conga-aCOM/cRLP

  • Based on conga-HPC/cRLP-i5-1340PE
  • High-Performance configuration with 2 pre-configured virtual machines

conga-aCOM/mRLP

  • Based on conga-HPC/mRLP-i5-1345URE
  • High-Performance configuration with 2 pre-configured virtual machines

conga-B7E3

  • AMD EPYC™ Embedded 3000 Series
  • Up to 16 cores
  • Up to 96 GB RAM
  • Extended temperature options
  • 4x 10 GbE with KR interface support

conga-B7XI

  • Intel® Xeon® D1700 processors
  • Up to 10 cores
  • Up to 128 GB RAM
  • Extended temperature options
  • Up to 4x 10 GbE supporting CEI/KR/SFI

conga-bCL6

  • Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
  • Up to 128 GByte DDR4 non-ECC/ECC memory
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-bID7

  • Intel® Xeon® D-1700 / D-1800 processor family
  • Quad 10 GbE interfaces
  • High-speed connectivity
  • Up to 1 TByte NVMe SSD onboard
  • Industrial grade versions

conga-bRP6

  • 13th Generation Intel® Core™ Processors
  • Up to 64 GByte DDR5 memory
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-bTL6

  • 11th Generation Intel® Core™ / Xeon® Processors
  • Up to 128 GByte DDR4 memory
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-cAL6

  • Intel Atom® E3900
  • Low-power - performance/watt optimized form factor solution
  • Up to 8 GByte DDR3L 1600/1866 Memory (2x SODIMM socket)
  • 4x USB 3.0/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
  • Industrial grade temperature

conga-cAS6

  • Intel Atom® x7000E / x7000RE
  • Up to 16 GByte DDR5-4800 memory with in-band ECC
  • Up to 2.5 Gb Ethernet with TSN support
  • Up to four independent display interfaces
  • Industrial grade versions

conga-cEL6

  • Intel Atom® x6000E, Pentium® and Celeron® Series
  • Low-power – performance/watt
  • Up to 32 GByte DDR4-3200 memory
  • Triple display support
  • Up to 2.5 Gb Ethernet with TSN support

conga-cRP6

  • 13th Generation Intel® Core™ Processors
  • Up to 64 GByte LPDDR5 memory down
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-cTL6

  • 11th Generation Intel® Core™/Celeron® Processors
  • Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-cWL6

  • 8th Generation Intel® Core™ / Celeron® Processors
  • Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
  • Industrial grade versions

conga-Eval Carrier Server

  • Support of overall 65x PCIe lanes via various PCIe card connectors
  • Support of overall 8x 10/25G Ethernet ports:
  • 8x 10/25G Ethernet via integrated re-timer support to SFP28 cages
  • 1x 10/1GBase-T interface
  • 4x USB 3.1/0 Interface
  • 2x SATA standard interfaces

conga-HPC/cBLS

  • 13th Gen Intel® Core™ 2xx series processors (Bartlett Lake-S)
  • Up to 24 CPU cores
  • AI acceleration with Intel® Deep Learning Boost (VNNI)
  • Up to 192 GB DDR5 memory
  • PCI Express Gen 5 and USB 3.2 Gen 2x2

conga-HPC/cPTL

  • Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
  • Up to 16 CPU cores
  • Integrated NPU with up to 50 TOPS
  • Up to 96 GB LPDDR5x memory
  • Up to PCI Express Gen5

conga-HPC/cRLP

  • 13th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 5

conga-HPC/cRLS

  • 13th/14th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Performance-optimized design
  • Up to 24 cores
  • PCIe Gen 5

conga-HPC/cRX1

  • AMD Ryzen™ AI Embedded X100 
  • TDP Range from 45W to 120W
  • NPU with 50 TOPS
  • Up to 128 GB LPDDR5x
  • Industrial Temp. Range

conga-HPC/cTLH

  • 11th Generation Intel® Core™
  • Intel® Xe graphics engine
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4

