congatec Whitepapers

AI for Medical Imaging Platforms

Integrate modules with Intel Core Ultra Series 3 architecture to unlock real-time image enhancement, automated segmentation, and AI-assisted probe positioning without extra hardware. 

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COMs with Intel Core Ultra Series 3 Processors

Execute demanding AI workloads locally without extra hardware by using Computer-on-Modules with Intel Core Ultra Series 3.  

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Beyond Science Fiction

Achieve scalability, IP protection, and faster time-to-market for RAS platforms with a modular design approach. 

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congatec Adds AI to Ultrasound Systems

Deliver versatile AI performance in a compact modular footprint to protect existing investments and discover what this means for your next design decision.

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全面了解COM(计算机模块)

从机器人、医疗设备到边缘计算和智能出行,COM(计算机模块) 是众多创新背后的核心动力。但为何它如此全能?哪种标准最适合您的应用?在我们这份全面的COM技术指南中,您将找到所有答案。

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COMs with Intel Core Ultra Series 3 Processors

Execute demanding AI workloads locally without extra hardware by using Computer-on-Modules with Intel Core Ultra Series 3.  

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NPU加速视觉边缘

嵌入式视觉集成对于 AI 驱动系统(如自主移动机器人 AMR、自动引导车 AGV、质量检测系统或协作机器人)的成功至关重要。预配置的嵌入式硬件和软件视觉构建模块,使开发者能够快速创建定制解决方案。

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aReady.IOT simplifies development

Discover how congatec's application-ready software building blocks streamline IIoT connectivity and deployment. Overcome complexity, accelerate time-to-market, and focus resources on your core application value by leveraging pre-integrated, modular solutions

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AI for Medical Imaging Platforms

Integrate modules with Intel Core Ultra Series 3 architecture to unlock real-time image enhancement, automated segmentation, and AI-assisted probe positioning without extra hardware. 

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Introduction to workload consolidation

Leveraging multicore processors and virtualization, you can consolidate multiple tasks onto a single platform, where each task operates securely and independently from each other. This is an effective way to reduce costs and complexity in embedded applications. 

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How to design robotic brains

The economic value of the industrial robotics market is growing rapidly and is expected to reach $US 214.60 billion, with a 22.80% compound annual growth rate (CAGR) by 2030. This will be driven, in part, by the integration of new technologies like artificial intelligence (AI), which is expected to contribute $US 44.5 billion to this figure.

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Adapting industrial edge servers to evolving markets

Data processing is surging in sectors like manufacturing, energy, and smart cities, creating a booming market for edge servers. According to Global Market Insights, this will create a $29 billion opportunity for near- and far-edge computing solutions by 2025 

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Ensuring cybersecurity at the industrial edge

Cyber attacks against industrial operations increased by 140% in 2022. Preventing such attacks is non-negotiable, but it can be a significant challenge for industrial operators.

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自主移动机器人的系统整合

软件功能决定了自主机器人的能力。将所有功能整合到一个系统上,有助于使您的设计更强大、更经济、更灵活。在我们的白皮书中,您将了解到哪些可能性以及需要考虑的事项。

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Etteplan 评估平台采用康佳特(congatec) 计算机模块(COM)

Etteplan 开发新一代的全方位评估平台 加速客户的产品开发

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COM-HPC Intel Xeon D Solution Brief

Three new computer-on-modules for high performance computing (COM-HPC) products from congatec bring the power of a server from the data center to the edge, including industrial environments and outdoor applications.

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解决方案简介: 面向医疗应用的COM-HPC

德国康佳特 (congatec) 的 COM-HPC 模块为人工智能、图形和其他数据密集型应用提供其所需的设计灵活性和高性能,从而推动医疗系统的现代化发展。

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首款具有x86混合架构并带来核心数量的飞跃

第12代英特尔酷睿移动端和台式机处理器近期登陆嵌入式计算领域,并在COM-HPC和COM Express高性能计算机模块上实现。新的高端嵌入式处理器代号为Alder Lake,采用创新混合 架构,绝非i9、i7、i5、i3的单纯升级版。那么它们的区别在哪里?这些新产品又能为新一代 高端嵌入式及边缘应用带来什么呢?

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基于英特尔至强D处理器的COM-HPC服务器模块

康佳特等众厂商现已将英特尔至强D处理器整合到COM-HPC服务器模块上, 让边缘服务器设备得以突破以往风冷机房严格散热条件的桎梏。

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Rugged Computer-on-Modules

congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.

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