Il nostro ecosistema COM Express Type 6 è la scelta ideale per l’intera gamma di applicazioni di embedded computing. Offrendo due diversi fattori di forma, mette a disposizione dei progettisti tutto il necessario per realizzare qualsiasi cosa, dai potenti PLC, HMI e sistemi per l’officina, fino a soluzioni di digital signage di fascia alta e apparecchiature medicali ad alte prestazioni.
Per applicazioni che richiedono prestazioni e larghezza di banda superiori a quelle offerte da COM Express, invitiamo gli sviluppatori a valutare anche il nostro ecosistema COM-HPC Client ad alte prestazioni.
Dettagli sulla specifica COM Express
There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
- Intel® Core™ Series 3 processors
- Up to 6 CPU cores
- Optional integrated NPU with up to 18 TOPS
- Up to 64 GB DDR5 memory
- AMD Zen5/5c CPU Cores
- AMD Radeon™ RDNA™ 3.5 Graphics
- AMD XDNA™ 2 NPU
- TDP Range from 15W to 54W
- Onboard NVMe™ SSD (option)
- Intel® Core™ Ultra processors (Series 3)
- Up to 16 cores and 22 threads
- Intel® Arc™ Graphics Xᵉ3 up to 192 EU
- Integrated NPU with 50 TOPS, 180 TOPS total platform performance
- LPDDR5x memory with up to 96 GB RAM system capacity
- Intel® Core™ Ultra processors (Series 3)
- Up to 16 cores and 22 threads
- Intel® Arc™ Graphics Xᵉ3 up to 192 EU
- Integrated NPU with 50 TOPS, 180 TOPS total platform performance
- Up to 128 GB DDR5 SODIMM
- Intel® Core™ Ultra processors
- Intel® Arc™ Graphics with up to 128 EUs
- Up to 99 TOPS Edge AI performance
- Up to 128 GB RAM with in-band ECC
- Up to 16 cores / 22 threads
- PCIe Gen 4 & USB 4
- AMD Ryzen Embedded 8000
- Up to 8 Zen 4 cores
- AMD Radeon™ RDNA™ 3 Graphics
- AMD XDNA™ NPU
- Up to 96 GB RAM (optional with ECC)
- TDP Range from 15W to 54W
- Onboard NVMe™ SSD (option)
- 8th Generation Intel® Core™ / Celeron® Processors
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Industrial grade versions
- 13th Generation Intel® Core™ Processors
- Up to 64 GByte DDR5 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- Intel Atom® E3900
- Low-power - performance/watt optimized form factor solution
- Up to 8 GByte DDR3L 1600/1866 Memory (2x SODIMM socket)
- 4x USB 3.0/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
- Industrial grade temperature
- Intel® Core™ Ultra processors
- Up to 16 cores
- Up to 96 GB DDR5 with in-band ECC
- Built-in Intel® Arc™ GPU
- Integrated Intel® AI Boost NPU
- 13th Generation Intel® Core™
- Soldered memory
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
- 13th Generation Intel® Core™
- Intel® Performance Hybrid Architecture
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
- 13th Generation Intel® Core™ Processors
- Up to 64 GByte LPDDR5 memory down
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- 11th Generation Intel® Core™
- Performance-optimized design
- Up to 8 cores
- Extended temperature range options
- PCIe Gen 4
- 11th Generation Intel® Core™
- Extremely rugged with soldered memory
- Extended temperature range options
- IEC-60068 certified
- PCIe Gen 4
- AMD Embedded Ryzen V2000 processor series
- High-performance Zen 2 CPU & VEGA GPU
- Superior cost/performance ratio
- Up to 8 cores
- Wide TDP range from 10-54 W
- Intel Atom® x6000E, Intel® Pentium® and Celeron®
- Cost- and power-optimized design
- Up to 4 cores
- Extended temperature range options
- Supports TSN and TCC
- Intel Atom® x7000E / x7000RE
- Up to 16 GByte DDR5-4800 memory with in-band ECC
- Up to 2.5 Gb Ethernet with TSN support
- Up to four independent display interfaces
- Industrial grade versions
- 11th Generation Intel® Core™ / Xeon® Processors
- Up to 128 GByte DDR4 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- Intel Atom® x6000E, Pentium® and Celeron® Series
- Low-power – performance/watt
- Up to 32 GByte DDR4-3200 memory
- Triple display support
- Up to 2.5 Gb Ethernet with TSN support
- 11th Generation Intel® Core™
- Compact design
- Up to 4 cores
- Extended temperature range options
- PCIe Gen 4
- 11th Generation Intel® Core™/Celeron® Processors
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- 8th Generation Intel® Core™ SOC processor
- Up to 4 cores at low-power TDP of 15W
- New Intel® Gen 9 HD Graphics
- Optional eMMC 5.1 on board mass storage
- COM Express Compact Type 6 module 95x95 mm²
- Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
- Up to 128 GByte DDR4 non-ECC/ECC memory
- Optional NVMe SSD onboard
- Industrial grade versions
- 8th Generation Intel® Core™ and Xeon®
- Performance-optimized design
- Up to 6 cores
- Supports USB 3.1 Gen 2 (10 Gbit/s)
- Up to 64 GB ECC memory
conga-TR4
- AMD Embedded Ryzen V1000 processor series
- High-performance Vega GPU
- Supports up to 4x 4k
- Up to 4 cores
- Wide TDP range down to 12 W
conga-TCA5
- Intel Atom® x7-E, Intel® Pentium® and Celeron®
- Size-optimized design
- Low power consumption (12 W)
- Up to 4 cores
- Extended temperature range options
conga-TEVAL3/COMe3.1
- Evaluation Carrier for COMe Type 6 modules
- Supports COMe Compact and Basic modules using connector Pinout Type 6
- Compliant to latest COMe Spec Rev. 3.1
conga-TEVAL/COMe 3.0
- Evaluation carrier board for COM Express Type 6
- 6x PCIe card slots for 25 lanes
- Supports 4x USB 3.1 Type A
- Compact size (294x244 mm)
- Schematics available on project basis
conga-Eval Carrier2 T6
- COM Express® Rev. 3.1, Pin-out Type 6
- ATX Form Factor (305mm x 244mm)
- 1x GbE support
- 8x PCIe x1 + PEG x16
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