搜索 - congatec

新闻稿 COM-HPC集成的重要里程碑

, China, 24 November 2020* * * 嵌入式和边缘计算技术的领先供应商德国康佳特宣布推出首批COM-HPC载板和散热解决方案，为全新PICMG ® COM-HPC™标准奠定了新的生态系统基础。这是COM-HPC集成的一个重大里程碑，加速基于第11代英特尔 ® 酷睿™处理器（代号Tiger Lake）的康佳特COM-HPC模块的应用。新…

/cn/congatec/press-releases/article/com-hpc%E9%9B%86%E6%88%90%E7%9A%84%E9%87%8D%E8%A6%81%E9%87%8C%E7%A8%8B%E7%A2%91/ 27.04.2021

文件 User's guide for conga-HPC/sILH

three documents that should be referred to when designing a COM-HPC application. The other reference documents that should be used include the following: • COM-HPC Module Base …

PDF – 4 MB 12.10.2026

页面 Embedded World India

edge applications. Our hardware buildings block based on COM-HPC , COM Express , and SMARC , along with software and service building blocks, are an integral part of our aReady. …

/cn/congatec/events/embedded-world-india/ 04.11.2026

页面 Automate

edge applications. Our hardware buildings block based on COM-HPC , COM Express , and SMARC , along with software and service building blocks, are an integral part of our aReady. …

/cn/congatec/events/automate/ 23.10.2026

页面 Elektronikmässan

edge applications. Our hardware buildings block based on COM-HPC , COM Express , and SMARC , along with software and service building blocks, are an integral part of our aReady. …

/cn/congatec/events/elektronikmaessan/ 23.10.2026

页面 Embedded World

coherent ecosystem. Our hardware buildings block based on COM-HPC , COM Express , and SMARC , along with software and service building blocks, are an integral part of our aReady. …

/cn/congatec/events/embedded-world/ 04.11.2026

新闻稿 congatec triples graphics performance of its Server-on-Modules

has added a particularly powerful graphics version to its COM Express Basic Server-on-Module portfolio. The new module features the Intel® Xeon® Processor E3-1515M v5, fast DDR4 …

/cn/congatec/press-releases/article/congatec-triples-graphics-performance-of-its-server-on-modules/ 15.10.2018

新闻稿康佳特利用AMD Ryzen™ Embedded V2000处理器实现性能翻倍

* 嵌入式和边缘计算技术的领先供应商德国康佳特推出基于AMD Ryzen™ Embedded V2000处理器的全新COM Express Compact 计算机模块conga-TCV2。与较早发布的AMD Ryzen™嵌入式V1000相比，该模块的性能提高了一倍，树立了新的每瓦性能标杆，在15W…

/cn/congatec/press-releases/article/%E5%BA%B7%E4%BD%B3%E7%89%B9%E5%88%A9%E7%94%A8amd-ryzentm-embedded-v2000%E5%A4%84%E7%90%86%E5%99%A8%E5%AE%9E%E7%8E%B0%E6%80%A7%E8%83%BD%E7%BF%BB%E5%80%8D/ 27.04.2021

页面 Powerful space saver

the necessary software. Currently, the most commonly used COM standards for new developments are COM Express and Qseven . The older ETX standard and its update XTX are gradually …

/cn/industries/industrial-automation/powerful-space-saver/ 23.10.2026

页面 3rd Generation Intel Atom

the necessary software. Currently, the most commonly used COM standards for new developments are COM Express and Qseven . The older ETX standard and its update XTX are gradually …

/cn/industries/industrial-automation/3rd-generation-intel-atom/ 23.10.2026