• COM Express® Rev. 3.1, Pin-out Type 10
• ATX Form Factor (305mm x 244mm)
• 4x PCIe x1, 1x GbE
• Full support for Type 10 featureset

• COM Express® Rev. 3.0 and 3.1 Pin-out Type 7
• 4x 10GbE support
• 32x PCIe lanes: 1x PCIe Gen4 x16, 1x PCIe Gen3 x8, 2x PCIe Gen3 x4
• SFP+, 10GBASE-KR or 10GBASE-T support via adapter cards

• COM Express® Rev. 3.1, Pin-out Type 6
• ATX Form Factor (305mm x 244mm)
• 1x GbE support
• 8x PCIe x1 + PEG x16

• Evaluation Carrier for COM-HPC Mini Modules
• Routing of the entire signals provided by COM HPC Module Base Specification to standard interface connectors

• Evaluation Carrier for COMe Type 6 modules
• Supports COMe Compact and Basic modules using connector Pinout Type 6
• Compliant to latest COMe Spec Rev. 3.1

• Evaluation carrier board for Size D & E
• 7x PCIe connectors for 52 lanes
• 10 GbE RJ45 through module
• GbE RJ45 through ASPEED AST2600

• Evaluation carrier board for sizes A, B, C
• 5x PCIe connectors for 48 lanes
• 2x MIPI Camera Serial Interface
• KR connector to connect LAN mezzanine cards

• Evaluation carrier board for COM Express Type 7
• 4x PCIe slots for 32 lanes
• 4x 10 Gigabit Ethernet SFP+
• BMC with VGA, iKVM, virtual storage
• Extended temperature options

• Evaluation carrier board for COM Express Type 6
• 6x PCIe card slots for 25 lanes
• Supports 4x USB 3.1 Type A
• Compact size (294x244 mm)
• Schematics available on project basis

• Evaluation carrier board for SMARC
• Reference schematics on project basis
• For all Arm based SMARC modules
• 3x PCIe slots
• Executes complete SMARC I/O range

康佳特提供此评估载板以快速启动Qseven ™模块，该载板将所有Qseven ™模块的信号发送至标准接口连接器。

• Compact Application Carrier for COM-HPC Mini Modules
• Scalable 3.5” motherboard
• Longevity by module concept
• Quick start for COM-HPC Mini designs

• Quick start for COM-HPC Server and Edge Computing
• Unparalleled feature density
• Industrial temperature support
• Scalable µATX carrier board

• Application carrier board for sizes A, B, C
• µATX form factor
• Application-ready layout
• Supports all defined COM-HPC Client I/Os

• Compact sized 3.5” Application Carrier Board
• Support for SMARC modules on ARM
• Made for dual SIM LTE applications
• Industrial Temperature Range -40°C to +85°C
• Fast implementation and improved Time-To-Market

• Application-ready 3.5“ carrier
• For direct system roll-out or evaluation
• For all x86 based SMARC modules
• Executes complete SMARC I/O range
• Tailored cooling solutions available

• Application-ready 3.5“ carrier
• For direct system roll-out or evaluation
• For all Arm based SMARC modules
• Executes complete SMARC I/O range
• Tailored cooling solutions available

• LAN enabling kit (LEK) for COM-HPC Server
• Up to 100 GbE throughput
• Supports SFP28, QSFP28, 8xSFP+
• With Intel® C827-IM or Intel® XL827

• Converts DP++ to HDMI
• Supports HDMI 1.4b with up to 3.4 Gbps
• Supports DP 1.2 with up to 5.4 Gbps
• Supports resolutions of up to 4k

MFG-header adapter on the QEV2 baseboard for RS-232 console-communication with UMX6 / QMX6

• Converts LVDS to DVI-D
• Allows for dual DVI-D systems