congatec Whitepapers
Etteplan Evaluation Platform leverages congatec Computer-on-Modules (COMs)
Etteplan Develops Next-Generation, All-in-One Evaluation Platform to Accelerate Customers’ Product Development
COM-HPC Intel Xeon D Solution Brief
Three new computer-on-modules for high performance computing (COM-HPC) products from congatec bring the power of a server from the data center to the edge, including industrial environments and outdoor applications.
솔루션 요약: 의료 애플리케이션을 위한 COM-HPC
콩가텍의 COM-HPC 모듈은 최신 헬스케어 시스템을 구동하는 AI, 그래픽 및 기타 데이터 집약적 애플리케이션에 필요한 설계 유연성과 고성능을 제공한다.
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12th Gen Intel Core Computer-on-Modules
The 12th generation Intel Core mobile and desktop processors have recently arrived in the embedded computing space, with implementations on the high-performance Computer-on-Module standards COM-HPC and COM Express.
Intel Xeon D processors on COM-HPC Server-on-Modules
The integration of Intel Xeon D processors on COM-HPC Server-on-Modules from manufacturers such as congatec allows edge server installations to break free from the tight thermal constraints of air-conditioned server rooms.
Rugged Computer-on-Modules
congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.
COM-HPC: Massive Performance Boost for the Edge
The new Intel Xeon, Core, and Celeron processors (code name “Tiger Lake-H”) can develop their full performance potential on COM-HPC modules. Their availability from module market leader congatec also marks a new era of computer-on-module–based system development.
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Edge computing boards with new Intel Atom x6000E processors
The new Intel Atom® x6000E Series, Intel Celeron® and Pentium® N & J processors impress with twice the graphics speed of their predecessors and 50% more multi-thread performance on up to 4 cores.
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Multitasking at the edge
In the past, there was rarely a need to put much emphasis on a high number of cores as most established embedded systems had little parallel processing to do. With Industry 4.0 and IIoT digitization, this picture has dramatically changed.
Remote management made easy
PICMG launched a COM-HPC interface specification for the management of embedded systems platforms. The goal is to help edge server engineers manage systems remotely. For example, if a system is hung up, an IT administrator can hit reset with the same effect as if he had gone to a factory floor or other site.
NPU-trained eyes
The integration of embedded vision is crucial to the success of AI-accelerated systems whether they are deployed in self-driving vehicles, video surveillance cameras or collaborative robotics. Preconfigured embedded vision building blocks make it easier for developers to create custom solutions fast.
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11th Gen Intel Core Solution Brief
Built on 11th Gen Intel® Core™ processors, congatec’s conga-TS570 COM Express Type 6 and conga-HPC/cTLH COM-HPC Client modules bring near real- time performance, scalability, security, and resilience to a new class of edge computing applications.
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Maximum performance for COM Express Type 7 servers
Embedded edge servers and microservers need high performance. Anyone wanting to develop such high-performance systems scalably with server-on-modules for harsh environments needs an ecosystem based on COM Express Type 7 with fanless support for TDPs of up to 100 W
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Human-Like Cognition with a NPU for Enhanced Patient Care
The way in which embedded integration is realized determines the success of AI-based systems in biomedical engineering applications – whether for diagnoses, defibrillators, or live images from minimally invasive surgery. Preconfigured embedded modules help developers find specific solutions for medical applications faster.
COM Express Type 6 and COM-HPC Client
It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.
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SMARC modules with NXP i.MX 8M Plus Processor
congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible.
8 cores for heterogeneous edge computing
Tasks at the embedded edge are getting more and more complex. Supporting up to 8 cores and 16 threads, the recently launched AMD Ryzen Embedded V2000 processors are paving the way for x86-based embedded designs with unprecedented compute density and performance per watt.
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Embedded server modules for edge data centers
The growing need to lower latency and reduce energy-hungry data traffic over long distances is leading to rapidly rising deployment of server technology and data centers at the edge. Server-on-Modules based on the COM-HPC and COM Express standards offer a highly efficient design basis for this.
The edge is modular
Industrial edge server designs must be highly flexible to integrate the ability to perform diverse tasks. Increasingly, virtual machines are being used to consolidate a variety of
Industry 4.0 workloads. Learn more about hardware consolidation and modular edge computing
The significance of real-time Ethernet networks for the IIoT
With the emergence of 5G technologies and the arrival of 10+ GbE networks in the industrial sector, real-time processing leveraging time-sensitive networking in tactile Internet environments is becoming an important new application area. What are the requirements for TSN-enabled edge computers?
11세대가 좋은 11가지 이유
11세대 Intel® Core™ 프로세서 세대(코드명 Tiger Lake)의 출시와 함께 congatec(콩가텍)은 이 새로운 프로세서를 사용할 수 있는 COM-HPC Size A 및 COM Express Compact Computer-on-Modules을 개발했습니다.
