Embedded in industrial automation
Evolve your automation applications
Embedded in your success
[ Computer-on-Modules | Single-Board-Computers | Customized Boards ]
High-performance embedded ecosystems for industrial automation
We deliver a leading Computer-on-Module ecosystem for your individual requirements
Artificial intelligence (AI), industrial IoT (IIoT), 5G, and advanced sensing with exponentially growing data rates are accelerators for productivity and massive disruptors for industrial automation applications. This makes robust, scalable edge computing crucial in the move towards the fully automated "lights out” factory. Application-ready hardware and software building blocks based on Computer-on-Modules (COMs) provide a modular and highly agile design path, enabling the rapid development of future-oriented, reliable and productive automation solutions.
With our high-performance ecosystem for industrial automation systems, you can:
Accelerate time to market
Concentrate on your core competencies and leave the embedded computing technology to congatec’s Computer-on-Module ecosystem. Our modules are application-ready and have all the complex components like CPU, GPU, memory, Ethernet, and other PC functions pre-integrated. Customization to specific needs is done via an easy-to-design carrier board. Additional design-in, pre-qualification, and software services from congatec boost performance and speed up your time to market even further.
Make your applications smarter
Integrate powerful AI capabilities into your applications. Modular designs provide scalability and flexibility to implement exactly the AI inference you need. This can be achieved by deploying powerful COM-HPC and COM Express modules with massive core counts and integrated AI engines. In addition, dedicated AI accelerators such as GPGPUs or FPGAs can be easily integrated on the carrier board. For applications with strictly limited power budgets, Arm-based SMARC modules with neural processing units (NPUs) are an ideal fit.
Improve reliability & maintenance cost
Our energy-efficient Computer-on-Modules are specifically developed for harsh environmental conditions. They offer support for industrial temperatures between -40°C to +85°C and come with high resistance against shock and vibrations. Together with powerful passive cooling solutions, they enable fully-sealed systems with high IP ratings. Consequently, automation systems can operate in the most demanding industries, including mining, oil & gas, food & beverage, and even in hazardous areas and Ex zones.
Improve business outcomes
Make more informed decisions and optimize operations with enhanced machine monitoring. Our dedicated Board Management Controller (BMC) collects comprehensive operating data, which can efficiently be transferred to your IT teams through aReady.IOT. Use the data to shorten response times, automate processes, and generate new business models and revenue streams, such as predictive maintenance or device-as-a-service.
Be Agile and ready for the future
Implement reliable upgrade paths to ensure your applications are always up to date. With a simple module exchange, you can implement more performance, improve power efficiency and boost computing capabilities as new demands arise, while the system itself remains unaltered - even for systems that have been in use for several years. This helps to extend the lifespan of your hardware and your applications, thereby increasing sustainability and ROI.
Orchestrate entire factories in real-time
Leverage real-time communication in your Industry 4.0 and IIoT applications. Our Computer-on-Module ecosystem is optimized not only for real-time processing but also for low latency communication. With native support of time synchronized networking (TSN) and time coordinated computing (TCC), you can synchronize machine controls, robot arms and conveying technologies in precisely orchestrated production lines - not just within a manufacturing cell but across the entire factory floor.
Integrate embedded vision
Improve the versatility, quality, and productivity of your machine vision solutions. Our Computer-on-Module ecosystems feature extensive camera connectivity for industrial MIPI-CSI cameras and the GigE Vision standard. Integrated AI accelerators and hardware-accelerated encoding/decoding capabilities enable the transport and processing of multiple video streams in parallel. To remain at the forefront in the design of embedded vision applications, we partner with leading vision companies like camera vendor Basler.
Reduce design risks and NRE
Standardized Computer-on-Modules lower design risks because the complex core components come as fully-developed and application-ready super-components. This enables the design of complete product families using the same carrier design equipped with scalable modules to meet individual performance requirements. Because designs can be efficiently re-used in new applications, non-recurring engineering costs are reduced. Design-in guides and training from congatec provide additional support.
Optimize Total Cost of Ownership sustainably
Reduce costs and enhance reliability with robust technology and system consolidation. Utilizing real-time hypervisor technology from congatec, workloads that previously ran on multiple dedicated systems can be integrated onto a single system. This results in immediate cost savings from less hardware and cabling. System consolidation also increases the mean time between failures (MTBF), decreases maintenance and downtime, and leads to a sustainable reduction in total cost of ownership.
