Designed for high-performance embedded and edge computing applications, our performance-class modules integrate latest multicore CPUs as well as GPUs for immersive graphics and/or accelerating AI inference workloads. They offer extremely high scalability for applications ranging from powerful PLCs, HMIs and shop-floor systems to immersive digital signage systems and high-performance medical equipment.
COM-HPC Client
Is ideal for next-generation high-end embedded and edge computing applications
conga-HPC/cBLS
- 13th/14th Gen Intel® Core™ processors
- Hybrid design with P-cores & E-cores
- Intel® UHD Graphics 770
- PCIe Gen 4/5 & USB 3.2 Gen 2
- AI acceleration with Intel® VNNI
conga-HPC/cRLS
- 13th/14th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
conga-HPC/cRLP
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
conga-HPC/cTLH
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
COM-HPC Mini
Offers extraordinary performance and I/O density for space- and power-restricted applications
conga-HPC/mRLP
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
COM Express Type 6
Is the most elaborated high-performance ecosystem for the entire range of embedded computing applications
conga-TCR8
- Up to 8 Zen 4 cores
- AMD Radeon™ RDNA™ 3 Graphics
- AMD XDNA™ NPU
- Up to 96 GB RAM (optional with ECC)
- TDP Range from 15W to 54W
- Onboard NVMe™ SSD (option)
conga-TC700
- Intel® Core™ Ultra processors
- Up to 16 cores
- Up to 96 GB DDR5 with in-band ECC
- Built-in Intel® Arc™ GPU
- Integrated Intel® AI Boost NPU
conga-TC675r
- 13th Generation Intel® Core™
- Soldered memory
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
conga-TC675
- 13th Generation Intel® Core™
- Intel® Performance Hybrid Architecture
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
conga-TS570
- 11th Generation Intel® Core™
- Performance-optimized design
- Up to 8 cores
- Extended temperature range options
- PCIe Gen 4
conga-TCV2
- AMD Embedded Ryzen V2000 processor series
- High-performance Zen 2 CPU & VEGA GPU
- Superior cost/performance ratio
- Up to 8 cores
- Wide TDP range from 10-54 W
