COM Express Type 6 Ecosystem

L’écosystème haute performance le plus abouti pour les designs modulaires

Notre écosystème COM Express Type 6 est le choix idéal pour toute la gamme des embedded computing applications. Avec deux formats disponibles, il fournit aux concepteurs tout ce dont ils ont besoin pour créer aussi bien des PLCs puissants, des HMIs et des systèmes shop-floor que des systèmes de digital signage haut de gamme ou des équipements médicaux haute performance.
Pour les applications nécessitant plus de performance et de bande passante que ce que COM Express peut offrir, les développeurs devraient également évaluer notre écosystème COM-HPC Client haute performance.

Details about the COM Express Specification

 

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    conga-TC1000r

    • Intel® performance hybrid architecture with up to 16 cores
    • Intel® Arc™ Graphics or Intel Graphics
    • Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
    • LPCAMM2 LPDDR5 memory with up to 96 GB RAM system capacity 
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    conga-TC1000

    • Up to 16 cores and 22 threads
    • Intel® Arc™ Graphics Xᵉ3 up to 192 EU
    • Integrated NPU with 50 TOPS, 180 TOPS total platform performance
    • Up to 128 GB DDR5 SODIMM
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    conga-TC750

    •  Intel® Core™ Ultra processors
    • Intel® Arc™ Graphics with up to 128 EUs
    • Up to 99 TOPS Edge AI performance
    • Up to 128 GB RAM with in-band ECC
    • Up to 16 cores / 22 threads
    • PCIe Gen 4 & USB 4
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    conga-TCR8

    • AMD Ryzen Embedded 8000
    • Up to 8 Zen 4 cores
    • AMD Radeon™ RDNA™ 3 Graphics
    • AMD XDNA™ NPU
    • Up to 96 GB RAM (optional with ECC)
    • TDP Range from 15W to 54W
    • Onboard NVMe™ SSD (option)
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    conga-bRP6

    • 13th Generation Intel® Core™ Processors
    • Up to 64 GByte DDR5 memory
    • Up to 2.5 Gb Ethernet with TSN support
    • Optional NVMe SSD onboard
    • Industrial grade versions
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    conga-cRP6

    • 13th Generation Intel® Core™ Processors
    • Up to 64 GByte LPDDR5 memory down
    • Up to 2.5 Gb Ethernet with TSN support
    • Optional NVMe SSD onboard
    • Industrial grade versions
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    conga-TCV2

    • AMD Embedded Ryzen V2000 processor series
    • High-performance Zen 2 CPU & VEGA GPU
    • Superior cost/performance ratio
    • Up to 8 cores
    • Wide TDP range from 10-54 W
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    conga-cAS6

    • Intel Atom® x7000E / x7000RE
    • Up to 16 GByte DDR5-4800 memory with in-band ECC
    • Up to 2.5 Gb Ethernet with TSN support
    • Up to four independent display interfaces
    • Industrial grade versions
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    conga-TCA7

    • Intel Atom® x6000E, Intel® Pentium® and Celeron®
    • Cost- and power-optimized design
    • Up to 4 cores
    • Extended temperature range options
    • Supports TSN and TCC
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    conga-cEL6

    • Intel Atom® x6000E, Pentium® and Celeron® Series
    • Low-power – performance/watt
    • Up to 32 GByte DDR4-3200 memory
    • Triple display support
    • Up to 2.5 Gb Ethernet with TSN support
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    conga-bTL6

    • 11th Generation Intel® Core™ / Xeon® Processors
    • Up to 128 GByte DDR4 memory
    • Up to 2.5 Gb Ethernet with TSN support
    • Optional NVMe SSD onboard
    • Industrial grade versions
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    conga-cTL6

    • 11th Generation Intel® Core™/Celeron® Processors
    • Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
    • Up to 2.5 Gb Ethernet with TSN support
    • Optional NVMe SSD onboard
    • Industrial grade versions
    More about conga-TC370

    conga-TC370

    • 8th Generation Intel® Core™ SOC processor
    • Up to 4 cores at low-power TDP of 15W
    • New Intel® Gen 9 HD Graphics
    • Optional eMMC 5.1 on board mass storage
    • COM Express Compact Type 6 module 95x95 mm²
    More about conga-bCL6

    conga-bCL6

    • Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
    • Up to 128 GByte DDR4 non-ECC/ECC memory
    • Optional NVMe SSD onboard
    • Industrial grade versions
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    conga-TS370

    • 8th Generation Intel® Core™ and Xeon®
    • Performance-optimized design
    • Up to 6 cores
    • Supports USB 3.1 Gen 2 (10 Gbit/s)
    • Up to 64 GB ECC memory
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    conga-TR4

    • AMD Embedded Ryzen V1000 processor series
    • High-performance Vega GPU
    • Supports up to 4x 4k
    • Up to 4 cores
    • Wide TDP range down to 12 W
    More about conga-TS175

    conga-TS175

    • 7th Generation Intel® Core™ and Xeon®
    • Performance-optimized design
    • Up to 4 cores
    • Up to 32 GB DDR4
    • ECC support
    More about conga-TC175

    conga-TC175

    • 7th Generation Intel® Core™ and Celeron®
    • Size-optimized design
    • Low configurable power consumption (cTDP 7.5 W)
    • Up to 2 cores
    • Up to 32 GB DDR4 memory
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    conga-TCA5

    • Intel Atom® x7-E, Intel® Pentium® and Celeron®
    • Size-optimized design
    • Low power consumption (12 W)
    • Up to 4 cores
    • Extended temperature range options
    More about conga-TS170

    conga-TS170

    • 6th Generation Intel® Core™ and Xeon®
    • Performance-optimized design
    • Up to 4 cores
    • Up to 32 GB DDR4
    • ECC support for Intel® Xeon®
    More about conga-TC170

    conga-TC170

    • 6th Generation Intel® Core™ and Celeron®
    • Size-optimized design
    • Low power consumption (TDP 15 W)
    • Up to 2 cores
    • Up to 32 GB DDR4 memory
    More about conga-TEVAL3/COMe3.1

    conga-TEVAL3/COMe3.1

    • Evaluation Carrier for COMe Type 6 modules
    • Supports COMe Compact and Basic modules using connector Pinout Type 6
    • Compliant to latest COMe Spec Rev. 3.1
    More about conga-TEVAL/COMe 3.0

    conga-TEVAL/COMe 3.0

    • Evaluation carrier board for COM Express Type 6
    • 6x PCIe card slots for 25 lanes
    • Supports 4x USB 3.1 Type A
    • Compact size (294x244 mm)
    • Schematics available on project basis
    More about conga-Eval Carrier2 T6

    conga-Eval Carrier2 T6

    • COM Express® Rev. 3.1, Pin-out Type 6
    • ATX Form Factor (305mm x 244mm)
    • 1x GbE support
    • 8x PCIe x1 + PEG x16
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