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Application Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C)

  • Application carrier board for COM-HPC
  • Scalable µATX motherboard
  • Longevity by module concept
  • Quick start to the COM-HPC world


Formfactor Standard Micro-ATX
Board Type Application Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C)
Internal IO 2x PCIe Gen4 x16 | 2x PCIe Gen4 x4 | 2x SATA III | 1x 2.5” Disk Drive Power connector
1x M.2 Key B 2242/3042/2260/2280 (USB2, PCIe x2, SIM) | 1x M.2 Key E 2230 (USB2, PCIe x2) 
1x M.2 Key M 2242/2260/2280/22110 (PCIe x4)
1x eDP (optional for LVDS)
1x DMIC header | 1x I2S/SoundWire header
2x MIPI CSI2/3 4-lane camera FFC | 2x UART native by module | 2x UART by Super IO
1x General Purpose SPI | 2x I2C header | 1x SMB header | 12x GPIO by header
1x Feature header with system control signals | 1x System Fan | 1x CPU Fan | 1x RTC CMOS battery holder
1x Power button | 1x Reset button | 1x LID button | 1x Sleep button 
1x SPI boot flash socket | 1x Intel ISP header | 
1x ATX power connector 24-pin | 1x AT banana power jacks 8-20V
External IO 1x Dual USB 2 | 2x Dual USB 3.2 up to 10Gbps | 2x USB4 with Thunderbolt Retimer (1x with Power Delivery) 3x DP++ with 8.1 Gbps Re-driver | 2x 10GbE RJ45 with IEEE1588 support
1x Audio Jack 4-pin | on-carrier HDA codec
Power Management ACPI 6.0
Operating Systems Microsoft® Windows 11 | Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto
Temperature Range Commercial: Operating Temperature: 0 to +60°C | Storage Temperature:  -20 to +80°C
Humidity Operating Hum.: 10% - 90% r. H. non cond. |  Storage Hum.: 5% - 95% r. H. non cond.
Size 244 x 244 mm²
Order Information PN 065620 conga-HPC/uATX-Client


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Data Sheet

Ecosystem Details


conga-HPC/uATX-Client (P/N 065620)

COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C.