11th Gen Intel® Core™ processors

Two great new design options on
COM-HPC and COM Express

首款COM-HPC和新一代COM Express 模块

基于英特尔®11代酷睿处理器(代号: Tiger Lake)两款全新设计选择: COM-HPCCOM Express

首款COM-HPC 客户端系列A尺寸的模块以及新一代COM Express紧凑型计算机模块使工程师们有机会进一步提高现有系统的性能,或利用COM-HPC的各类接口开发下一代产品。基于英特尔®第11代酷睿™处理器的新模块大大提升了高端嵌入式计算性能和通信功能,使原始设备制造商(OEM)受益。高端解决方案中有各种典型应用,包括嵌入式系统、边缘计算节点、网络集线器、本地fog数据中心及核心网络设备,以及用于政府关键应用的加固中央云数据中心。

 


块详情


 

Videos

conga-TC570r - New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM


 

Learn more about our 11th Gen Intel Core based Computer-on-Modules

Everything you need to know about COMs

Computer-on-Modules (COMs) power everything from robotics and medical devices to edge computing and smart mobility. But what makes them so versatile? And which standard is right for your needs? Explore the answers in our comprehensive guide to COMs.

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COM Express Type 6 and COM-HPC Client

It’s a new era for high-end embedded processors that are now available on two COM form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.
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Rugged Computer-on-Modules

congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.

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第11代英特尔酷睿解决方案

康佳特conga-TS570 COM Express Type 6和conga-HPC/cTLH COM-HPC Client模块基于第11代英特尔®酷睿™处理器,为新时代的边缘计算应用提供近乎实时的性能、可拓展性、安全性和容错性

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