COM Express Type 6 Ecosystem

L’écosystème haute performance le plus abouti pour les designs modulaires

Notre écosystème COM Express Type 6 est le choix idéal pour toute la gamme des embedded computing applications. Avec deux formats disponibles, il fournit aux concepteurs tout ce dont ils ont besoin pour créer aussi bien des PLCs puissants, des HMIs et des systèmes shop-floor que des systèmes de digital signage haut de gamme ou des équipements médicaux haute performance. Pour les applications nécessitant plus de performance et de bande passante que ce que COM Express peut offrir, les développeurs devraient également évaluer notre écosystème COM-HPC Client haute performance.

Details about the COM Express Specification

Products

conga-TC300

  • Intel® Core™ Series 3 processors
  • Up to 6 CPU cores
  • Optional integrated NPU with up to 18 TOPS
  • Up to 64 GB DDR5 memory

conga-TCRP1

  • AMD Zen5/5c CPU Cores
  • AMD Radeon™ RDNA™ 3.5 Graphics
  • AMD XDNA™ 2 NPU
  • TDP Range from 15W to 54W
  • Onboard NVMe™ SSD (option)

conga-TC1000r

  • Intel® Core™ Ultra processors (Series 3)
  • Up to 16 cores and 22 threads
  • Intel® Arc™ Graphics Xᵉ3 up to 192 EU
  • Integrated NPU with 50 TOPS, 180 TOPS total platform performance
  • LPDDR5x memory with up to 96 GB RAM system capacity

conga-TC1000

  • Intel® Core™ Ultra processors (Series 3)
  • Up to 16 cores and 22 threads
  • Intel® Arc™ Graphics Xᵉ3 up to 192 EU
  • Integrated NPU with 50 TOPS, 180 TOPS total platform performance
  • Up to 128 GB DDR5 SODIMM

conga-TC750

  • Intel® Core™ Ultra processors
  • Intel® Arc™ Graphics with up to 128 EUs
  • Up to 99 TOPS Edge AI performance
  • Up to 128 GB RAM with in-band ECC
  • Up to 16 cores / 22 threads
  • PCIe Gen 4 & USB 4

conga-TCR8

  • AMD Ryzen Embedded 8000
  • Up to 8 Zen 4 cores
  • AMD Radeon™ RDNA™ 3 Graphics
  • AMD XDNA™ NPU
  • Up to 96 GB RAM (optional with ECC)
  • TDP Range from 15W to 54W
  • Onboard NVMe™ SSD (option)

conga-cWL6

  • 8th Generation Intel® Core™ / Celeron® Processors
  • Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
  • Industrial grade versions

conga-bRP6

  • 13th Generation Intel® Core™ Processors
  • Up to 64 GByte DDR5 memory
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-cAL6

  • Intel Atom® E3900
  • Low-power - performance/watt optimized form factor solution
  • Up to 8 GByte DDR3L 1600/1866 Memory (2x SODIMM socket)
  • 4x USB 3.0/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
  • Industrial grade temperature

conga-TC700

  • Intel® Core™ Ultra processors
  • Up to 16 cores
  • Up to 96 GB DDR5 with in-band ECC
  • Built-in Intel® Arc™ GPU
  • Integrated Intel® AI Boost NPU

conga-TC675r

  • 13th Generation Intel® Core™
  • Soldered memory
  • Extended temperature range options
  • Up to 14 cores
  • PCIe Gen 4

conga-TC675

  • 13th Generation Intel® Core™
  • Intel® Performance Hybrid Architecture
  • Extended temperature range options
  • Up to 14 cores
  • PCIe Gen 4

conga-cRP6

  • 13th Generation Intel® Core™ Processors
  • Up to 64 GByte LPDDR5 memory down
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-TS570

  • 11th Generation Intel® Core™
  • Performance-optimized design
  • Up to 8 cores
  • Extended temperature range options
  • PCIe Gen 4

conga-TC570r

  • 11th Generation Intel® Core™
  • Extremely rugged with soldered memory
  • Extended temperature range options
  • IEC-60068 certified
  • PCIe Gen 4

conga-TCV2

  • AMD Embedded Ryzen V2000 processor series
  • High-performance Zen 2 CPU & VEGA GPU
  • Superior cost/performance ratio
  • Up to 8 cores
  • Wide TDP range from 10-54 W

conga-TCA7

  • Intel Atom® x6000E, Intel® Pentium® and Celeron®
  • Cost- and power-optimized design
  • Up to 4 cores
  • Extended temperature range options
  • Supports TSN and TCC

conga-cAS6

  • Intel Atom® x7000E / x7000RE
  • Up to 16 GByte DDR5-4800 memory with in-band ECC
  • Up to 2.5 Gb Ethernet with TSN support
  • Up to four independent display interfaces
  • Industrial grade versions

conga-bTL6

  • 11th Generation Intel® Core™ / Xeon® Processors
  • Up to 128 GByte DDR4 memory
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-cEL6

  • Intel Atom® x6000E, Pentium® and Celeron® Series
  • Low-power – performance/watt
  • Up to 32 GByte DDR4-3200 memory
  • Triple display support
  • Up to 2.5 Gb Ethernet with TSN support

conga-TC570

  • 11th Generation Intel® Core™
  • Compact design
  • Up to 4 cores
  • Extended temperature range options
  • PCIe Gen 4

conga-cTL6

  • 11th Generation Intel® Core™/Celeron® Processors
  • Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-TC370

  • 8th Generation Intel® Core™ SOC processor
  • Up to 4 cores at low-power TDP of 15W
  • New Intel® Gen 9 HD Graphics
  • Optional eMMC 5.1 on board mass storage
  • COM Express Compact Type 6 module 95x95 mm²

conga-bCL6

  • Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
  • Up to 128 GByte DDR4 non-ECC/ECC memory
  • Optional NVMe SSD onboard
  • Industrial grade versions

conga-TS370

  • 8th Generation Intel® Core™ and Xeon®
  • Performance-optimized design
  • Up to 6 cores
  • Supports USB 3.1 Gen 2 (10 Gbit/s)
  • Up to 64 GB ECC memory

conga-TR4

  • AMD Embedded Ryzen V1000 processor series
  • High-performance Vega GPU
  • Supports up to 4x 4k
  • Up to 4 cores
  • Wide TDP range down to 12 W

conga-TCA5

  • Intel Atom® x7-E, Intel® Pentium® and Celeron®
  • Size-optimized design
  • Low power consumption (12 W)
  • Up to 4 cores
  • Extended temperature range options

conga-TEVAL3/COMe3.1

  • Evaluation Carrier for COMe Type 6 modules
  • Supports COMe Compact and Basic modules using connector Pinout Type 6
  • Compliant to latest COMe Spec Rev. 3.1

conga-TEVAL/COMe 3.0

  • Evaluation carrier board for COM Express Type 6
  • 6x PCIe card slots for 25 lanes
  • Supports 4x USB 3.1 Type A
  • Compact size (294x244 mm)
  • Schematics available on project basis

conga-Eval Carrier2 T6

  • COM Express® Rev. 3.1, Pin-out Type 6
  • ATX Form Factor (305mm x 244mm)
  • 1x GbE support
  • 8x PCIe x1 + PEG x16

aReady.COM is congatec’s pre-validated and pre-configured platform that combines modular hardware and software building blocks to accelerate embedded development. It includes Computer-on-Modules, virtualization by Hypervisor, and pre-installed, licensed OS like ctrlX OS or Ubuntu Pro. Whether for edge computing or IIoT, aReady.COM simplifies integration, enhances security, and shortens time to market.


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