Unser COM Express Type 6 Ecosystem ist die ideale Wahl für das gesamte Spektrum embedded Computing Applications. Mit zwei unterschiedlichen Formfaktoren bietet es Entwicklern alles, was sie benötigen – vom leistungsstarken PLC über HMI- und Shop-Floor-Systeme bis hin zu High-End Digital Signage und High-Performance Medizintechnik. Für Applikationen, die mehr Performance und höhere Bandbreite als COM Express benötigen, sollten Entwickler zusätzlich unser High-Performance COM-HPC Client Ecosystem evaluieren.
Details zur COM Express Spezifikation
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conga-bRP6
- 13th Generation Intel® Core™ Processors
- Up to 64 GByte DDR5 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
conga-cRP6
- 13th Generation Intel® Core™ Processors
- Up to 64 GByte LPDDR5 memory down
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
conga-cAS6
- Intel Atom® x7000E / x7000RE
- Up to 16 GByte DDR5-4800 memory with in-band ECC
- Up to 2.5 Gb Ethernet with TSN support
- Up to four independent display interfaces
- Industrial grade versions
conga-cEL6
- Intel Atom® x6000E, Pentium® and Celeron® Series
- Low-power – performance/watt
- Up to 32 GByte DDR4-3200 memory
- Triple display support
- Up to 2.5 Gb Ethernet with TSN support
conga-bTL6
- 11th Generation Intel® Core™ / Xeon® Processors
- Up to 128 GByte DDR4 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
conga-cTL6
- 11th Generation Intel® Core™/Celeron® Processors
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
conga-TC370
- 8th Generation Intel® Core™ SOC processor
- Up to 4 cores at low-power TDP of 15W
- New Intel® Gen 9 HD Graphics
- Optional eMMC 5.1 on board mass storage
- COM Express Compact Type 6 module 95x95 mm²
conga-bCL6
- Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
- Up to 128 GByte DDR4 non-ECC/ECC memory
- Optional NVMe SSD onboard
- Industrial grade versions
conga-TS370
- 8th Generation Intel® Core™ and Xeon®
- Performance-optimized design
- Up to 6 cores
- Supports USB 3.1 Gen 2 (10 Gbit/s)
- Up to 64 GB ECC memory
conga-TR4
- AMD Embedded Ryzen V1000 processor series
- High-performance Vega GPU
- Supports up to 4x 4k
- Up to 4 cores
- Wide TDP range down to 12 W
conga-TS175
- 7th Generation Intel® Core™ and Xeon®
- Performance-optimized design
- Up to 4 cores
- Up to 32 GB DDR4
- ECC support
conga-TC175
- 7th Generation Intel® Core™ and Celeron®
- Size-optimized design
- Low configurable power consumption (cTDP 7.5 W)
- Up to 2 cores
- Up to 32 GB DDR4 memory
conga-TCA5
- Intel Atom® x7-E, Intel® Pentium® and Celeron®
- Size-optimized design
- Low power consumption (12 W)
- Up to 4 cores
- Extended temperature range options
conga-TS170
- 6th Generation Intel® Core™ and Xeon®
- Performance-optimized design
- Up to 4 cores
- Up to 32 GB DDR4
- ECC support for Intel® Xeon®
conga-TC170
- 6th Generation Intel® Core™ and Celeron®
- Size-optimized design
- Low power consumption (TDP 15 W)
- Up to 2 cores
- Up to 32 GB DDR4 memory
conga-TEVAL3/COMe3.1
- Evaluation Carrier for COMe Type 6 modules
- Supports COMe Compact and Basic modules using connector Pinout Type 6
- Compliant to latest COMe Spec Rev. 3.1
conga-TEVAL/COMe 3.0
- Evaluation carrier board for COM Express Type 6
- 6x PCIe card slots for 25 lanes
- Supports 4x USB 3.1 Type A
- Compact size (294x244 mm)
- Schematics available on project basis
conga-Eval Carrier2 T6
- COM Express® Rev. 3.1, Pin-out Type 6
- ATX Form Factor (305mm x 244mm)
- 1x GbE support
- 8x PCIe x1 + PEG x16