머신 비전을 가속화하는 COM-HPC 모듈
3D 머신 비전은 실제 사람 눈과 가장 유사해 다양한 분야에서 응용되며, 머신 러닝과 함께 빠르게 시장을 확대해 나가고 있다. 산업용 제조 분야에서 3D 비전이 가장 널리 활용되는 분야는 비전가이드로봇(Vision Guided Robotics, VGR) 및 무인운반차(Automated Guided Vehicles, AGV) 시스템으로, 이 기술은 현재 인더스트리 4.0 세대 애플리케이션에 활용되는 새로운 솔루션을 제공하고 있다.
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Focus on mobile devices
Color video technology paired with artificial intelligence is a large development field for the future optimization of patient care. Mobile systems have an important role to play in this context, and OEMs need solutions that integrate embedded vision and embedded computer technology.
COM-HPC: 개발자와 사용자가 알아야 할 사항
임베디드 컴퓨팅 업계는 모듈식 시스템 설계를 위한 차세대 표준으로 COM-HPC를 출범합니다. COM-HPC는 복잡하고 때로는 잘못 해석될 수 있기 때문에 명확한 정보가 필요합니다
COM HPC 서버 – 새로운 서버 온 모듈(Server-on-Module) 표준
새로운 하이엔드 서버 온 모듈의 가장 중요한 시장과 애플리케이션은 무엇이며 그 한계는 무엇일까요?
COM-HPC 캐리어 보드 설계
COM-HPC는 모듈식 고급 에지 서버를 위한 새로운 표준입니다. COM Express보다 훨씬 빠르고 거의 두 배 많은 인터페이스를 제공합니다. 그 결과 캐리어 보드에 대한 설계 요구 사항이 기하급수적으로 증가하고 있습니다. 개발자는 이러한 새로운 도전에 어떻게 대비할 수 있을까요?
Intel Elkhart Lake Solution Brief
congatec uses Intel Atom® x6000E Series processors plus Intel® Pentium® and Celeron® N and J series processors to bring full-featured computing and IoT services to their SMARC 2.0, Qseven, COMe Mini, COMe compact modules, and Pico-ITX boards
솔루션 개요
콩가텍 COM-HPC 모듈은 확장 가능한 더 많은 레인과 처리 능력에 대한 요구사항에 맞춘 “어드밴스드 IoT를 위한” 11세대 인텔® 코어™ 프로세서를 사용합니다.
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로보틱스용 AI 비전 플랫폼
로보틱 시스템에서 컴퓨터 비전의 중요도는 갈수록 높아지고 있다. 구현이 어려운 실시간 애플리케이션과 TSN을 비전 시스템과 인공지능(AI)에 어떻게 융합할 것인지가 화두가 되고 있다.
로보틱스용 AI 비전 플랫폼
로보틱 시스템에서 컴퓨터 비전의 중요도는 갈수록 높아지고 있다. 구현이 어려운 실시간 애플리케이션과 TSN을 비전 시스템과 인공지능(AI)에 어떻게 융합할 것인지가 화두가 되고 있다.
New benchmark modules for high-end medical computing
The x86 rivalry has once again been rekindled. With the introduction of the AMD Ryzen™
Embedded processors, AMD has set a new benchmark that extends the company’s existing
lead in graphics with 108% more performance, and increases overall computing performance
by 144%.
Quality and Performance Meet Low-Power Innovation for Embedded Designs
congatec simplifies IoT with embedded form factors based on 8th Gen Intel® Core™ U-series processors.
Function toolkit for automated retail checkout systems
congatec, Basler and NXP Semiconductors have developed a function toolkit for deep learning applications in retail. The platform is a proof-of-concept, using artificial intelligence (AI) to fully automate the retail checkout process.
Sensor network orchestration made easy
The path to plug and play cloud solutions leads via cloud API standardization.
Modules for cooperative robotics
The Service Robotics Research Center of Ulm University of Applied Sciences is developing
a modular software framework to make it easier to program robots. The goal is to provide
software components that can be used universally, for instance to swap robotic gripping
arms from different manufacturers as required to generate new robotics solutions via
plug and play.
Whispers about the Computer-on-Module standard COM-HPC
The Computer-on-Module industry is about to launch a new product lifecycle that will create a new performance class after ETX/XTX and COM Express. Called COM-HPC, the new form factor standard is currently primed for PICMG certification by companies such as congatec.
IoT migration made easier
More manufacturers of computer technology for harsh environments are expanding their
hardware offerings with the right ‘glue logic’ to develop IoT solutions. congatec advocates
vendor-independent standardization to ensure that these solutions remain scalable in
line with requirements.
