COM Express Type 6 Ecosystem
The most elaborated high-performance ecosystem for modular designs
Our COM Express Type 6 ecosystem is the ideal choice for the full range of embedded computing applications. Offering two different form factors, it provides designers with everything they need to build anything from powerful PLCs, HMIs and shop-floor systems, to high-end digital signage systems, and high-performance medical equipment. For applications that require more performance and higher bandwidth than COM Express can offer, developers should also evaluate our high-performance COM-HPC Client ecosystem.
Details about the COM Express Specification
There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
If you don't find the configuration you require contact your
congatec Sales representative for further assistance.
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conga-TC675r
13th Generation Intel® Core™
Soldered memory
Extended temperature range options
Up to 14 cores
PCIe Gen 4
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conga-TC675
13th Generation Intel® Core™
Intel® Performance Hybrid Architecture
Extended temperature range options
Up to 14 cores
PCIe Gen 4
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conga-TS570
11th Generation Intel® Core™
Performance-optimized design
Up to 8 cores
Extended temperature range options
PCIe Gen 4
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conga-TC570r
11th Generation Intel® Core™
Extremely rugged with soldered memory
Extended temperature range options
IEC-60068 certified
PCIe Gen 4
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conga-TCV2
AMD Embedded Ryzen V2000 processor series
High-performance Zen 2 CPU & VEGA GPU
Superior cost/performance ratio
Up to 8 cores
Wide TDP range from 10-54 W
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conga-TCA7
Intel Atom® x6000E, Intel® Pentium® and Celeron®
Cost- and power-optimized design
Up to 4 cores
Extended temperature range options
Supports TSN and TCC
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conga-TC570
11th Generation Intel® Core™
Compact design
Up to 4 cores
Extended temperature range options
PCIe Gen 4
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conga-TC370
8th Generation Intel® Core™ and Celeron®
Size- and power-optimized design
Up to 4 cores
Supports USB 3.1 Gen 2 (10 Gbit/sw)
Up to 64 GB memory
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conga-TS370
8th Generation Intel® Core™ and Xeon®
Performance-optimized design
Up to 6 cores
Supports USB 3.1 Gen 2 (10 Gbit/sw)
Up to 64 GB ECC memory
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conga-TR4
AMD Embedded Ryzen V1000 processor series
High-performance Vega GPU
Supports up to 4x 4k
Up to 4 cores
Wide TDP range down to 12 W
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conga-TS175
7th Generation Intel® Core™ and Xeon®
Performance-optimized design
Up to 4 cores
Up to 32 GB DDR4
ECC support
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conga-TC175
7th Generation Intel® Core™ and Celeron®
Size-optimized design
Low configurable power consumption (cTDP 7.5 W)
Up to 2 cores
Up to 32 GB DDR4 memory
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conga-TCA5
Intel Atom® x7-E, Intel® Pentium® and Celeron®
Size-optimized design
Low power consumption (12 W)
Up to 4 cores
Extended temperature range options
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conga-TS170
6th Generation Intel® Core™ and Xeon®
Performance-optimized design
Up to 4 cores
Up to 32 GB DDR4
ECC support for Intel® Xeon®
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conga-TC170
6th Generation Intel® Core™ and Celeron®
Size-optimized design
Low power consumption (TDP 15 W)
Up to 2 cores
Up to 32 GB DDR4 memory
conga-TEVAL/COMe 3.0
Evaluation carrier board for COM Express Type 6
6x PCIe card slots for 25 lanes
Supports 4x USB 3.1 Type A
Compact size (294x244 mm)
Schematics available on project basis
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