conga-TEVAL3/COMe3.1 Preview image
  • conga-TEVAL3/COMe3.1 Image 1
  • conga-TEVAL3/COMe3.1 Image 2
  • conga-TEVAL3/COMe3.1 Image 3

Your item has been added to the inquiry

conga-TEVAL3/COMe3.1 Image


COM Express Type 6 Rev. 3.1 Evaluation Carrier Board

Selected module variant


COM Express Type 6 Rev. 3.1 Evaluation Carrier Board

  • Evaluation Carrier for COMe Type 6 modules
  • Supports COMe Compact and Basic modules using connector Pinout Type 6
  • Compliant to latest COMe Spec Rev. 3.1


Board Type

  • Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.1

Internal IO

  • PCIe Gen4 x16 (PEG)
  • PCIe Gen4 x4
  • 2x PCIe Gen4 x1
  • M.2 Key B 2242/3042 (USB2.0 muxed, PCIe x1, SIM)
  • M.2 Key E 2230 (USB2.0 muxed, PCIe x1)
  • Dual USB2.0 header (muxed)
  • USB Typ B (muxed)
  • 3x SATA 6Gb/s
  • SATA 6Gb/s with SATADOM Pin 7
  • LVDS (muxed with eDP)
  • eDP (muxed with LVDS)
  • VGA Dsub
  • HDA/SoundWire header
  • GSPI header
  • SD Card socket (muxed with GPIOs)
  • SPI boot flash socket
  • Up to 4x COM headers
  • CAN header
  • LPC header
  • Feature Connector
  • ATX-4pin Power connector
  • ATX-24pin Power connector
  • Banana sockets for single power input

External IO

  • RJ45 2.5G Base-T
  • 2x Dual USB Type A up to 10Gbps
  • 2x USB4 Type C up to 20Gbps
  • DP++ HBR3
  • 2x Audio Jack 3.5mm

Operation -40°C to 85°C | Storage -40°C to 85°C

Operation 10% to 90% r. H. non cond. | Storage 5% to 95% r. H. non cond.

294 x 244 mm2



All documents found on this page are updated without notification. Always check this page for the latest version.

Data Sheet

Ecosystem Details


conga-TEVAL3/COMe3.1 (P/N 065820)

congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C