog
Size
160 x 160 mm
Documents
All documents found on this page are updated without notification. Always check this page for
the latest
version.
Data Sheet
15.12.2025
Manual
22.01.2026
Whitepaper
The Computer-on-Modules Compendium
Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.
Product Variants
conga-sdID/D-2776NT (P/N HSD01-0000-76-2)
COM-HPC® Server Size D module with Intel® Xeon® D-2776NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.
conga-sdID/D-2753NT (P/N HSD01-0000-53-2)
COM-HPC® Server Size D module with Intel® Xeon® D-2753NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.
conga-sdID/D-2796TE (P/N HSD02-0000-96-1)
COM-HPC® Server Size D module with Intel® Xeon® D-2796TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.
conga-sdID/D-2775TE (P/N HSD02-0000-75-1)
COM-HPC® Server Size D module with Intel® Xeon® D-2775TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.
conga-sdID/D-2752TER (P/N HSD02-0000-52-1)
COM-HPC® Server Size D module with Intel® Xeon® D-2752TER SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.
Ecosystem Details
Carrierboards
COM-HPC/SERVER EVAL-CARRIER (P/N HST01-0001-10-0)
Evaluation Carrier with 10-mm stack-up connector
Cooling Solutions
COMh-sdID (E2) HSP THREADED (P/N HSD01-0000-99-0)
COMh-sdID (E2) heatspreader theaded
COMh-sdID (E2) HSP THROUGH HOLE (P/N HSD01-0000-99-1)
COMh-sdID (E2) heatspreader through hole
COMh SIZE D ACTIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-0)
COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)
COMh SIZE D PASSIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-1)
COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)
COOLING COMh-sdID (E2): ADAPTER (P/N HSD01-0000-99-A)
Cooling Solution for COMh-sdID (E2), adapter for a standard LGA115x cooling solution.
To be used with HSD01-0000-99-B & HSD01-0000-99-C
COOLING COMh-sdID (E2): BACKPLATE (P/N HSD01-0000-99-B)
Cooling Solution for COMh-sdID (E2), backplate
To be used with HSD01-0000-99-A & HSD01-0000-99-C
COOLING COMh-sdID (E2): COOLER (P/N HSD01-0000-99-C)
Cooling Solution for COMh-sdID (E2), LGA115x cooler
To be used with HSD01-0000-99-A & HSD01-0000-99-B
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