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conga-HPC/cRX1

AMD Ryzen™ AI Embedded X100シリーズを搭載したCOM-HPC Client Size C

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                conga-HPC/cRX1

                AMD Ryzen™ AI Embedded X100 シリーズ搭載 COM-HPC Client Size Cモジュール

                COMについて学ぶ  - 解説書をダウンロード

                • AMD Zen 5 CPUコア
                • AMD Radeon RDNA 3.5グラフィックス
                • AMD XDNA 2 NPU
                • TDP範囲：45W～120W
                • オンボードPCIeスイッチ（オプション）
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                Value adding ecosystem offerings

                Operating Systems

                Virtualization

                IOT Software

                Cooling Solutions

                Carrierboards

                Module services

                Specification

                Formfactor
                COM-HPC
                CPU
                AMD Ryzen™ AI Embedded X199 (16 x 5.1 GHz, 64 MB cache, 55W)
                AMD Ryzen™ AI Embedded X188 (12 x 5 GHz, 64 MB cache, 55W)
                AMD Ryzen™ AI Embedded X168 (8 x 5 GHz, 32 MB cache, 55W)
                AMD Ryzen™ AI Embedded X199i (16 x 5.1 GHz, 64 MB cache, 55W)
                AMD Ryzen™ AI Embedded X188i (12 x 5 GHz, 64 MB cache, 55W)
                DRAM
                Up to 128GB 256-bit LPDDR5x-8533
                Ethernet
                2 x 2.5 GbE via Intel® i226 Ethernet controller series
                I/O Interfaces
                Up to 4x USB 3.2 Gen2
                Up to 8x USB 2.0
                2 x SATA 6Gb/s (assembly option)
                Up to 24x PCIe Gen4 (assembly option)
                2 x I²C bus
                2 x UART
                12 x GPIO
                1 x SM-Bus
                1 x GPSPI
                Mass storage
                NVMe SSD with 128GB (optional up to 1 TB capacity)
                Graphics
                Integrated AMD Radeon RDNA 3.5 Graphics with up to 40x CUs (Compute Units)
                NPU/AI Acceleration
                Integrated XDNA 2™ NPU with up to 50 TOPs
                congatec Board Controller
                Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
                embedded BIOS Features
                AMI Aptio UEFI
                64Mbyte serial SPI with congatec Embedded BIOS feature
                OEM Logo
                OEM CMOS Defaults
                LCD Control
                Display Auto Detection
                Backlight Control
                Flash Update
                Security
                Trusted Platform Module (TPM 2.0)
                Power Management
                ACPI 6.0 with battery support
                Operating Systems
                Microsoft® Windows 11
                Microsoft® Windows 11 IoT Enterprise
                Linux
                Hypervisor
                conga-zones Hypervisor
                Temperature
                Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C
                Humidity
                Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
                Video Interfaces
                Up to 3x DDI
                1 x eDP
                Up to 4x independent displays
                Size
                120 x 160 mm

                Documents

                All documents found on this page are updated without notification. Always check this page for the latest version.

                Other

                Data Sheet for conga-HPC/cRX1
                09.07.2026

                Whitepaper

                The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

                Product Variants

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                    There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
                    If you don't find the configuration you require contact your congatec Sales representative for further assistance.
                    conga-HPC/cRX1-X199-128G (P/N 053700)

                    COM-HPC Size C module based on AMD Ryzen AI Embedded X199 processor with 16 Zen5 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 40 CUs | 128GB LPDDR5x onboard memory | 64MB L3 Cache | Scalable TDP from 45W up to 120W | Commercial grade temperature range from 0°C to +60°C.

                    conga-HPC/cRX1-X188-64G (P/N 053701)

                    COM-HPC Size C module based on AMD Ryzen AI Embedded X188 processor with 12 Zen5 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 32 CUs | 64GB LPDDR5x onboard memory | 64MB L3 Cache | Scalable TDP from 45W up to 120W | Commercial grade temperature range from 0°C to +60°C.

                    conga-HPC/cRX1-X168-32G (P/N 053702)

                    COM-HPC Size C module based on AMD Ryzen AI Embedded X168 processor with 8 Zen5 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 32 CUs | 32GB LPDDR5x onboard memory | 32MB L3 Cache | Scalable TDP from 45W up to 120W | Commercial grade temperature range from 0°C to +60°C.

                    conga-HPC/cRX1-X199i-128G (P/N 053710)

                    COM-HPC Size C module based on AMD Ryzen AI Embedded X199i processor with 16 Zen5 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 40 CUs | 128GB LPDDR5x onboard memory | 64MB L3 Cache | Scalable TDP from 45W up to 120W | Industrial grade temperature range from -40°C to +85°C.

                    conga-HPC/cRX1-X188i-64G (P/N 053701)

                    COM-HPC Size C module based on AMD Ryzen AI Embedded X188i processor with 12 Zen5 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 32 CUs | 64GB LPDDR5x onboard memory | 64MB L3 Cache | Scalable TDP from 45W up to 120W | Industrial grade temperature range from -40°C to +85°C.

                    conga-HPC/cRX1-X168i-32G (P/N 053702)

                    COM-HPC Size C module based on AMD Ryzen AI Embedded X168i processor with 8 Zen5 Cores | Integrated XDNA 2 NPU | Integrated RDNA 3.5 Graphics with 32 CUs | 32GB LPDDR5x onboard memory | 32MB L3 Cache | Scalable TDP from 45W up to 120W | Industrial grade temperature range from -40°C to +85°C.

                    Ecosystem Details

                    Operating Systems

                    ctrlX OS (P/N 300020 )
                    Ubuntu Pro (P/N N/A)
                    Kontron OS (P/N 300004)

                    Virtualization

                    Hypervisor (P/N 300501)

                    IOT Software

                    Application Manager (P/N 300201)
                    Fleet Manager (P/N 300202)
                    Cloud Connector (P/N 300203)

                    Cooling Solutions

                    conga-HPC/cRX1-CSA-HP-B (P/N 053750)

                    Standard active cooling solution for COM-HPC module conga-HPC/cRX1 with integrated heat pipes, overall height 40mm and integrated 12V fan. Standoffs are with 2.7mm borehole.

                    conga-HPC/cRX1-CSA-HP-T (P/N 053751)

                    Standard active cooling solution for COM-HPC module conga-HPC/cRX1 with integrated heat pipes, overall height 40mm and integrated 12V fan. Standoffs are M2.5mm threaded.

                    conga-HPC/cRX1-HSP-HP-B (P/N 053754)

                    Standard heatspreader for COM-HPC module conga-HPC/cRX1 with integrated heat pipes and 13mm height. Standoffs are with 2.7mm borehole.

                    conga-HPC/cRX1-HSP-HP-T (P/N 053755)

                    Standard heatspreader for COM-HPC module conga-HPC/cRX1 with integrated heat pipes and 13mm height. Standoffs are M2.5mm threaded.

                    Carrierboards

                    conga-HPC/EVAL-Client (P/N 065600)

                    Evaluation Carrier Board for COM-HPC Client type Modules.

                    conga-HPC/uATX-Client (P/N 065620)

                    COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C.

                    Module services

                    Design-In Training (P/N 27000001)

                    Design-Training to develop carrier boards for Computer on Modules

                    製品比較