Our COM Express Type 7 Server-on-Module ecosystem targets enhanced micro servers and other server-like applications that permit only low power consumption but require high computing performance and communication throughput. We also provide passive cooling solutions for designs with up to 100 W heat dissipation to simplify the design-in of these ultra-powerful COM Express modules. For embedded server applications requiring more than 4x10 GbE and 32x PCIe lanes, designers should also check out our COM-HPC Server ecosystem.
Details about the COM Express Type 7 Specification
There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
conga-B7XI
- Intel® Xeon® D1700 processors
- Up to 10 cores
- Up to 128 GB RAM
- Extended temperature options
- Up to 4x 10 GbE supporting CEI/KR/SFI
conga-bID7
- Intel® Xeon® D-1700 / D-1800 processor family
- Quad 10 GbE interfaces
- High-speed connectivity
- Up to 1 TByte NVMe SSD onboard
- Industrial grade versions
conga-B7E3
- AMD EPYC™ Embedded 3000 Series
- Up to 16 cores
- Up to 96 GB RAM
- Extended temperature options
- 4x 10 GbE with KR interface support
conga-X7EVAL
- Evaluation carrier board for COM Express Type 7
- 4x PCIe slots for 32 lanes
- 4x 10 Gigabit Ethernet SFP+
- BMC with VGA, iKVM, virtual storage
- Extended temperature options
conga-Eval Carrier T7 Gen2
- COM Express® Rev. 3.0 and 3.1 Pin-out Type 7
- 4x 10GbE support
- 32x PCIe lanes: 1x PCIe Gen4 x16, 1x PCIe Gen3 x8, 2x PCIe Gen3 x4
- SFP+, 10GBASE-KR or 10GBASE-T support via adapter cards
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