Which ecosystem to choose
COM-HPC Client | COM Express | SMARC Module | |
| Inspection Systems | +++ | +++ | ++ |
| Next-Generation PLC | +++ | +++ | + |
| Industrial Control Systems | +++ | ++ | + |
| Industrial PC/Embedded Systems | ++ | +++ | ++ |
| HMI/Panel PCs | + | +++ | +++ |
| Edge AI Systems | +++ | ++ | ++ |
| Machine Vision Systems | +++ | ++ | ++ |
Legend: +++ optimal solution; ++ very good solution; + good solution; O recommended, if cost and/or performance fit
congatec's high-performance ecosystem
| Facts | Features | Benefits |
| Comprehensive Computer-on-Module portfolio | x86 and Arm-based Computer-on-Modules, tailored cooling solutions, accompanying services for design qualification, and individual BIOS and bootloader adaptation | Designers get everything they need for highly agile development of dedicated solutions. They can fully concentrate on their core competencies to deliver highest performance to their customers. |
| Open standards | Support of the high-performance PICMG standards COM-HPC and COM Express as well as the low-power SGeT standard SMARC Module | Broad support from a huge community and multiple vendors increases design security and long-term availability through second-source strategies. Also increases supply chain resilience. |
| Application-ready super- components | Computer modules come as fully developed super-components, implementing CPU, RAM, and computer I/Os, and featuring software support packages | Computer modules offer industrial designers the best of both worlds: The high design security of ready-made Computer-on-Modules, and the high customizability of carrier boards. The modular approach enables high scalability and easy upgradability with a simple module change. |
| Most comprehensive COM-HPC offering | congatec offers the most comprehensive COM-HPC ecosystem | Designers get everything they need in the form they need from one reliable vendor. Suitable and highly scalable modules, tailored and most efficient cooling solutions, corresponding evaluation and application carriers, board support packages, as well as design-in services from definition phase to validation phase. |
| Embedded vision capabilities | Some of our Computer-on-Modules offer MIPI-CSI support directly off the module, and come with integrated AI and vision accelerators | Developers can build their applications on already developed camera interface technology, which improves time to market and design reliability. Integrated powerful encoding / decoding as well as AI capabilities enable highly efficient vision applications with an exceptional performance-per-watt ratio. |
Recommended Products
conga-HPC/mRLP
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/cBLS
- 13th/14th Gen Intel® Core™ processors
- Hybrid design with P-cores & E-cores
- Intel® UHD Graphics 770
- PCIe Gen 4/5 & USB 3.2 Gen 2
- AI acceleration with Intel® VNNI
conga-SMX95
- NXP i.MX 95 processor series
- Up to 6-core ARM Cortex-A55
- NXP eIQ® Neutron NPU
- Advanced Security
- Industrial temperature support
conga-SA8
- Intel Atom x7000RE Series
- Up to 8 Cores
- Up to 16 GByte soldered LPDDR5
- Virtualization ready with Hypervisor
- Industrial temperature support
conga-TC750
- Intel® Arc™ Graphics with up to 128 EUs
- Up to 99 TOPS Edge AI performance
- Up to 128 GB RAM with in-band ECC
- Up to 16 cores / 22 threads
- PCIe Gen 4 & USB 4
conga-STDA4
- TI processor TDA4VM or DRA829J
- Dual Arm® Cortex®-A72
- Deep learning hardware accelerator
- Arm® Cortex®-R5F MCUs for real-time communication
- Industrial temperature support
conga-TCR8
- Up to 8 Zen 4 cores
- AMD Radeon™ RDNA™ 3 Graphics
- AMD XDNA™ NPU
- Up to 96 GB RAM (optional with ECC)
- TDP Range from 15W to 54W
- Onboard NVMe™ SSD (option)
conga-TC675r
- 13th Generation Intel® Core™
- Soldered memory
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
conga-TC700
- Intel® Core™ Ultra processors
- Up to 16 cores
- Up to 96 GB DDR5 with in-band ECC
- Built-in Intel® Arc™ GPU
- Integrated Intel® AI Boost NPU
Learn more
about congatec COMs in industrial automation
Wireless TSN
Wireless Time Sensitive Networking (WTSN) enables deterministic, low-latency communication and real-time synchronization over standard Wi-Fi Ethernet extending real-time communication to autonomous and mobile applications. The first standardized modules are already simplifying the design-in of this upcoming standard.
Introduction to workload consolidation
Leveraging multicore processors and virtualization, you can consolidate multiple tasks onto a single platform, where each task operates securely and independently from each other. This is an effective way to reduce costs and complexity in embedded applications.
Cutting complexity with a single module design
See system consolidation in action! Ono Sokki reduced hardware requirements for its test and measurement solution by going from seven systems down to just one with congatec's Computer-on-Modules and real-time hypervisor.
Webinars & Videos
EXPERT VIDEO
High-performance AI for robotics
Claire Liu demonstrates the powerful AI capabilities of congatec’s COM Express Module in a real-life demo together with Intel. This demonstration highlights efficient edge AI processing using the conga-TC700 COM Express Type 6 module based on Intel Core™ Ultra processors. See demanding AI applications like natural language processing, image segmentation, and object recognition in action.
EXPERT VIDEO
Simplifying Edge IoT with aReady.IOT
Knud Hartung, Solution Manager at congatec, explains our demo featuring a conveyor belt system with real-time monitoring and control, all connected via our aReady.IOT software.
EXPERT VIDEO
Workload consolidation in action
Timo Kühn demonstrates a key capability for modern embedded systems to streamline development of demanding automation applications: workload consolidation.
EXPERT VIDEO
CoMs for AI in a nutshell
Maximilian Gerstl takes you on a quick and intensive tour and gives you a clear overview of congatec’s AI-accelerating modules
- perfect for powering your next automation application.
