块详情
conga-HPC/cTLU
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-TC570r
- 11th Generation Intel® Core™
- Extremely rugged with soldered memory
- Extended temperature range options
- IEC-60068 certified
- PCIe Gen 4
conga-TC570
- 11th Generation Intel® Core™
- Compact design
- Up to 4 cores
- Extended temperature range options
- PCIe Gen 4
Videos
conga-TC570 - high-performance COM Express based on 11th Gen Intel® Core™ processors
conga-TC570r - New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
Learn more about our 11th Gen Intel Core based Computer-on-Modules
COM Express Type 6 and COM-HPC Client
It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.
Download Whitepaper
第11代英特尔酷睿解决方案
康佳特conga-TS570 COM Express Type 6和conga-HPC/cTLH COM-HPC Client模块基于第11代英特尔®酷睿™处理器，为新时代的边缘计算应用提供近乎实时的性能、可拓展性、安全性和容错性
下载白皮书
Rugged Computer-on-Modules
congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.