conga-HPC/cTLU​

  • 11th Generation Intel® Core™
  • Power- and size-optimized design
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4

conga-HPC/mIQ-X

  • Qualcomm® Dragonwing IQ-X processors
  • Up to 12 Oryon™ CPU cores
  • Hexagon™ NPU with 45 TOPS
  • Up to 64 GB LPDDR5x
  • Industrial Temp. Range

conga-HPC/mPTL

  • Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
  • Up to 16 CPU cores
  • Integrated NPU with up to 50 TOPS
  • Up to 96 GB LPDDR5x
  • Industrial temperature range

conga-HPC/mRLP

  • 13th Generation Intel® Core™
  • Intel® Xe graphics engine
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4

conga-HPC/sILH

  • Intel® Xeon® D2700 processors
  • Up to 20 cores
  • Up to 1 TB RAM
  • Ext. temp. options
  • 100 Gb max. Ethernet bandwidth

conga-HPC/sILL

  • Intel® Xeon® D1700 processors
  • Up to 10 cores
  • Up to 256 GB RAM
  • Ext. temp. options
  • 100 Gb max. Ethernet bandwidth

conga-MA5

  • 5th Generation Intel® Pentium®, Celeron® and Atom® processors
  • Rugged design with soldered processor and memory
  • Quadcore technology
  • Up to 4k display support
  • Extended temperature support

conga-MA7

  • Intel Atom®, Intel® Pentium® and Celeron®
  • Rugged design with soldered processor and memory
  • Real-time capable with TCC and TSN
  • Inband ECC memory support
  • Extended temperature support

conga-mAL10/m4AL10

  • Intel® Atom® E3900, Pentium® and Celeron® Processor Series
  • Low-power, watt-optimized small form factor solution
  • Two variants: DDR3L + ECC or LPDDR4
  • Strong graphics and real-time performance
  • Compact, energy-efficient, long-term available

conga-mAS10

  • Intel Atom® x7000E / x7000RE Series
  • Low-Power – Performance/Watt optimized
  • Up to 16 GByte LPDDR5 memory down (In-Band ECC)
  • 1 GbE (optional 2.5 GbE) with TSN support
  • Industrial grade temperature

conga-MC1000

  • Intel® performance hybrid architecture with up to 16 cores
  • Intel® Arc™ Graphics with up to 12 Xᵉ cores
  • Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
  • Up to 32GB LPDDR5x soldered down memory for maximum memory bandwidth

conga-mEL10

  • Intel Atom® x6000E
  • Low-Power – Performance/Watt optimized form factor solution
  • Up to 16 GByte LPDDR4 memory down (In-Band ECC)
  • 1GbE (optional 2.5GbE) with TSN support
  • Industrial grade temperature

conga-mRP10

  • 13th Generation Intel® Core™/Pentium® Processors
  • Up to 32 GByte LPDDR5(x) memory down
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-PA7

Pico-ITX SBC based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series

conga-QA5

  • Intel Atom® x7 Intel® Pentium® or Celeron® J
  • 6 variants for broad scalability
  • GbE with TSN and TCC support
  • Up to 8 GB LPDDR4
  • Industrial temperature support

conga-QA7

  • Intel Atom® x6000E, Intel® Pentium® or Celeron® J
  • 8 variants for broad scalability
  • GbE with TSN and TCC support
  • Up to 16 GB LPDDR4x
  • Industrial temperature support

conga-QMX6

  • NXP i.MX6 application processor
  • Up to quadcore Arm® Cortex®-A9
  • 1x Arm Cortex®-M4F for real-time processing
  • GC NanoUltra 3D graphics
  • Industrial temperature support

conga-QMX8-Plus

  • NXP i.MX 8M Plus processor
  • Integrated Neural Processing Unit (NPU)
  • Quadcore Arm® Cortex®-A53 / M7
  • Up to 3 independent display outputs
  • Industrial temperature support

