COM Express Type 6 Ecosystem

The most elaborated high-performance ecosystem for modular designs

Our COM Express Type 6 ecosystem is the ideal choice for the full range of embedded computing applications. Offering two different form factors, it provides designers with everything they need to build anything from powerful PLCs, HMIs and shop-floor systems, to high-end digital signage systems, and high-performance medical equipment. For applications that require more performance and higher bandwidth than COM Express can offer, developers should also evaluate our high-performance COM-HPC Client ecosystem.

Details about the COM Express Specification

 

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    More about conga-TC700

    conga-TC700

    Virtualization Ready
    • Intel® Core™ Ultra processors
    • Up to 16 cores
    • Up to 96 GB DDR5 with in-band ECC
    • Built-in Intel® Arc™ GPU
    • Integrated Intel® AI Boost NPU
    More about conga-TC675r

    conga-TC675r

    Virtualization Ready
    • 13th Generation Intel® Core™
    • Soldered memory
    • Extended temperature range options
    • Up to 14 cores
    • PCIe Gen 4
    More about conga-TC675

    conga-TC675

    Virtualization Ready
    • 13th Generation Intel® Core™
    • Intel® Performance Hybrid Architecture
    • Extended temperature range options
    • Up to 14 cores
    • PCIe Gen 4
    More about conga-TS570

    conga-TS570

    Virtualization Ready
    • 11th Generation Intel® Core™
    • Performance-optimized design
    • Up to 8 cores
    • Extended temperature range options
    • PCIe Gen 4
    More about conga-TC570r

    conga-TC570r

    Virtualization Ready
    • 11th Generation Intel® Core™
    • Extremely rugged with soldered memory
    • Extended temperature range options
    • IEC-60068 certified
    • PCIe Gen 4
    More about conga-TCV2

    conga-TCV2

    Virtualization Ready
    • AMD Embedded Ryzen V2000 processor series
    • High-performance Zen 2 CPU & VEGA GPU
    • Superior cost/performance ratio
    • Up to 8 cores
    • Wide TDP range from 10-54 W
    More about conga-TCA7

    conga-TCA7

    Virtualization Ready
    • Intel Atom® x6000E, Intel® Pentium® and Celeron®
    • Cost- and power-optimized design
    • Up to 4 cores
    • Extended temperature range options
    • Supports TSN and TCC
    More about conga-TC570

    conga-TC570

    Virtualization Ready
    • 11th Generation Intel® Core™
    • Compact design
    • Up to 4 cores
    • Extended temperature range options
    • PCIe Gen 4
    More about conga-TC370

    conga-TC370

    • 8th Generation Intel® Core™ and Celeron®
    • Size- and power-optimized design
    • Up to 4 cores
    • Supports USB 3.1 Gen 2 (10 Gbit/sw)
    • Up to 64 GB memory
    More about conga-TS370

    conga-TS370

    • 8th Generation Intel® Core™ and Xeon®
    • Performance-optimized design
    • Up to 6 cores
    • Supports USB 3.1 Gen 2 (10 Gbit/sw)
    • Up to 64 GB ECC memory
    More about conga-TR4

    conga-TR4

    • AMD Embedded Ryzen V1000 processor series
    • High-performance Vega GPU
    • Supports up to 4x 4k
    • Up to 4 cores
    • Wide TDP range down to 12 W
    More about conga-TS175

    conga-TS175

    • 7th Generation Intel® Core™ and Xeon®
    • Performance-optimized design
    • Up to 4 cores
    • Up to 32 GB DDR4
    • ECC support
    More about conga-TC175

    conga-TC175

    • 7th Generation Intel® Core™ and Celeron®
    • Size-optimized design
    • Low configurable power consumption (cTDP 7.5 W)
    • Up to 2 cores
    • Up to 32 GB DDR4 memory
    More about conga-TCA5

    conga-TCA5

    • Intel Atom® x7-E, Intel® Pentium® and Celeron®
    • Size-optimized design
    • Low power consumption (12 W)
    • Up to 4 cores
    • Extended temperature range options
    More about conga-TS170

    conga-TS170

    • 6th Generation Intel® Core™ and Xeon®
    • Performance-optimized design
    • Up to 4 cores
    • Up to 32 GB DDR4
    • ECC support for Intel® Xeon®
    More about conga-TC170

    conga-TC170

    • 6th Generation Intel® Core™ and Celeron®
    • Size-optimized design
    • Low power consumption (TDP 15 W)
    • Up to 2 cores
    • Up to 32 GB DDR4 memory
    More about conga-TEVAL/COMe 3.0

    conga-TEVAL/COMe 3.0

    • Evaluation carrier board for COM Express Type 6
    • 6x PCIe card slots for 25 lanes
    • Supports 4x USB 3.1 Type A
    • Compact size (294x244 mm)
    • Schematics available on project basis