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conga-TCR8

COM Express Type 6 Compact module based on AMD Ryzen Embedded 8000 processor series

Ausgewählte Modulvariante

    Ausgewählte Ecosystem Parts

    Virtualization

      Operating Systems

        IOT Software

          Cooling Solutions

            Carrierboards

              Memory

                Module services

                  Zusätzliche Ecosystem Parts


                  Virtualization

                  Operating Systems

                  IOT Software

                  Cooling Solutions

                  Carrierboards

                  Memory

                  Module services

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                  conga-TCR8

                  COM Express Type 6 Compact module based on AMD Ryzen Embedded 8000 processor series

                  Virtualization Ready
                  • Up to 8 Zen 4 cores
                  • AMD Radeon™ RDNA™ 3 Graphics
                  • AMD XDNA™ NPU
                  • Up to 96 GB RAM (optional with ECC)
                  • TDP Range from 15W to 54W
                  • Onboard NVMe™ SSD (option)
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                  Wollen Sie noch weitere Produkte aus unserem Ecosystem (zB. Carrierboards oder Arbeitsspeicher) zu Ihrer Anfrage hinzufügen?

                  Zusätzliche Ecosystem Parts

                  Virtualization

                  Operating Systems

                  IOT Software

                  Cooling Solutions

                  Carrierboards

                  Memory

                  Module services

                  Spezifikation

                  Formfactor
                  COM Express Compact
                  CPU
                  AMD Ryzen™ Embedded 8640U (6 cores 3.2GHz up to 4.9GHz, 22MB cache)
                  AMD Ryzen™ Embedded 8645HS (6 cores 4.3GHz up to 5GHz, 22MB cache)
                  AMD Ryzen™ Embedded 8840U (8 cores 3.3GHz up to 5.1GHz, 24MB cache)
                  AMD Ryzen™ Embedded 8845HS (8 cores 3.8GHz up to 5.1GHz, 24MB cache)
                  DRAM
                  2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |up to 5600 MT/s | ECC (option)
                  Ethernet
                  2.5 GbE via Intel® i226 Ethernet controller series
                  I/O Interfaces
                  4 x USB 3.2 Gen2
                  4 x USB 2.0
                  2 x SATA 6Gb/s (if NVMe™ SSD option is not used)
                  6 x PCIe Gen4 (8 lanes)
                  PEG x8 Gen4
                  1 x I²C bus
                  1 x GPSPI
                  2 x UART
                  8 x GPIO
                  1 x SM-Bus
                  1 x LPC
                  Mass storage
                  NVMe™ SSD up to 1 TB capacity (option instead of SATA ports)
                  Graphics
                  Integrated AMD Radeon™ RDNA™ 3 Graphics with up to 6x WGPs (12 CUs)
                  NPU/AI Acceleration
                  Integrated XDNA™ NPU with up to 16 TOPs | Up to 39 TOPs total SoC performance
                  congatec Board Controller
                  Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
                  embedded BIOS Features
                  AMI Aptio® UEFI firmware
                  32 Mbyte serial SPI with congatec Embedded BIOS feature
                  OEM Logo
                  OEM CMOS Defaults
                  LCD Control
                  Display Auto Detection
                  Backlight Control
                  Flash Update
                  Security
                  Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard
                  Power Management
                  ACPI 6.0 with battery support
                  Operating Systems
                  Microsoft® Windows 11
                  Microsoft® Windows 11 IoT Enterprise
                  Microsoft® Windows® 10
                  Microsoft® Windows 10 IoT Enterprise
                  Linux
                  Hypervisor
                  RTS Real-Time Hypervisor
                  Temperature
                  Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
                  Humidity
                  Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
                  Video Interfaces
                  Up to 3x DDI
                  LVDS or eDP
                  4 x independent displays
                  Size
                  95 x 95 mm (3,74" x 3,74")

                  Dokumente

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                  Data Sheet

                  Data Sheet for conga-TCR8
                  07.01.2025

                  Produktvarianten

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                    conga-TCR8/8845HS (P/N 051700)

                    COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8845HS with 8 cores | 3.8GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

                    conga-TCR8/8840U (P/N 051701)

                    COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8840U with 8 cores | 3.3GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

                    conga-TCR8/8645HS (P/N 051702)

                    COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8645HS with 6 cores | 4.3GHz up to 5.0GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

                    conga-TCR8/8640U (P/N 051703)

                    COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8640U with 6 cores | 3.2GHz up to 4.9GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.

                    Ecosystem Details

                    Virtualization

                    Hypervisor (P/N 300501)

                    Operating Systems

                    ctrlX OS (P/N )
                    Ubuntu Pro (P/N N/A)

                    IOT Software

                    COM Manager (P/N 300200)
                    Application Manager (P/N 300201)
                    Fleet Manager (P/N 300202)
                    Cloud Connector (P/N 300203)

                    Cooling Solutions

                    conga-TCR8/CSA-HP-B (P/N 051750)

                    Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

                    conga-TCR8/CSA-HP-T (P/N 051751)

                    Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.

                    conga-TCR8/CSP-HP-B (P/N 051752)

                    Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

                    conga-TCR8/CSP-HP-T (P/N 051753)

                    Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded.

                    conga-TCR8/HSP-HP-B (P/N 051754)

                    Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

                    conga-TCR8/HSP-HP-T (P/N 051755)

                    Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded.

                    Carrierboards

                    conga-TEVAL3/COMe3.1 (P/N 065820)

                    congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C

                    Memory

                    DDR5-SODIMM-5600 (8GB) (P/N 068930)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 (16GB) (P/N 068931)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 (32GB) (P/N 068932)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 (48GB) (P/N 068933)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 ECC (8GB) (P/N 68940)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM with ECC, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 ECC (16GB) (P/N 68941)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 ECC (32GB) (P/N 68942)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C

                    DDR5-SODIMM-5600 ECC (48GB) (P/N 68943)

                    DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C

                    Module services

                    Design-In Training (P/N 27000001)

                    Design-Training to develop carrier boards for Computer on Modules

                    Conformal Coating COM Express Basic and Compact (P/N )

                    HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
                    RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.