conga-SA5

  • Intel Atom® x7 Intel® Pentium® or Celeron® J
  • 6 variants for broad scalability
  • GbE with TSN and TCC support
  • Up to 8 GB LPDDR4
  • Industrial temperature support

conga-SA7

  • Intel Atom® x6000E, Intel® Pentium® or Celeron® J
  • 8 variants for broad scalability
  • GbE with TSN and TCC support
  • Up to 16 GB LPDDR4x
  • Industrial temperature support

conga-SA8

  • Intel Atom x7000RE Series
  • Up to 8 Cores
  • Up to 16 GByte soldered LPDDR5
  • Industrial temperature support
  • Virtualization ready with Hypervisor

conga-sdIL

  • Intel® Xeon® D-1700 / D-1800 processors
  • Up to 10 cores
  • Up to 64GB soldered RAM | ECC support
  • Ext. temp. options
  • 100 Gb max. Ethernet bandwidth

conga-SMX8-Mini

  • NXP i.MX 8M Mini application processor
  • Up to quadcore Arm® Cortex®-A35
  • 1x Arm® Cortex®-M4F for real-time processing
  • GC NanoUltra 3D graphics
  • Industrial temperature support

conga-SMX8-Plus

  • NXP i.MX 8M Plus application processor
  • Integrated Neural Processing Unit (NPU)
  • Quadcore Arm® Cortex®-A53 / M7
  • Up to 3 independent display outputs
  • Industrial temperature support

conga-SMX8-Plus embedded AI Vision Kit

congatec i.MX 8M Plus Vision Kit for AI and Machine Learning applications

conga-SMX8X

  • NXP MX8-X application processor
  • Ultra-low power design (2-5 W)
  • Up to quadcore Arm® Cortex®-A35
  • 1x Arm® Cortex®-M4F for real-time processing
  • Industrial temperature support

conga-SMX95

  • NXP i.MX 95 processor series
  • Up to 6-core ARM Cortex-A55
  • NXP eIQ® Neutron NPU
  • Advanced Security
  • Industrial temperature support

conga-STDA4

  • TI processor TDA4VM
  • Dual Arm® Cortex®-A72
  • Deep learning hardware accelerator
  • Arm® Cortex®-R5F MCUs for real-time communication
  • Industrial temperature support

conga-sXAL4

  • Latest Generation Intel Atom®, Pentium® and Celeron®
  • Processor Series
  • Up to 8 GByte LPDDR4 memory down
  • Triple display support

conga-sXAS

  • Intel Atom® x7000E, x7000RE Series
  • Up to 16 GByte LPDDR5 memory down with inband ECC support
  • Dual LVDS, HDMI, DP++
  • 1x USB 3.2, 6x USB 2.0, eMMC onboard
  • Industrial grade temperature

conga-sXEL

  • Intel® Atom®, Pentium® and Celeron® processor series
  • Up to 16 GByte LPDDR4 memory down with inband ECC support
  • 2x USB 3.0, 4x USB 2.0, 1x SATA, eMMC onboard
  • TSN support
  • Industrial grade temperature

conga-TC1000

  • Intel® Core™ Ultra processors (Series 3)
  • Up to 16 cores and 22 threads
  • Intel® Arc™ Graphics Xᵉ3 up to 192 EU
  • Integrated NPU with 50 TOPS, 180 TOPS total platform performance
  • Up to 128 GB DDR5 SODIMM

conga-TC1000r

  • Intel® Core™ Ultra processors (Series 3)
  • Up to 16 cores and 22 threads
  • Intel® Arc™ Graphics Xᵉ3 up to 192 EU
  • Integrated NPU with 50 TOPS, 180 TOPS total platform performance
  • LPDDR5x memory with up to 96 GB RAM system capacity

conga-TC300

  • Intel® Core™ Series 3 processors
  • Up to 6 CPU cores
  • Optional integrated NPU with up to 18 TOPS
  • Up to 64 GB DDR5 memory

