首款COM-HPC和新一代COM Express 模块

基于英特尔®11代酷睿处理器(代号: Tiger Lake)两款全新设计选择: COM-HPCCOM Express

首款COM-HPC 客户端系列A尺寸的模块以及新一代COM Express紧凑型计算机模块使工程师们有机会进一步提高现有系统的性能,或利用COM-HPC的各类接口开发下一代产品。基于英特尔®第11代酷睿™处理器的新模块大大提升了高端嵌入式计算性能和通信功能,使原始设备制造商(OEM)受益。高端解决方案中有各种典型应用,包括嵌入式系统、边缘计算节点、网络集线器、本地fog数据中心及核心网络设备,以及用于政府关键应用的加固中央云数据中心。

 


块详情

More about conga-HPC/cTLU​

conga-HPC/cTLU​

  • 11th Generation Intel® Core™
  • Power- and size-optimized design
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4
More about conga-TC570r

conga-TC570r

  • 11th Generation Intel® Core™
  • Extremely rugged with soldered memory
  • Extended temperature range options
  • IEC-60068 certified
  • PCIe Gen 4
More about conga-TC570

conga-TC570

  • 11th Generation Intel® Core™
  • Compact design
  • Up to 4 cores
  • Extended temperature range options
  • PCIe Gen 4

 

Videos

conga-TC570 - high-performance COM Express based on 11th Gen Intel® Core™ processors

conga-TC570r - New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM


 

Learn more about our 11th Gen Intel Core based Computer-on-Modules

COM Express Type 6 and COM-HPC Client

It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.
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选择第11代处理器的绝佳理由

本白皮书将逐一阐述OEM应信赖基于第11代英特尔®酷睿™处理器的康佳特模块的11个原因。

 

下载白皮书

COM-HPC: Massive Performance Boost for the Edge

The new Intel Xeon, Core, and Celeron processors (code name “Tiger Lake-H”) can develop their full performance potential on COM-HPC modules. Their availability from module market leader congatec also marks a new era of computer-on-module–based system development.

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第11代英特尔酷睿解决方案

康佳特conga-TS570 COM Express Type 6和conga-HPC/cTLH COM-HPC Client模块基于第11代英特尔®酷睿™处理器,为新时代的边缘计算应用提供近乎实时的性能、可拓展性、安全性和容错性

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康佳特实现高性能工业边缘计算

康佳特的COM-HPC模块采用“物联网优化”的第11代英特尔®酷睿™处理器,旨在满足用户对更多通道、更强处理性能和可拓展性的需求。

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Rugged Computer-on-Modules

congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.

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