COM Express – Computer-on-Module Standard

COM Express – Computer-on-Module Standard

Simplify embedded development with a proven industry standard

Discover the COM Express standard with scalable performance, standardized interfaces, and flexible form factors for embedded and edge computing applications.

COM Express

COM Express® 是由 PICMG® 联盟制定的广泛应用的计算机模块(Computer-on-Module,COM)标准。该标准定义了统一的模块尺寸、引脚定义和接口规范,为嵌入式计算和边缘计算应用提供灵活且可扩展的技术基础。当前的 COM Express 3.1 版本支持 PCI Express® Gen 4、SATA Gen 3 等现代高速接口,Type 6 模块还可选支持 USB4。Type 6 适用于对图形处理性能要求较高的应用,Type 7 专为无显示输出(Headless)的嵌入式服务器和网络系统而设计,Type 10 则面向紧凑型、低功耗系统。COM Express 能够满足广泛的工业应用需求。

Interfaces

COM Express connects modules and carrier boards through standardized connectors with up to 440 pins. Revision 3.1 supports PCIe Gen 4 and, depending on the pinout, interfaces such as USB4, SATA and digital displays.

Server-on-Module

COM Express Type 7 is designed for headless server and networking applications, supporting up to four 10GbE interfaces and 32 PCIe lanes.

Customization

Standardized COM Express modules combine with application-specific carrier boards, allowing developers to integrate custom I/O and system functions.

Form Factors

Four standardized sizes are defined: Mini (84 × 55 mm), Compact (95 × 95 mm), Basic (125 × 95 mm) and Extended (155 × 110 mm).

GPIO

COM Express provides eight general-purpose input/output signals for application-specific control and system integration.

Thermal Design

Thermal interfaces and cooling solutions are adapted to the module's power requirements and the application's operating conditions.

PCI Express

COM Express Rev. 3.1 supports PCIe Gen 4 with signaling rates up to 16 GT/s per lane. The available lane count depends on the module type.

Video Output

Type 6 supports multiple display interfaces, including digital display outputs and LVDS or eDP options. Type 7 is designed for headless operation without dedicated display outputs.

congatec

Our latest COM Express modules

  • 英特尔® 酷睿™ 3 系列处理器
  • 支持最多 6 个 CPU 核心
  • 可选配集成 NPU,最高可达 18 TOPS
  • 支持最高 64 GB DDR5 内存
  • Intel® Core™ Ultra processors (Series 3)
  • Up to 16 cores and 22 threads
  • Intel® Arc™ Graphics Xᵉ3 up to 192 EU
  • Integrated NPU with 50 TOPS, 180 TOPS total platform performance
  • LPDDR5x memory with up to 96 GB RAM system capacity
  • Intel® Core™ Ultra processors (Series 3)
  • Up to 16 cores and 22 threads
  • Intel® Arc™ Graphics Xᵉ3 up to 192 EU
  • Integrated NPU with 50 TOPS, 180 TOPS total platform performance
  • Up to 128 GB DDR5 SODIMM
  • Intel® performance hybrid architecture with up to 16 cores
  • Intel® Arc™ Graphics with up to 12 Xᵉ cores
  • Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
  • Up to 32GB LPDDR5x soldered down memory for maximum memory bandwidth

aReady.COM is congatec’s pre-validated and pre-configured platform that combines modular hardware and software building blocks to accelerate embedded development. It includes Computer-on-Modules, virtualization by Hypervisor, and pre-installed, licensed OS like ctrlX OS or Ubuntu Pro. Whether for edge computing or IIoT, aReady.COM simplifies integration, enhances security, and shortens time to market.


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