First COM-HPC and next-gen COM Express modules

11th Gen Intel® Core™ processors (Code name: Tiger Lake) with two great new design options on COM-HPC and COM Express

The first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC’s broader array of interfaces. OEMs will benefit from the substantial performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel® Core™ processors deliver to the high-end computing sector. Typical applications can be found in many high-end solutions, from embedded systems and edge computing nodes to network hubs, and local fog data centers to core network appliances, as well as ruggedized central cloud data centers for critical government applications.

The modules

More about conga-HPC/cTLU​


  • 11th Generation Intel® Core™
  • Power- and size-optimized design
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4
More about conga-TC570r


  • 11th Generation Intel® Core™
  • Extremely rugged with soldered memory
  • Extended temperature range options
  • IEC-60068 certified
  • PCIe Gen 4
More about conga-TC570


  • 11th Generation Intel® Core™
  • Compact design
  • Up to 4 cores
  • Extended temperature range options
  • PCIe Gen 4



conga-TC570 - high-performance COM Express based on 11th Gen Intel® Core™ processors

conga-TC570r - New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM


Learn more about our 11th Gen Intel Core based Computer-on-Modules

COM Express Type 6 and COM-HPC Client

It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.
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11 Good reasons for the 11th generation

In parallel with the launch of the 11th Intel® Core™ processor generation (codenamed
Tiger Lake), congatec has made the new processors available on COM-HPC Size A and COM Express Compact Computer-on-Modules.

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COM-HPC: Massive Performance Boost for the Edge

The new Intel Xeon, Core, and Celeron processors (code name “Tiger Lake-H”) can develop their full performance potential on COM-HPC modules. Their availability from module market leader congatec also marks a new era of computer-on-module–based system development.

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11th Gen Intel Core Solution Brief

Built on 11th Gen Intel® Core™ processors, congatec’s conga-TS570 COM Express Type 6 and conga-HPC/cTLH COM-HPC Client modules bring near real- time performance, scalability, security, and resilience to a new class of edge computing applications.

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Intel Tiger Lake Solution Brief

congatec COM-HPC modules use “Enhanced for IoT” 11th Gen Intel® Core™ processors to meet demand for more lanes and more processing power that can scale

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Rugged Computer-on-Modules

congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.

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