System consolidation in autonomous mobile robots
Software functions define the capabilities of autonomous robots. Consolidating all functions on one system can help to make your designs more powerful, cost effective, and resilient. Learn what is possible and what to consider in our whitepaper.
COM-HPC Intel Xeon D Solution Brief
Three new computer-on-modules for high performance computing (COM-HPC) products from congatec bring the power of a server from the data center to the edge, including industrial environments and outdoor applications.
解决方案简介: 面向医疗应用的COM-HPC
德国康佳特 (congatec) 的 COM-HPC 模块为人工智能、图形和其他数据密集型应用提供其所需的设计灵活性和高性能，从而推动医疗系统的现代化发展。
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首款具有x86混合架构并带来核心数量的飞跃
第12代英特尔酷睿移动端和台式机处理器近期登陆嵌入式计算领域，并在COM-HPC和COM Express高性能计算机模块上实现。新的高端嵌入式处理器代号为Alder Lake，采用创新混合 架构，绝非i9、i7、i5、i3的单纯升级版。那么它们的区别在哪里？这些新产品又能为新一代 高端嵌入式及边缘应用带来什么呢？
Rugged Computer-on-Modules
congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.
COM-HPC: Massive Performance Boost for the Edge
The new Intel Xeon, Core, and Celeron processors (code name “Tiger Lake-H”) can develop their full performance potential on COM-HPC modules. Their availability from module market leader congatec also marks a new era of computer-on-module–based system development.
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Edge computing boards with new Intel Atom x6000E processors
The new Intel Atom® x6000E Series, Intel Celeron® and Pentium® N & J processors impress with twice the graphics speed of their predecessors and 50% more multi-thread performance on up to 4 cores.
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NPU-助力人工视觉训练
对于AI加速系统来说，不管是应用在自动驾驶汽车、监控摄像头或协作机器人，其集成的嵌入式 视觉功能堪称是它们成功运行的关键。预配置的嵌入式视觉构件让开发者能够更轻松、更快速地 创建 制解决方案。现在，康佳特与Basler就携手推出了这样的构件平台，它基于NXP i.MX 8 Plus处理器及其强大的集成式神经处理单元（NPU）。
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第11代英特尔酷睿解决方案
康佳特conga-TS570 COM Express Type 6和conga-HPC/cTLH COM-HPC Client模块基于第11代英特尔®酷睿™处理器，为新时代的边缘计算应用提供近乎实时的性能、可拓展性、安全性和容错性
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Maximum performance for COM Express Type 7 servers
Embedded edge servers and microservers need high performance. Anyone wanting to develop such high-performance systems scalably with server-on-modules for harsh environments needs an ecosystem based on COM Express Type 7 with fanless support for TDPs of up to 100 W
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NPU人形识别技术助力病患护理
在生物工程应用领域 (包括诊断、除颤器、微创外科手术中的实时影像)，嵌入式集成的实现方式决定了AI系统的成败。预配置的嵌入式模块可帮助开发者更快为医疗应用找到适用的解决方案。
COM Express Type 6 and COM-HPC Client
It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.
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SMARC modules with NXP i.MX 8M Plus Processor
congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible.
用于异构边缘计算的8核
当下嵌入式边缘计算的任务变得越来越复杂。最新推出的的AMD锐龙嵌入式V2000处理器支持多达8
个核心和16个线程，为基于x86的嵌入式设计铺平了道路。康佳特在COM Express Compact大小的
模块上以6核和8核的新世代Zen 2架构处理器补足了V1000处理器。
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Embedded server modules for edge data centers
The growing need to lower latency and reduce energy-hungry data traffic over long distances is leading to rapidly rising deployment of server technology and data centers at the edge. Server-on-Modules based on the COM-HPC and COM Express standards offer a highly efficient design basis for this.
The edge is modular
Industrial edge server designs must be highly flexible to integrate the ability to perform diverse tasks. Increasingly, virtual machines are being used to consolidate a variety of
Industry 4.0 workloads. Learn more about hardware consolidation and modular edge computing
The significance of real-time Ethernet networks for the IIoT
With the emergence of 5G technologies and the arrival of 10+ GbE networks in the industrial sector, real-time processing leveraging time-sensitive networking in tactile Internet environments is becoming an important new application area. What are the requirements for TSN-enabled edge computers?
COM-HPC模块加速机器视觉
3D机器视觉虽然不是最简单的识别技术，但由于它最接近人眼，因此3D视觉应用广泛，并 越来越多地与机器学习一起使用。目前正在利用3D视觉为工业4.0应用，创造全新解决方案 的工业制造大型应用领域包括视觉引导机器人(VGR)和自动导引车(AGV)。康佳特推出的新 型COM-HPC模块可大幅提升性能并推动这两个领域的硬件整合趋势。
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COM-HPC: 开发者和用户需要了解的信息
COM-HPC: 开发者和用户需要了解的信息 - 嵌入式计算行业计划推出COM-HPC作为模块化系统设计的下一代标准。由于 COM-HPC 设计复杂，且有时会被错误理解，因此需要有明确表述的信息。
COM HPC Server – the new Server-on-Module standard
What are the most important markets and applications for the new high-end Server-on-Modules and what are the limits?
COM-HPC载板设计
近期推出的COM-HPC新标准是面向模块化高端边缘服务器。该标准的速度相比 COM Express显著提升且接口增加近双倍，因此，对载板设计的要求也急剧提升。开发者们该作何准备以应对全新挑战？
Intel Elkhart Lake Solution Brief
congatec uses Intel Atom® x6000E Series processors plus Intel® Pentium® and Celeron® N and J series processors to bring full-featured computing and IoT services to their SMARC 2.0, Qseven, COMe Mini, COMe compact modules, and Pico-ITX boards
AI vision platform for robotics
Computer-based vision is growing more and more important in robotic systems. But how do you fuse hard real-time applications and time-sensitive networking (TSN) with vision systems and artificial intelligence (AI)?
