conga-HPC/uATX-Client (P/N 065620)
COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C.
Application Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C)
Formfactor | Standard Micro-ATX |
Board Type | Application Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C) |
Internal IO | 2x PCIe Gen4 x16 | 2x PCIe Gen4 x4 | 2x SATA III | 1x 2.5” Disk Drive Power connector 1x M.2 Key B 2242/3042/2260/2280 (USB2, PCIe x2, SIM) | 1x M.2 Key E 2230 (USB2, PCIe x2) 1x M.2 Key M 2242/2260/2280/22110 (PCIe x4) 1x eDP (optional for LVDS) 1x DMIC header | 1x I2S/SoundWire header 2x MIPI CSI2/3 4-lane camera FFC | 2x UART native by module | 2x UART by Super IO 1x General Purpose SPI | 2x I2C header | 1x SMB header | 12x GPIO by header 1x Feature header with system control signals | 1x System Fan | 1x CPU Fan | 1x RTC CMOS battery holder 1x Power button | 1x Reset button | 1x LID button | 1x Sleep button 1x SPI boot flash socket | 1x Intel ISP header | 1x ATX power connector 24-pin | 1x AT banana power jacks 8-20V |
External IO | 1x Dual USB 2 | 2x Dual USB 3.2 up to 10Gbps | 2x USB4 with Thunderbolt Retimer (1x with Power Delivery) 3x DP++ with 8.1 Gbps Re-driver | 2x 10GbE RJ45 with IEEE1588 support 1x Audio Jack 4-pin | on-carrier HDA codec |
Power Management | ACPI 6.0 |
Operating Systems | Microsoft® Windows 11 | Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Linux | Yocto |
Temperature Range | Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C |
Humidity | Operating Hum.: 10% - 90% r. H. non cond. | Storage Hum.: 5% - 95% r. H. non cond. |
Size | 244 x 244 mm² |
Order Information | PN 065620 conga-HPC/uATX-Client |
Data Sheet
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COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C.