COM-HPC Client – a quantum leap in embedded client performance

Unmatched features and performance for next-gen edge computing designs

COM-HPC Client modules are designed for high-performance embedded and edge computing applications requiring not only extensive computing power and I/O bandwidth but also powerful integrated graphics. COM-HPC Client modules can also be combined with other Client or server modules in one multi-module system design for ultra-high performance designs. 

Facts, Features and Benefits

3 different sizes COM-HPC Client modules come in Size A (120x95 mm), Size B (120x120 mm) and Size C (120x160 mm). Different sizes allow designers to optimally balance the requirements of processor build, performance, memory capacity, and heat dissipation with the space provided by the application.  
Latest interface technology  Support of more and higher bandwidth I/Os including PCIe up to Gen 5 and beyond, USB4 / Thunderbolt 4 and up to 4x 10 GbE.  Future-oriented interface technology for highest transfer rates, reducing bandwidth bottlenecks for an extra-long application lifecycle. 
Immersive hi-res graphics and native camera support COM-HPC Client modules support up to 4x independent graphics outputs and 2x MIPI CSI camera interfaces.  Edge applications require multi-display support with highest resolutions for an immersive user experience and high-quality visualization. This is especially helpful in medical and industrial imaging applications where camera interfaces are often required. 
Increased power budget  Extreme performance thanks to power budgets of up to 251 Watt.  High power budgets provide more headroom for designers to leverage highly powerful CPUs, I/Os and memory, which all require more power for more performance. OEMs are advised to look for vendors that also offer optimized cooling solutions.


Optimum balance of performance, power and size

COM-HPC Client modules come in 3 different sizes, starting at 120x95 mm (Size A) and increasing up to 120x160 mm (Size C). This enables COM-HPC Client modules to provide applications with a huge performance spectrum, ranging from power-optimized soldered CPUs on Size A to socketed high-performance processors and up to 4x SO-DIMM sockets on Size C. With these features, COM-HPC Client takes a unique position in terms of performance and interfaces above all other existing Computer-on-Module standards. 

COM-HPC Client a game changer

COM-HPC Client modules address an application range that other existing standards, including the widely used COM Express standard, simply can’t cover. Nevertheless, COM Express - the most successful Computer-on-Module standard ever - will remain an important design platform which will be maintained for the next decade. The outstanding congatec support for COM Express won’t change. So, OEMs can be assured, that both standards provide the same level of design security. 

Prepared for system consolidation

All COM-HPC Client Computer-on-Modules from congatec provide native support for real-time Hypervisor technology from Real-Time Systems. This enables to consolidate various functions that previously required separated system on one single system. This optimizes cost due to reduced system count as well as application reliability as less systems result in a higher Mean Time Between Failures (MTBF).  

Furthermore, with its latest revision 1.15, the COM-HPC standard is now also prepared for applications requiring functional safety (FuSa). This simplifies the development of applications such as industrial real-time machine controls, train and wayside controls, collaborative robotics, autonomous vehicles, avionics, and other safety critical systems. With the Safe Hypervisor from Real-Time Systems system consolidation is now also possible for mission critical designs.  

COM-HPC Client in comparison to COM Express Type 6

 COM-HPC Client COM Express Type 6 (Spec 3.1)

120x95 mm (Size A) 
120x120 mm (Size B) 
120x160 mm (Size C) 

125x95 mm (basic) 
95x95 mm (compact) 

Construction height 20 mm z-height from top of carrier board with heatspreader (5 mm stack option) 18 mm z-height from top of carrier board with heatspreader (5 mm stack option) 
Max. power dissipation 251 Watt 137 Watt 
Signal pins 800440
PCIe lanes¹49x PCIe Gen 5 24x PCIe Gen 4 
Graphics¹3x DDI + 1x eDP 3x DDI + 1x LVDS/eDP / VGA 
Sound¹2x SoundWire + I2S + HDA HDA (1x SoundWire optional) 
Camera interface¹2x MIPI CSI 2x MIPI CSI via dedicated connectors on the module 
Ethernet¹2x 25 GbE KR + 2x BaseT (up to 10 Gb) 1x GbE 
USB¹4x USB 4.0 + 4x USB 2.0 4x USB 3.2 or 2x USB 4.0 multiplexed with 2x DDI  
+ 8x USB 2.0 
SATA¹2x SATA Gen 3 4x SATA Gen 3 
CAN bus¹-2
Other¹SMB, 2x I2C, IPMB LPC/eSPI 
FuSa¹Supported Not supported 

¹ Not all IOs are available in parallel, some pins are shared 

Complete ecosystem to simplify and accelerate new designs

Despite its young age, there is already a comprehensive COM-HPC Client ecosystem in place to accelerate and simplify designs based on this new standard. Besides a broad range of Computer-on-Modules, there is a PICMG carrier design guide, and congatec additionally offers matching evaluation and application carrier boards, advanced cooling solutions, as well design-in trainings to support its customers in the best possible way. 

Our range of COM-HPC Client Computer-on-Modules

More about conga-HPC/cRLS


Virtualization Ready
  • 13th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Performance-optimized design
  • Up to 24 cores
  • PCIe Gen 5
More about conga-HPC/cRLP


Virtualization Ready
  • 13th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 5
More about conga-HPC/cTLH


Virtualization Ready
  • 11th Generation Intel® Core™
  • Intel® Xe graphics engine
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4
More about conga-HPC/cTLU​


Virtualization Ready
  • 11th Generation Intel® Core™
  • Power- and size-optimized design
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4

COM-HPC Client carrier boards

More about conga-HPC/uATX-Client


  • Application carrier board for sizes A, B, C
  • µATX form factor
  • Application-ready layout
  • Supports all defined COM-HPC Client I/Os
More about conga-HPC/EVAL-Client


  • Evaluation carrier board for sizes A, B, C
  • 5x PCIe connectors for 48 lanes
  • 2x MIPI Camera Serial Interface
  • KR connector to connect LAN mezzanine cards

COM-HPC Client Videos

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COM-HPC™ is the new and coming PICMG standard for high-performance Computer-on-Modules. The pinout and therefore also the functionality were recently officially approved. Elektronik is revealing further- details.

Download Whitepaper

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COM-HPC carrier board designs

COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?

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