conga-TC370

  • 8th Generation Intel® Core™ SOC processor
  • Up to 4 cores at low-power TDP of 15W
  • New Intel® Gen 9 HD Graphics
  • Optional eMMC 5.1 on board mass storage
  • COM Express Compact Type 6 module 95x95 mm²

conga-TC570

  • 11th Generation Intel® Core™
  • Compact design
  • Up to 4 cores
  • Extended temperature range options
  • PCIe Gen 4

conga-TC570r

  • 11th Generation Intel® Core™
  • Extremely rugged with soldered memory
  • Extended temperature range options
  • IEC-60068 certified
  • PCIe Gen 4

conga-TC675

  • 13th Generation Intel® Core™
  • Intel® Performance Hybrid Architecture
  • Extended temperature range options
  • Up to 14 cores
  • PCIe Gen 4

conga-TC675r

  • 13th Generation Intel® Core™
  • Soldered memory
  • Extended temperature range options
  • Up to 14 cores
  • PCIe Gen 4

conga-TC700

  • Intel® Core™ Ultra processors
  • Up to 16 cores
  • Up to 96 GB DDR5 with in-band ECC
  • Built-in Intel® Arc™ GPU
  • Integrated Intel® AI Boost NPU

conga-TC750

  • Intel® Core™ Ultra processors
  • Intel® Arc™ Graphics with up to 128 EUs
  • Up to 99 TOPS Edge AI performance
  • Up to 128 GB RAM with in-band ECC
  • Up to 16 cores / 22 threads
  • PCIe Gen 4 & USB 4

conga-TCA5

  • Intel Atom® x7-E, Intel® Pentium® and Celeron®
  • Size-optimized design
  • Low power consumption (12 W)
  • Up to 4 cores
  • Extended temperature range options

conga-TCA7

  • Intel Atom® x6000E, Intel® Pentium® and Celeron®
  • Cost- and power-optimized design
  • Up to 4 cores
  • Extended temperature range options
  • Supports TSN and TCC

conga-TCR8

  • AMD Ryzen Embedded 8000
  • Up to 8 Zen 4 cores
  • AMD Radeon™ RDNA™ 3 Graphics
  • AMD XDNA™ NPU
  • Up to 96 GB RAM (optional with ECC)
  • TDP Range from 15W to 54W
  • Onboard NVMe™ SSD (option)

conga-TCRP1

  • AMD Zen5/5c CPU Cores
  • AMD Radeon™ RDNA™ 3.5 Graphics
  • AMD XDNA™ 2 NPU
  • TDP Range from 15W to 54W
  • Onboard NVMe™ SSD (option)

conga-TCV2

  • AMD Embedded Ryzen V2000 processor series
  • High-performance Zen 2 CPU & VEGA GPU
  • Superior cost/performance ratio
  • Up to 8 cores
  • Wide TDP range from 10-54 W

conga-TR4

  • AMD Embedded Ryzen V1000 processor series
  • High-performance Vega GPU
  • Supports up to 4x 4k
  • Up to 4 cores
  • Wide TDP range down to 12 W

conga-TS370

  • 8th Generation Intel® Core™ and Xeon®
  • Performance-optimized design
  • Up to 6 cores
  • Supports USB 3.1 Gen 2 (10 Gbit/s)
  • Up to 64 GB ECC memory

conga-TS570

  • 11th Generation Intel® Core™
  • Performance-optimized design
  • Up to 8 cores
  • Extended temperature range options
  • PCIe Gen 4

conga-zones

aReady.COM is congatec’s pre-validated and pre-configured platform that combines modular hardware and software building blocks to accelerate embedded development. It includes Computer-on-Modules, virtualization by Hypervisor, and pre-installed, licensed OS like ctrlX OS or Ubuntu Pro. Whether for edge computing or IIoT, aReady.COM simplifies integration, enhances security, and shortens time to market.


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