conga-Eval Carrier3 T10 COMExpress® Evaluation Carrier Type 10 Gen3 COMExpress® Rev. 3.1, Pin-out Type 10 ATX Form Factor (305mm x 244mm) 4x PCIe [...] Full support for Type 10…
conga-TEVAL3/COMe3.1 COMExpress Type 6 Rev. 3.1 Evaluation Carrier Board Evaluation Carrier for COMe Type 6 modules Supports COMe Compact and [...] 3.1 Specification BOARD TYPE…
DVI-D 小尺寸 支持双DVI-D系统 Specification 转换LVDS到DVI-D的轉接卡,可用于XTX™, COMExpress™ 或 Qseven™ 模块.透过这转接卡可实现一个双通道DVI-D集成,而不需依赖传统的图像输出信道(SDVO or DVO). Documents All documents found on this page…
card to evaluate the DDI interface on the congatec Qseven or COMExpress modules. Documents All documents found on this page are updated without notification. Always check this…
PCI Express Gen 4 | USB 4 Industrial Temperature Range -40°C to +85°C Press Release Specification Formfactor COM-HPC CPU Qualcomm [...] for COM-HPC module conga-HPC/mIQX. All…
conga-HPC/sILL COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake") Learn all about COMs - download [...] efficiently. COM-HPC Intel Xeon D…
efficiently. COM-HPC Intel Xeon D Solution Brief Three new computer-on-modules for high performance computing (COM-HPC) products from [...] RAM Add-On Cards conga-HPC/LEK-C827-IM…
conga-HPC/cPTL COM-HPC Client Size A high performance module based on Intel® Core™ Ultra Processors Series 3 (Panther Lake-H) Learn all [...] Integrated NPU for dedicated AI…
with FlexCAN) USB 2.0 1 x eSPI 1 x SPI I²C bus 1 x PCI Express™ 3.0 lanes 1 x SDIO 3.0 1 x USB 3.0 optional M.2 1216 WiFi module (soldered down) Graphics Integrated in NXP i.MX8-X…
