Our COM Express Type 7 Server-on-Module ecosystem targets enhanced micro servers and other server-like applications that permit only low power consumption but require high computing performance and communication throughput. We also provide passive cooling solutions for designs with up to 100 W heat dissipation to simplify the design-in of these ultra-powerful COM Express modules. For embedded server applications requiring more than 4x10 GbE and 32x PCIe lanes, designers should also check out our COM-HPC Server ecosystem.
Details zur COM Express Spezifikation
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conga-B7XI
- Intel® Xeon® D1700 processors
- Up to 10 cores
- Up to 128 GB RAM
- Extended temperature options
- Up to 4x 10 GbE supporting CEI/KR/SFI
conga-B7E3
- AMD EPYC™ Embedded 3000 Series
- Up to 16 cores
- Up to 96 GB RAM
- Extended temperature options
- 4x 10 GbE with KR interface support
conga-B7AC
- Intel Atom® C3000 processor family
- Up to 16 cores
- Extended temperature options
- Power-optimized design
- 4x 10 GbE with KR interface support
conga-B7XD
- Intel® Xeon® D1500 and Intel® Pentium® processors
- Up to 16 cores
- Up to 96 GB RAM
- Optional ECC support
- 2x 10 GbE with KR interface support
conga-X7EVAL
- Evaluation carrier board for COM Express Type 7
- 4x PCIe slots for 32 lanes
- 4x 10 Gigabit Ethernet SFP+
- BMC with VGA, iKVM, virtual storage
- Extended temperature options
