COM-HPC-Client-Ecosystem
High-Performance Computing für anspruchsvolle Edge-, Embedded- und AI-Anwendungen
Unser COM-HPC Client Ecosystem bietet skalierbare Rechen- und Grafikleistung für anspruchsvolle Edge- und Embedded-Anwendungen. Mit schnellen Schnittstellen, vielseitiger Konnektivität, Multi-Display-Unterstützung und AI-Beschleunigung schafft es die Grundlage für moderne Industrieautomation, Embedded Vision, Robotik, medizinische Bildverarbeitung und weitere rechenintensive Anwendungen.
- AMD Ryzen™ AI Embedded X100
- TDP Range from 45W to 120W
- NPU with 50 TOPS
- Up to 128 GB LPDDR5x
- Industrial Temp. Range
- Intel® performance hybrid design with up to 16 cores
- Onboard LPDDR5x with in-band ECC on selected product variants
- Integrated NPU for dedicated AI acceleration
- Up to PCI Express Gen5
- Product variants based on Intel® hybrid design and Intel® P-core only
- Up to Intel® UHD Graphics 770 driven by Xe Architecture
- PCI Express Gen 4 and 5 | USB 3.2 Gen 2x2
- AI Acceleration based on Intel® Deep Learning Boost (VNNI)
- 13th/14th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/EVAL-Client
- Evaluation carrier board for sizes A, B, C
- 5x PCIe connectors for 48 lanes
- 2x MIPI Camera Serial Interface
- KR connector to connect LAN mezzanine cards
conga-HPC/uATX-Client
- Application carrier board for sizes A, B, C
- µATX form factor
- Application-ready layout
- Supports all defined COM-HPC Client I/Os
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