New benchmark modules for high-end medical computing
The x86 rivalry has once again been rekindled. With the introduction of the AMD Ryzen™
Embedded processors, AMD has set a new benchmark that extends the company’s existing
lead in graphics with 108% more performance, and increases overall computing performance
by 144%.
Function toolkit for automated retail checkout systems
congatec, Basler and NXP Semiconductors have developed a function toolkit for deep learning applications in retail. The platform is a proof-of-concept, using artificial intelligence (AI) to fully automate the retail checkout process.
Sensor network orchestration made easy
The path to plug and play cloud solutions leads via cloud API standardization.
Whispers about the Computer-on-Module standard COM-HPC
The Computer-on-Module industry is about to launch a new product lifecycle that will create a new performance class after ETX/XTX and COM Express. Called COM-HPC, the new form factor standard is currently primed for PICMG certification by companies such as congatec.
IoT migration made easier
More manufacturers of computer technology for harsh environments are expanding their
hardware offerings with the right ‘glue logic’ to develop IoT solutions. congatec advocates
vendor-independent standardization to ensure that these solutions remain scalable in
line with requirements.
Driving fleets into the cloud
Connecting their fleets to the clouds is a must for transport operators today. The Spanish
solution provider Datik is specialized in such cloud-based solutions for public transport.
Scalable Artificial Intelligence
Medical imaging vendors want to improve their services for medical professionals by adding Artificial Intelligence (AI) and Augmented Reality (AR) to their devices. For small form factor devices, AMD embedded processor based Computer-on-Modules are a good choice to balance the performance needs of their AI inference engines under space and power restricted conditions.
用ARM实现低能耗计算
康佳特新推出了符合SMARC 2.0与Qseven标准的恩智浦(NXP) i.MX8多核32位与64位ARM处理
器模块。该类模块极其稳定，有些甚至可以支持-40℃至+85℃的工作温度范围，可用于一系列广泛
的应用, 甚至在正常运作模式下，可以仅凭太阳能供电，能耗小于3至5瓦，。那么，该类模块有哪些
工业应用呢？
Performance boost for harsh environments
Server processors are getting more and more energy efficient. Embedded application developers use them to boost performance, which also opens up completely new application fields for them. congatec supports such OEM designs with application-ready COM Express Type 7 modules and platforms.
Symbiosis of Mini-ITX and COM Express
High-end industrial applications demand continuous performance upgrades. In times when new embedded processor generations offer significant performance gains each year, modular designs present a distinct advantage.
USB Type-C Whitepaper
Want to use USB-C for Embedded? Do it right!
Advantages and Pitfalls of USB-C Implementations
Apollo Lake Whitepaper
Next generation Intel® low-power "Apollo Lake" processors and their benefits
SBC Whitepaper
congatec explains what really counts if you want to deploy motherboards outside your cozy home and office.
Computer-on-Modules Whitepaper
Computer-on-Modules are world-leading platforms for embedded system designs.
Modular fog servers with real-time support
The future of Industry 4.0 systems across all sectors lies in the combination of fog server and real time technology.
Intel & RTS Whitepaper
Real-Time Systems and Intel take industrial embedded systems to the next level
Innovative hypervisor and partitioning software increases flexibility and functionality for industry
High Performance on a small factor
The 8th generation Intel Core Mobile processors deliver up to 40% more performance than the
predecessor generation. congatec now offers the new cores on extremely compact 3.5-inch
single-board computers (SBCs).
Computing Core Standard for Mobility IT
In the past, electronic components were tailored to specific automotive platforms in order to reduce costs in series production. But in the cockpits of tomorrow, the days of proprietary controller platforms for dedicated functions are over; the future lies in clustering individual mobility functions by using universally applicable computing cores.
SMARC 2.1 Whitepaper
SMARC 2.0模块以其丰富的图形、摄像头、声音、网络和可选的无线接口选择而脱颖而出。它们为嵌入式系统开发人员提供了一个完整的、现成的、信用卡大小的嵌入式计算内核，是物联网连接多媒体平台和其他许多图形密集型低功耗应用的理想选择。更新后的SMARC 2.1规格进一步扩展了这一功能集。两个PCI Express通道可作为额外的以太网端口。额外的两个MIPI CSI接口和额外的GPIO也扩展了SMARC模块的可能性。
Real-time capable Ethernet becomes standard
With the coming of 5G technology and the implementation of 10+ GbE networks in factories, real-time data processing for OPC UA and other tactile Internet applications is emerging as an important new area of use.
40% performance boost for 3.5 inch SBC
congatec is presenting a 3.5 inch board for the first time at Embedded World 2019.
Like the new COM Express Type 6 module that provides the technology base for the new board,
it is equipped with 8th Generation Intel Core i7 Mobile processors. What can the embedded market expect from this?
Device development with SMARC 2.0
SMARC 2.0 is the great new Computer-on-Modules standard for the efficient design of powerful and feature-rich small form factor (SFF) applications.
Rugged 10 GbE infrastructure equipment
The new COM Express® Type 7 specification defines high-end Server-on-Modules that support multiple 10 GbE connections. The modules simplify and optimize the design of infrastructure equipment in rugged environments, in particular with regards to the specific size, weight and power restraints of these applications.
Embedded computing with 8th generation Intel Core Mobile processors
The 8th generation of Intel Core Mobile processors offers a mighty 40% increase in performance over that of the predecessor generation. However, there are even more reasons that speak in favor of the new Intel Core Mobile processors, which are a perfect fit for many different embedded industries.
