First COM-HPC and next-gen COM Express modules

11th Gen Intel® Core™ processors (Code name: Tiger Lake) with two great new design options on COM-HPC and COM Express

The first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC’s broader array of interfaces. OEMs will benefit from the substantial performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel® Core™ processors deliver to the high-end computing sector. Typical applications can be found in many high-end solutions, from embedded systems and edge computing nodes to network hubs, and local fog data centers to core network appliances, as well as ruggedized central cloud data centers for critical government applications.


The modules

More about conga-HPC/cTLU​

conga-HPC/cTLU​

Virtualization Ready
  • 11th Generation Intel® Core™
  • Power- and size-optimized design
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4
More about conga-TC570r

conga-TC570r

Virtualization Ready
  • 11th Generation Intel® Core™
  • Extremely rugged with soldered memory
  • Extended temperature range options
  • IEC-60068 certified
  • PCIe Gen 4
More about conga-TC570

conga-TC570

Virtualization Ready
  • 11th Generation Intel® Core™
  • Compact design
  • Up to 4 cores
  • Extended temperature range options
  • PCIe Gen 4

 

Videos

conga-TC570 - high-performance COM Express based on 11th Gen Intel® Core™ processors

conga-TC570r - New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM


 

Learn more about our 11th Gen Intel Core based Computer-on-Modules

COM Express Type 6 and COM-HPC Client

It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.

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11th Gen Intel Core Solution Brief

Built on 11th Gen Intel® Core™ processors, congatec’s conga-TS570 COM Express Type 6 and conga-HPC/cTLH COM-HPC Client modules bring near real- time performance, scalability, security, and resilience to a new class of edge computing applications.

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Rugged Computer-on-Modules

congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.

Download Whitepaper