Long-term available Computer-on-Modules for cost-sensitive deeply embedded designs

Qseven - the Mobile COM Definition

The Qseven specification is hosted by the Standardization Group for Embedded Technologies - SGET. Find the latest Qseven specification here: https://www.sget.org/standards/qseven.html

Targeting next generation ultra mobile embedded processors built using latest mobile chip technologies, the Qseven® format complements the low power and small size of these processors. By exploiting the small form factor of the industry’s latest processors, the Qseven® format offers high performance computing power, delivered in a module measuring only 70 x 70 mm² or 40x70 mm².


Qseven® allows for the use of non x86 processor architectures. It also supports the low power mobile ARM processor architecture. Customers have the freedom to use all kinds of Qseven® modules without the need to change the carrier board.

Mobile Applications

Qseven® is an optimized standard targeting towards low power and mobile / ultra-mobile applications.

Low Power

Qseven® is defined for a maximum power consumption of 12 Watts. It is designed to be operated by single 5 Volt DC power and provides all additional signals for battery management. This simple power requirement allows for small mobile solutions powered by compact two cell batteries.


Qseven® does not require an expensive board-to-board connector. Instead, it utilizes a very affordable MXM2 card slot with 230 pins in a 0.5 mm configuration.

Legacy Free

Qseven® is a legacy free standard focused on high speed serial interfaces such as PCI Express® and Serial ATA. Qseven® omits support for legacy interfaces like EIDE and PCI, in order to provide ideal support for today‘s, as well as future, mobile CPUs and chipsets.

Compact Size

The module‘s dimensions are a mere 70 x 70 mm². This means it can be easily integrated into size constricted systems. The even smaller μQseven definition is 40x70mm² only but is limited to support ultra-low power CPUs only.

Slim Design

When comparing to COM Express® Basic & Compact and SMARC, Qseven® enables slimmer mechanical housings.

SGeT e.V.

The Qseven® Specification is hosted by the SGeT standardization group founded in 2012. congatec is founding member, board member and Qseven® development team member of the SGeT.


The Specification will be hosted by the  "Standardization Group for Embedded Technologies" SGET: www.sget.org

Latest Specification:

Rev. 2.1

Qseven Design Guide:

Rev. 2.0




Our latest Qseven modules

More about conga-QA7


Virtualization Ready
  • Intel Atom® x6000E, Intel® Pentium® or Celeron® J
  • 8 variants for broad scalability
  • GbE with TSN and TCC support
  • Up to 16 GB LPDDR4x
  • Industrial temperature support
More about conga-QA5


  • Intel Atom® x7 Intel® Pentium® or Celeron® J
  • 6 variants for broad scalability
  • GbE with TSN and TCC support
  • Up to 8 GB LPDDR4
  • Industrial temperature support


More information about congatec Qseven modules

i.MX 8X on SMARC 2.0 and Qseven modules from congatec

The 8X version of the NXP i.MX 8 processor has an extremely low power consumption, is robust and comes with many functional safety features. congatec now supports it on the SMARC 2.0 and Qseven module standards.

Download Whitepaper