COM Express Technology

COM Express

COM Express® is a widely adopted Computer-on-Module (COM) standard defined by the PICMG® consortium. It specifies standardized form factors and interfaces, providing a flexible and scalable foundation for high-performance embedded and edge computing applications. The current COM Express Revision 3.1 supports modern interfaces such as PCI Express® Gen 4, optional USB4 for Type 6, SATA, and high-resolution display connectivity. With Type 6 for graphics-intensive applications, Type 7 for headless embedded servers, and Type 10 for compact, low-power systems, COM Express addresses a broad range of industrial requirements.

Interfaces

COM Express connects modules and carrier boards through standardized connectors with up to 440 pins. Revision 3.1 supports PCIe Gen 4 and, depending on the pinout, interfaces such as USB4, SATA and digital displays.

Server-on-Module

COM Express Type 7 is designed for headless server and networking applications, supporting up to four 10GbE interfaces and 32 PCIe lanes.

Customization

Standardized COM Express modules combine with application-specific carrier boards, allowing developers to integrate custom I/O and system functions.

Form Factors

Four standardized sizes are defined: Mini (84 × 55 mm), Compact (95 × 95 mm), Basic (125 × 95 mm) and Extended (155 × 110 mm).

GPIO

COM Express provides eight general-purpose input/output signals for application-specific control and system integration.

Thermal Design

Thermal interfaces and cooling solutions are adapted to the module's power requirements and the application's operating conditions.

PCI Express

COM Express Rev. 3.1 supports PCIe Gen 4 with signaling rates up to 16 GT/s per lane. The available lane count depends on the module type.

Video Output

Type 6 supports multiple display interfaces, including digital display outputs and LVDS or eDP options. Type 7 is designed for headless operation without dedicated display outputs.