Driving fleets into the cloud
Connecting their fleets to the clouds is a must for transport operators today. The Spanish
solution provider Datik is specialized in such cloud-based solutions for public transport.
AMD Ryzen TR4 Whitepaper
New benchmark modules for high-end embedded computing. congatec COM Express Type 6 modules with AMD Ryzen™ Embedded processors
Scalable Artificial Intelligence
Medical imaging vendors want to improve their services for medical professionals by adding Artificial Intelligence (AI) and Augmented Reality (AR) to their devices. For small form factor devices, AMD embedded processor based Computer-on-Modules are a good choice to balance the performance needs of their AI inference engines under space and power restricted conditions.
i.MX 8X on SMARC 2.0 and Qseven modules from congatec
The 8X version of the NXP i.MX 8 processor has an extremely low power consumption, is robust and comes with many functional safety features. congatec now supports it on the SMARC 2.0 and Qseven module standards.
Closing the loop on industrial manufacturing efficiency
As industrial manufacturers look to capitalize on the efficiency and insights of Industry 4.0 they must transition their electronics infrastructure to support intelligence at the edge of operational networks.
Performance boost for harsh environments
Server processors are getting more and more energy efficient. Embedded application developers use them to boost performance, which also opens up completely new application fields for them. congatec supports such OEM designs with application-ready COM Express Type 7 modules and platforms.
Symbiosis of Mini-ITX and COM Express
High-end industrial applications demand continuous performance upgrades. In times when new embedded processor generations offer significant performance gains each year, modular designs present a distinct advantage.
USB Type-C Whitepaper
Want to use USB-C for Embedded? Do it right!
Advantages and Pitfalls of USB-C Implementations
Apollo Lake Whitepaper
Next generation Intel® low-power "Apollo Lake" processors and their benefits
COM Express Type 7 fog server Whitepaper
10 GbE in real time. COM Express Type 7 for fog and Industry 4.0 servers
SBC Whitepaper
congatec explains what really counts if you want to deploy motherboards outside your cozy home and office.
MIPI Camera Whitepaper
congatec and Intel accelerate Time to Market for Small, Smart Cameras
Computer-on-Modules Whitepaper
Computer-on-Modules are world-leading platforms for embedded system designs.
Modular fog servers with real-time support
The future of Industry 4.0 systems across all sectors lies in the combination of fog server and real time technology.
Intel & RTS Whitepaper
Real-Time Systems and Intel take industrial embedded systems to the next level
Innovative hypervisor and partitioning software increases flexibility and functionality for industry
High Performance on a small factor
The 8th generation Intel Core Mobile processors deliver up to 40% more performance than the
predecessor generation. congatec now offers the new cores on extremely compact 3.5-inch
single-board computers (SBCs).
Computing Core Standard for Mobility IT
In the past, electronic components were tailored to specific automotive platforms in order to reduce costs in series production. But in the cockpits of tomorrow, the days of proprietary controller platforms for dedicated functions are over; the future lies in clustering individual mobility functions by using universally applicable computing cores.
SMARC 2.1 Whitepaper
SMARC 2.0 모듈은 그래픽, 카메라, 사운드, 네트워크 및 무선 인터페이스의 여러옵션등 풍부한 선택 항목으로 뛰어난 기능을 자랑합니다. 임베디드 시스템 개발자에게 IoT 연결 멀티미디어 플랫폼 및 그래픽 집약적인 저전력의 많은 기타 응용 분야에 이상적인 신용 카드 크기의 완전한 상용 임베디드 컴퓨팅 코어를 제공합니다.
Real-time capable Ethernet becomes standard
With the coming of 5G technology and the implementation of 10+ GbE networks in factories, real-time data processing for OPC UA and other tactile Internet applications is emerging as an important new area of use.
40% performance boost for 3.5 inch SBC
congatec is presenting a 3.5 inch board for the first time at Embedded World 2019.
Like the new COM Express Type 6 module that provides the technology base for the new board,
it is equipped with 8th Generation Intel Core i7 Mobile processors. What can the embedded market expect from this?
Device development with SMARC 2.0
SMARC 2.0 is the great new Computer-on-Modules standard for the efficient design of powerful and feature-rich small form factor (SFF) applications.
Rugged 10 GbE infrastructure equipment
The new COM Express® Type 7 specification defines high-end Server-on-Modules that support multiple 10 GbE connections. The modules simplify and optimize the design of infrastructure equipment in rugged environments, in particular with regards to the specific size, weight and power restraints of these applications.
Embedded computing with 8th generation Intel Core Mobile processors
The 8th generation of Intel Core Mobile processors offers a mighty 40% increase in performance over that of the predecessor generation. However, there are even more reasons that speak in favor of the new Intel Core Mobile processors, which are a perfect fit for many different embedded industries.
