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conga-TFS (EOL)
AMD Embedded R-Series platform in COM Express Type 6 module featuring unprecedented graphics
- Power efficient high-performance x86 processing
- Unprecedented integrated graphics performance
- High performance parallel processing support
- End of Life
Specification
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Manual
Data Sheet
Image
Software
Product Variants
Ecosystem Details
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Cooling solutions
Standard active cooling solution for high performance COM Express module conga-TFS with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
Standard active cooling solution for high performance COM Express module conga-TFS with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-TFS with integrated vapor chamber. All standoffs are M2.5mm thread.
Standard heatspreader for high performance COM Express module conga-TFS with integrated vapor chamber. All standoffs are with 2.7mm bore hole.
Accessories
conga-TEVAL/COMe 2.1 (EOL)
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 2.1
conga-Cdebug (EOL)
COM Express® Debug Platform for Type 2 Modules and Carrier Boards
conga-LDVI
DVI Converter Module for LVDS