COM-HPC Client Ecosystem

Next-generation edge and embedded computing devices with unmatched features, performance, and graphics

Our COM-HPC Client ecosystem addresses high-end embedded and edge computing applications requiring high-performance graphics and/or accelerated AI inference workloads. Target applications can be found in all next-generation high-end embedded systems, including embedded vision for which it also offers two MIPI-CSI interfaces. 
 

Learn more about COM-HPC Client

 

Product Filter:

    Add Filter:

    There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
    If you don't find the configuration you require contact your congatec Sales representative for further assistance.
    More about conga-HPC/cRLS

    conga-HPC/cRLS

    Virtualization Ready
    • 13th Generation Intel® Core™
    • Intel® performance hybrid architecture
    • Performance-optimized design
    • Up to 24 cores
    • PCIe Gen 5
    More about conga-HPC/cRLP

    conga-HPC/cRLP

    Virtualization Ready
    • 13th Generation Intel® Core™
    • Intel® performance hybrid architecture
    • Rugged soldered processor
    • Industrial temperature support
    • PCIe Gen 5
    More about conga-HPC/cTLH

    conga-HPC/cTLH

    Virtualization Ready
    • 11th Generation Intel® Core™
    • Intel® Xe graphics engine
    • Rugged soldered processor
    • Industrial temperature support
    • PCIe Gen 4
    More about conga-HPC/cTLU​

    conga-HPC/cTLU​

    Virtualization Ready
    • 11th Generation Intel® Core™
    • Power- and size-optimized design
    • Rugged soldered processor
    • Industrial temperature support
    • PCIe Gen 4
    More about conga-HPC/EVAL-Client

    conga-HPC/EVAL-Client

    • Evaluation carrier board for sizes A, B, C
    • 5x PCIe connectors for 48 lanes
    • 2x MIPI Camera Serial Interface
    • KR connector to connect LAN mezzanine cards
    More about conga-HPC/uATX

    conga-HPC/uATX

    • Application carrier board for sizes A, B, C
    • µATX form factor
    • Application-ready layout
    • Supports all defined COM-HPC Client I/Os