COM Express Type 6 Ecosystem

L’écosystème haute performance le plus abouti pour les designs modulaires

Notre écosystème COM Express Type 6 est le choix idéal pour toute la gamme des embedded computing applications. Avec deux formats disponibles, il fournit aux concepteurs tout ce dont ils ont besoin pour créer aussi bien des PLCs puissants, des HMIs et des systèmes shop-floor que des systèmes de digital signage haut de gamme ou des équipements médicaux haute performance.
Pour les applications nécessitant plus de performance et de bande passante que ce que COM Express peut offrir, les développeurs devraient également évaluer notre écosystème COM-HPC Client haute performance.

Details about the COM Express Specification

 

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    More about conga-TC750

    conga-TC750

    • Intel® Arc™ Graphics with up to 128 EUs
    • Up to 99 TOPS Edge AI performance
    • Up to 128 GB RAM with in-band ECC
    • Up to 16 cores / 22 threads
    • PCIe Gen 4 & USB 4
    More about conga-TCR8

    conga-TCR8

    • Up to 8 Zen 4 cores
    • AMD Radeon™ RDNA™ 3 Graphics
    • AMD XDNA™ NPU
    • Up to 96 GB RAM (optional with ECC)
    • TDP Range from 15W to 54W
    • Onboard NVMe™ SSD (option)
    More about conga-TCV2

    conga-TCV2

    • AMD Embedded Ryzen V2000 processor series
    • High-performance Zen 2 CPU & VEGA GPU
    • Superior cost/performance ratio
    • Up to 8 cores
    • Wide TDP range from 10-54 W
    More about conga-TCA7

    conga-TCA7

    • Intel Atom® x6000E, Intel® Pentium® and Celeron®
    • Cost- and power-optimized design
    • Up to 4 cores
    • Extended temperature range options
    • Supports TSN and TCC
    More about conga-TC370

    conga-TC370

    • 8th Generation Intel® Core™ SOC processor
    • Up to 4 cores at low-power TDP of 15W
    • New Intel® Gen 9 HD Graphics
    • Optional eMMC 5.1 on board mass storage
    • COM Express Compact Type 6 module 95x95 mm²
    More about conga-TS370

    conga-TS370

    • 8th Generation Intel® Core™ and Xeon®
    • Performance-optimized design
    • Up to 6 cores
    • Supports USB 3.1 Gen 2 (10 Gbit/s)
    • Up to 64 GB ECC memory
    More about conga-TR4

    conga-TR4

    • AMD Embedded Ryzen V1000 processor series
    • High-performance Vega GPU
    • Supports up to 4x 4k
    • Up to 4 cores
    • Wide TDP range down to 12 W
    More about conga-TS175

    conga-TS175

    • 7th Generation Intel® Core™ and Xeon®
    • Performance-optimized design
    • Up to 4 cores
    • Up to 32 GB DDR4
    • ECC support
    More about conga-TC175

    conga-TC175

    • 7th Generation Intel® Core™ and Celeron®
    • Size-optimized design
    • Low configurable power consumption (cTDP 7.5 W)
    • Up to 2 cores
    • Up to 32 GB DDR4 memory
    More about conga-TCA5

    conga-TCA5

    • Intel Atom® x7-E, Intel® Pentium® and Celeron®
    • Size-optimized design
    • Low power consumption (12 W)
    • Up to 4 cores
    • Extended temperature range options
    More about conga-TS170

    conga-TS170

    • 6th Generation Intel® Core™ and Xeon®
    • Performance-optimized design
    • Up to 4 cores
    • Up to 32 GB DDR4
    • ECC support for Intel® Xeon®
    More about conga-TC170

    conga-TC170

    • 6th Generation Intel® Core™ and Celeron®
    • Size-optimized design
    • Low power consumption (TDP 15 W)
    • Up to 2 cores
    • Up to 32 GB DDR4 memory
    More about conga-TEVAL3/COMe3.1

    conga-TEVAL3/COMe3.1

    • Evaluation Carrier for COMe Type 6 modules
    • Supports COMe Compact and Basic modules using connector Pinout Type 6
    • Compliant to latest COMe Spec Rev. 3.1
    More about conga-TEVAL/COMe 3.0

    conga-TEVAL/COMe 3.0

    • Evaluation carrier board for COM Express Type 6
    • 6x PCIe card slots for 25 lanes
    • Supports 4x USB 3.1 Type A
    • Compact size (294x244 mm)
    • Schematics available on project basis
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