Ecosystème client COM-HPC
Appareils edge et embedded de nouvelle génération avec des fonctionnalités, des performances et des capacités graphiques inégalées
Notre écosystème COM-HPC Client répond aux exigences des applications edge et embarquées haut de gamme nécessitant des performances graphiques élevées et/ou des charges de travail d’inférence IA accélérée. Les applications ciblées se trouvent dans tous les systèmes embarqués nouvelle génération haut de gamme, y compris la vision embarquée, pour laquelle il propose également deux interfaces MIPI-CSI.
- AMD Ryzen™ AI Embedded X100
- TDP Range from 45W to 120W
- NPU with 50 TOPS
- Up to 128 GB LPDDR5x
- Industrial Temp. Range
- Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
- Up to 16 CPU cores
- Integrated NPU with up to 50 TOPS
- Up to 96 GB LPDDR5x memory
- Up to PCI Express Gen5
- 13th Gen Intel® Core™ 2xx series processors (Bartlett Lake-S)
- Up to 24 CPU cores
- AI acceleration with Intel® Deep Learning Boost (VNNI)
- Up to 192 GB DDR5 memory
- PCI Express Gen 5 and USB 3.2 Gen 2x2
- 13th/14th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-HPC/EVAL-Client
- Evaluation carrier board for sizes A, B, C
- 5x PCIe connectors for 48 lanes
- 2x MIPI Camera Serial Interface
- KR connector to connect LAN mezzanine cards
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