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conga-sdID

COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family

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      Cooling Solutions

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        conga-sdID

        formerly JUMPtec COMh-sdID
        COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family 
         

        Learn all about COMs - download the guide

        • Up to 20 cores, processor TDP up to 125W
        • 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
        • Max 512GB DDR4-DIMM with 4x DIMM sockets
        • Optional onboard storage NVMe
        • Industrial temperature versions
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        Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

        Value adding ecosystem offerings

        Carrierboards

        Cooling Solutions

        Specification

        Formfactor
        COM-HPC
        CPU
        Intel® Xeon® D-2752TER (12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)
        Intel® Xeon® D-2775TE (16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)
        Intel® Xeon® D-2796NT (20 x 2.0 GHz, 30 MB cache, 120W)
        Intel® Xeon® D-2776NT (16 x 2.1 GHz, 25 MB cache, 117W)
        Intel® Xeon® D-2753NT (12 x 2.0 GHz, 20 MB cache, 87W)
        Intel® Xeon® D-2796TE (20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)
        DRAM
        4x DDR4 DIMM sockets for up to 128GB LRDIMM
        Ethernet
        1/2.5 Gb Ethernet
        8x Ethernet ports supporting versatile configurations:
        100GbE/2x 50GbE/4x 25GbE/2x 25GbE + 4x 10GbE/8x 10GbE
        I/O Interfaces
        32x PCIe Gen4 (2 x16, 4 x8, 8 x4)
        16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
        4 x USB 3.0 / USB 2.0
        2 x serial interface (RX/TX only)
        SPI
        eSPI
        SM-Bus
        RTC
        Mass storage
        2xSATA 6Gb/s
        embedded BIOS Features
        AMI UEFI
        Security
        Trusted Platform Module (TPM 2.0)
        Power Management
        ACPI 6.0
        Operating Systems
        Linux
        Windows®10
        Microsoft® Windows 11
        Windows Server 2022
        Temperature
        Commercial temperature: 0 °C to +60 °C operating, -30 °C to +80 °C non-operating
        Industrial temperature: -40 °C to +80 °C operating, -40 °C to +80 °C non-operating
        Humidity
        93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
        Features
        Staged Watchdog
        Size
        160 x 160 mm

        Documents

        All documents found on this page are updated without notification. Always check this page for the latest version.

        Data Sheet

        Data sheet for conga-sdID
        15.12.2025

        Whitepaper

        The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

        Product Variants

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            There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
            If you don't find the configuration you require contact your congatec Sales representative for further assistance.
            conga-sdID/D-2796NT (P/N HSD01-0000-96-2)

            COM-HPC® Server Size D module with Intel® Xeon® D-2796NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

            conga-sdID/D-2776NT (P/N HSD01-0000-76-2)

            COM-HPC® Server Size D module with Intel® Xeon® D-2776NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

            conga-sdID/D-2753NT (P/N HSD01-0000-53-2)

            COM-HPC® Server Size D module with Intel® Xeon® D-2753NT SoC, Intel® I226-LM 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and operating temperature from 0 °C to +60 °C.

            conga-sdID/D-2796TE (P/N HSD02-0000-96-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-2796TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

            conga-sdID/D-2775TE (P/N HSD02-0000-75-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-2775TE SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

            conga-sdID/D-2752TER (P/N HSD02-0000-52-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-2752TER SoC, Intel® I226-IT 1/2.5 GbE PHY, support for 8x LAN ports, 4x DDR4 DIMM sockets and extended operating temperature from −40 °C to +80 °C.

            Ecosystem Details

            Carrierboards

            COM-HPC/SERVER EVAL-CARRIER (P/N HST01-0001-10-0)

            Evaluation Carrier with 10-mm stack-up connector

            Cooling Solutions

            COMh-sdID (E2) HSP THREADED (P/N HSD01-0000-99-0)

            COMh-sdID (E2) heatspreader theaded

            COMh-sdID (E2) HSP THROUGH HOLE (P/N HSD01-0000-99-1)

            COMh-sdID (E2) heatspreader through hole

            COMh SIZE D ACTIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-0)

            COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

            COMh SIZE D PASSIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-1)

            COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

            COOLING COMh-sdID (E2): ADAPTER (P/N HSD01-0000-99-A)

            Cooling Solution for COMh-sdID (E2), adapter for a standard LGA115x cooling solution.
            To be used with HSD01-0000-99-B & HSD01-0000-99-C

            COOLING COMh-sdID (E2): BACKPLATE (P/N HSD01-0000-99-B)

            Cooling Solution for COMh-sdID (E2), backplate
            To be used with HSD01-0000-99-A & HSD01-0000-99-C

            COOLING COMh-sdID (E2): COOLER (P/N HSD01-0000-99-C)

            Cooling Solution for COMh-sdID (E2), LGA115x cooler
            To be used with HSD01-0000-99-A & HSD01-0000-99-B

            製品比較