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conga-SMX8X

SMARC 2.0 module based on Ultra Low Power NXP i.MX8-X series

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          conga-SMX8X

          SMARC 2.0 module based on Ultra Low Power NXP i.MX8-X series

          Learn all about COMs - download the guide

          • NXP i.MX8-X ARM Cortex-A35 and Cortex-M4F
          • Ultra Low Power 2-5W
          • Industrial grade, improved Reliability and Virtualization
          • 3D Graphics up to two independent HD displays
          • MIPI CSI-2 camera interface
          Congatec Logo
          Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

          Value adding ecosystem offerings

          Cooling Solutions

          Carrierboards

          Module services

          Specification

          Formfactor
          SMARC
          CPU
          NXP i.MX8 QuadXPlus – 4, ARM Cortex-A35, 1x ARM Cortex-M4F, 4W
          DRAM
          Up to 4 GByte onboard LPDDR4 memory | 2400 MT/s
          Ethernet
          2 x Gigabit Ethernet
          I/O Interfaces
          5 x USB 2.0 (shared with 1x USB OTG client)
          GPIOs
          2 x FlexCAN
          up to 4x UART (2x with Handshake (1x shared with FlexCAN)
          USB 2.0
          1 x eSPI
          1 x SPI
          I²C bus
          1 x PCI Express™ 3.0 lanes
          1 x SDIO 3.0
          1 x USB 3.0
          optional M.2 1216 WiFi module (soldered down)
          Graphics
          Integrated in NXP i.MX8-X Series single GT7000Lite multimedia GPU
          VPU up to 4K h.265 dec / 1080p h.264 enc/dec) | 3D Graphics with up to 4 high performance vec4 shaders and 16 execution units up to 2 independent displays | OpenGL ES 3.1 | Vulcan VX extensions | OpenCL 1.2 EP | OpenVG 1.1i
          Security
          High Assurance Boot support | Inline Encryption Engine (AES-128) TNG, AES-128, AES-256, 3DES, ARC4, RSA4096, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096
          Operating Systems
          Android
          Linux
          Yocto
          Video Interfaces
          1 x dual channel or 2x single channel LVDS 24 bit | 2x MIPI-DSI with 4-lanes shared with LVDS | 1x MIPI-CSI 4-lanes
          Size
          82 x 50 mm (3,23” x 1,97”)

          Documents

          All documents found on this page are updated without notification. Always check this page for the latest version.

          Data Sheet
          Data Sheet for conga-SMX8X 11.11.2026
          Manual
          User's Guide for conga-SMX8X 03.02.2025
          conga-SMX8X software Documentation
          Whitepaper
          The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

          Software

          Android
          Link
          In order to fetch and build the Android-BSP for conga-SMX8-X, please follow:
          https://wiki.congatec.com/wiki/Android_11_conga-SMX8-X
          yocto
          Link
          In order to fetch and build the Yocto for conga-SMX8-X, please follow:
          https://wiki.congatec.com/wiki/Yocto_4.0_conga-SMX8-X

          Product Variants

          partnumber(s) found

          conga-SMX8-X/i-QXP-4G eMMC16 (P/N 051110)

          SMARC 2.0 module ultra low power NXP i.MX8 QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range.

          conga-SMX8-X/i-QXP-2G eMMC16 (P/N 051113)

          SMARC 2.0 module with ultra low-power NXP i.MX8-X QuadXPlus processor with 4x ARM Cortex-A35 and 1x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range.

          Ecosystem Details

          Cooling Solutions

          conga-SMX8-X/i-CSP-B (P/N 051150)

          Passive cooling solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

          conga-SMX8-X/i-HSP-B (P/N 051151)

          Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.

          Carrierboards

          conga-SEVAL (P/N 007010)

          Evaluation Carrier Board for SMARC 2.0 modules.

          conga-SMC1/SMARC-ARM (P/N 020750)

          Compact sized SMARC 2.0 Carrier Board for ARM based SMARC Modules

          Module services

          Design-In Training (P/N 27000001)

          Design-Training to develop carrier boards for Computer on Modules

          Conformal Coating Qseven, SMARC, Type 10 (P/N )

          HumiSeal® 1A33 coating for Qseven, SMARC and Type 10 modules; MIL-I-46058C qualified, IPC-CC-830 and RoHS
          Directive 2002/95/EC compliant and recognized under UL File Number E105698.

          Ext. temperature screening (-40°C to +85°C) (P/N )

          congatec Wide Temperature Range Screening
          Standard screening profile with 12h temperature screening and cold soak test
          Including functional test and several boot-ups (before & after screening)

          Ext. temperature screening (-25°C to +80°C) (P/N )

          congatec Wide Temperature Range Screening
          Standard screening profile with 12h temperature screening and cold soak test
          Including functional test and several boot-ups (before & after screening)

          Accessories

          More about conga-SEVAL

          conga-SEVAL

          Evaluation Carrier Board compatible with SMARC modules

          Details
          More about conga-SMC1/SMARC-ARM

          conga-SMC1/SMARC-ARM

          Compact sized Carrier Board for ARM based SMARC 2.0 modules

          Details

          What is aReady.COM?

          aReady.COM is congatec’s pre-validated and pre-configured platform that combines modular hardware and software building blocks to accelerate embedded development. It includes Computer-on-Modules, virtualization by Hypervisor, and pre-installed, licensed OS like ctrlX OS or Ubuntu Pro. Whether for edge computing or IIoT, aReady.COM simplifies integration, enhances security, and shortens time to market.


          Learn more