COM-HPC Client Ecosystem
High-Performance Computing for Demanding Edge, Embedded, and AI Applications
Our COM-HPC Client ecosystem delivers scalable computing and graphics performance for demanding edge and embedded applications. With high-speed interfaces, extensive connectivity, multi-display support, and AI acceleration, it provides the foundation for advanced industrial automation, embedded vision, robotics, medical imaging, and other compute-intensive applications.
conga-HPC/cRX1
- AMD Ryzen™ AI Embedded X100
- TDP Range from 45W to 120W
- NPU with 50 TOPS
- Up to 128 GB LPDDR5x
- Industrial Temp. Range
conga-HPC/cPTL
- Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
- Up to 16 CPU cores
- Integrated NPU with up to 50 TOPS
- Up to 96 GB LPDDR5x memory
- Up to PCI Express Gen5
conga-HPC/cBLS
- 13th Gen Intel® Core™ 2xx series processors (Bartlett Lake-S)
- Up to 24 CPU cores
- AI acceleration with Intel® Deep Learning Boost (VNNI)
- Up to 192 GB DDR5 memory
- PCI Express Gen 5 and USB 3.2 Gen 2x2
conga-HPC/cRLS
- 13th/14th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
conga-HPC/cRLP
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
conga-HPC/cTLH
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/cTLU
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/EVAL-Client
- Evaluation carrier board for sizes A, B, C
- 5x PCIe connectors for 48 lanes
- 2x MIPI Camera Serial Interface
- KR connector to connect LAN mezzanine cards
conga-HPC/uATX-Client
- Application carrier board for sizes A, B, C
- µATX form factor
- Application-ready layout
- Supports all defined COM-HPC Client I/Os
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