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conga-cAS6

COM Express® compact Type 6 with Intel Atom® x7000E / x7000RE

Ausgewählte Modulvariante

    Ausgewählte Ecosystem Parts

    Carrierboards

      Cooling Solutions

        Memory

          Zusätzliche Ecosystem Parts


          Carrierboards

          Cooling Solutions

          Memory

          conga-cAS6

          formerly JUMPtec COMe-cAS6

          COM Express® compact Type 6 with Intel Atom® x7000E / x7000RE
           
          Learn all about COMs - download the guide
          • Low-Power – Performance/Watt optimized form factor solution
          • Up to 16 GByte DDR5 4800 MT/s - In-Band ECC
          • Up to 4x Graphics interfaces
          • Up to 6x PCIe lanes, up to 4x USB 3.2/2.0, 6x USB 2.0
          • Up to 2.5 Gb Ethernet with TSN support
          • Industrial grade temperature
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          Wollen Sie noch weitere Produkte aus unserem Ecosystem (zB. Carrierboards oder Arbeitsspeicher) zu Ihrer Anfrage hinzufügen?

          Zusätzliche Ecosystem Parts

          Carrierboards

          Cooling Solutions

          Memory

          Spezifikation

          Formfactor
          COM Express Compact
          CPU
          Intel Atom® x7213RE (2 x 1.0 GHz, 6 MB cache, 6W)
          Intel Atom® x7211RE (2 x 1.0 GHz, 6 MB cache, 6W)
          Intel Atom® x7433RE (4 x 1.5 GHz, 6MB cache, 9W)
          Intel Atom® x7835RE (8 x 1.3 GHz, 6MB cache, 12W)
          DRAM
          Up to 16 GByte DDR5 4800 MT/s via 1x SODIMM socket (In-Band ECC)
          Ethernet
          Up to 2.5Gb Ethernet with TSN support
          I/O Interfaces
          4 x PCIe Gen3
          2 x 1 (PCIe Gen2) - onboard i226 connected via PCIe Gen2 lane
          2 x USB 3.2 Gen2 (includes USB 2.0)
          6 x USB 2.0
          2 x serial interface (RX/TX only)
          SPI
          LPC
          SMB
          Fast I²C
          RTC
          Mass storage
          2xSATA 6Gb/s
          Graphics
          SOC: Intel® HD Gfx Gen 12: LVDS/eDP, 2x DP
          embedded BIOS Features
          AMI Aptio V
          Power Management
          ACPI 5.0
          Operating Systems
          Microsoft® Windows 11
          Microsoft® Windows® 10
          LTSC
          Linux
          Temperature
          0 °C to +60 °C operating, -30 °C to +85 °C non-operating
          industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
          Humidity
          93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
          Video Interfaces
          3 x DP++
          LVDS: Dual Channel 18/24bit
          Features
          Staged Watchdog
          Size
          95 x 95 mm (3,74" x 3,74")

          Dokumente

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          Data Sheet

          Whitepaper

          The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

          Produktvarianten

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            conga-cAS6/x7211RE (P/N 36039-0000-R1-2)

            COM Express® Compact Type 6 module with Intel Atom® x7211RE processor, industrial temperature range -40°C to +85°C.

            conga-cAS6/x7213RE (P/N 36039-0000-R2-2)

            COM Express® Compact Type 6 module with Intel Atom® x7213RE processor, industrial temperature range -40°C to +85°C.

            conga-cAS6/x7433RE (P/N 36039-0000-R2-4)

            COM Express® Compact Type 6 module with Intel Atom® x7433RE processor, industrial temperature range -40°C to +85°C.

            conga-cAS6/x7835RE (P/N 36039-0000-R2-8)

            COM Express® Compact Type 6 module with Intel Atom® x7835RE processor, industrial temperature range -40°C to +85°C.

            Ecosystem Details

            Carrierboards

            COMe Eval Carrier 2 T6 5 mm (P/N 38116-0000-00-5)

            COM Express® Eval Carrier 2 Type 6 with 5 mm COMe connector

            Cooling Solutions

            HSP COMe-cAS6 (E2) THREAD (P/N 36039-0000-99-0)

            Heatspreader for COMe-cAS6 commercial and E2, threaded mounting holes

            HSP COMe-cAS6 (E2) THROUGH (P/N 36039-0000-99-1)

            Heatspreader for COMe-cAS6 commercial and E2, through holes

            COME ACTIVE UNI COOLER2 (W/O HSP) (P/N 36099-0000-99-4)

            COM Express® Universal Active Cooler for Heatspreader Mounting (95 x 95 x 14.3) - 90° turnable

            COME PASSIVE UNI COOLER2 (W/O HSP) (P/N 36099-0000-99-5)

            COM Express® Universal Passive Cooler for Heatspreader Mounting (95 x 95 x 14.3) - 90° turnable

            Memory

            conga-cAS6/DDR5-4800 (16GB) (P/N 97040-1648-CAS6)

            DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM, commercial temp 0°C to +60°C

            conga-cAS6/DDR5-4800 (8GB) (P/N 97040-0848-CAS6)

            DDR5 SODIMM memory module with up to 4800 MT/s and 8GB RAM, commercial temp 0°C to +60°C

            conga-cAS6/DDR5-4800 (16GB) i-temp (P/N 97041-1648-CAS6)

            DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM, industrial temp -40°C to +85°C

            conga-cAS6/DDR5-4800 (8GB) i-temp (P/N 97041-0848-CAS6)

            DDR5 SODIMM memory module with up to 4800 MT/s and 8GB RAM, industrial temp -40°C to +85°C

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