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- AMD EPYC™ Embedded 3000 Series
- Up to 16 cores
- Up to 96 GB RAM
- Extended temperature options
- 4x 10 GbE with KR interface support
- Intel® Xeon® D1700 processors
- Up to 10 cores
- Up to 128 GB RAM
- Extended temperature options
- Up to 4x 10 GbE supporting CEI/KR/SFI
- Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
- Up to 128 GByte DDR4 non-ECC/ECC memory
- Optional NVMe SSD onboard
- Industrial grade versions
- Intel® Xeon® D-1700 / D-1800 processor family
- Quad 10 GbE interfaces
- High-speed connectivity
- Up to 1 TByte NVMe SSD onboard
- Industrial grade versions
- 13th Generation Intel® Core™ Processors
- Up to 64 GByte DDR5 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- 11th Generation Intel® Core™ / Xeon® Processors
- Up to 128 GByte DDR4 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- Intel Atom® E3900
- Low-power - performance/watt optimized form factor solution
- Up to 8 GByte DDR3L 1600/1866 Memory (2x SODIMM socket)
- 4x USB 3.0/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
- Industrial grade temperature
- Intel Atom® x7000E / x7000RE
- Up to 16 GByte DDR5-4800 memory with in-band ECC
- Up to 2.5 Gb Ethernet with TSN support
- Up to four independent display interfaces
- Industrial grade versions
- Intel Atom® x6000E, Pentium® and Celeron® Series
- Low-power – performance/watt
- Up to 32 GByte DDR4-3200 memory
- Triple display support
- Up to 2.5 Gb Ethernet with TSN support
- 13th Generation Intel® Core™ Processors
- Up to 64 GByte LPDDR5 memory down
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- 11th Generation Intel® Core™/Celeron® Processors
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
- 8th Generation Intel® Core™ / Celeron® Processors
- Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
- Industrial grade versions
conga-Eval Carrier Server
- Support of overall 65x PCIe lanes via various PCIe card connectors
- Support of overall 8x 10/25G Ethernet ports:
- 8x 10/25G Ethernet via integrated re-timer support to SFP28 cages
- 1x 10/1GBase-T interface
- 4x USB 3.1/0 Interface
- 2x SATA standard interfaces
- 13th Gen Intel® Core™ 2xx series processors (Bartlett Lake-S)
- Up to 24 CPU cores
- AI acceleration with Intel® Deep Learning Boost (VNNI)
- Up to 192 GB DDR5 memory
- PCI Express Gen 5 and USB 3.2 Gen 2x2
- Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
- Up to 16 CPU cores
- Integrated NPU with up to 50 TOPS
- Up to 96 GB LPDDR5x memory
- Up to PCI Express Gen5
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
- 13th/14th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
- AMD Ryzen™ AI Embedded X100
- TDP Range from 45W to 120W
- NPU with 50 TOPS
- Up to 128 GB LPDDR5x
- Industrial Temp. Range
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- Qualcomm® Dragonwing IQ-X processors
- Up to 12 Oryon™ CPU cores
- Hexagon™ NPU with 45 TOPS
- Up to 64 GB LPDDR5x
- Industrial Temp. Range
- Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
- Up to 16 CPU cores
- Integrated NPU with up to 50 TOPS
- Up to 96 GB LPDDR5x
- Industrial temperature range
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- 5th Generation Intel® Pentium®, Celeron® and Atom® processors
- Rugged design with soldered processor and memory
- Quadcore technology
- Up to 4k display support
- Extended temperature support
- Intel Atom®, Intel® Pentium® and Celeron®
- Rugged design with soldered processor and memory
- Real-time capable with TCC and TSN
- Inband ECC memory support
- Extended temperature support
- Intel® Atom® E3900, Pentium® and Celeron® Processor Series
- Low-power, watt-optimized small form factor solution
- Two variants: DDR3L + ECC or LPDDR4
- Strong graphics and real-time performance
- Compact, energy-efficient, long-term available
- Intel Atom® x7000E / x7000RE Series
- Low-Power – Performance/Watt optimized
- Up to 16 GByte LPDDR5 memory down (In-Band ECC)
- 1 GbE (optional 2.5 GbE) with TSN support
- Industrial grade temperature
- Intel® performance hybrid architecture with up to 16 cores
- Intel® Arc™ Graphics with up to 12 Xᵉ cores
- Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
- Up to 32GB LPDDR5x soldered down memory for maximum memory bandwidth
- Intel Atom® x6000E
- Low-Power – Performance/Watt optimized form factor solution
- Up to 16 GByte LPDDR4 memory down (In-Band ECC)
- 1GbE (optional 2.5GbE) with TSN support
- Industrial grade temperature
- 13th Generation Intel® Core™/Pentium® Processors
- Up to 32 GByte LPDDR5(x) memory down
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
conga-PA7
Pico-ITX SBC based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series
- Intel Atom® x7 Intel® Pentium® or Celeron® J
- 6 variants for broad scalability
- GbE with TSN and TCC support
- Up to 8 GB LPDDR4
- Industrial temperature support
- Intel Atom® x6000E, Intel® Pentium® or Celeron® J
- 8 variants for broad scalability
- GbE with TSN and TCC support
- Up to 16 GB LPDDR4x
- Industrial temperature support
conga-QMX6
- NXP i.MX6 application processor
- Up to quadcore Arm® Cortex®-A9
- 1x Arm Cortex®-M4F for real-time processing
- GC NanoUltra 3D graphics
- Industrial temperature support
- NXP i.MX 8M Plus processor
- Integrated Neural Processing Unit (NPU)
- Quadcore Arm® Cortex®-A53 / M7
- Up to 3 independent display outputs
- Industrial temperature support
- Intel Atom® x7 Intel® Pentium® or Celeron® J
- 6 variants for broad scalability
- GbE with TSN and TCC support
- Up to 8 GB LPDDR4
- Industrial temperature support
- Intel Atom® x6000E, Intel® Pentium® or Celeron® J
- 8 variants for broad scalability
- GbE with TSN and TCC support
- Up to 16 GB LPDDR4x
- Industrial temperature support
- Intel Atom x7000RE Series
- Up to 8 Cores
- Up to 16 GByte soldered LPDDR5
- Industrial temperature support
- Virtualization ready with Hypervisor
conga-sdIL
- Intel® Xeon® D-1700 / D-1800 processors
- Up to 10 cores
- Up to 64GB soldered RAM | ECC support
- Ext. temp. options
- 100 Gb max. Ethernet bandwidth
- NXP i.MX 8M Mini application processor
- Up to quadcore Arm® Cortex®-A35
- 1x Arm® Cortex®-M4F for real-time processing
- GC NanoUltra 3D graphics
- Industrial temperature support
- NXP i.MX 8M Plus application processor
- Integrated Neural Processing Unit (NPU)
- Quadcore Arm® Cortex®-A53 / M7
- Up to 3 independent display outputs
- Industrial temperature support
conga-SMX8-Plus embedded AI Vision Kit
congatec i.MX 8M Plus Vision Kit for AI and Machine Learning applications
- NXP MX8-X application processor
- Ultra-low power design (2-5 W)
- Up to quadcore Arm® Cortex®-A35
- 1x Arm® Cortex®-M4F for real-time processing
- Industrial temperature support
- NXP i.MX 95 processor series
- Up to 6-core ARM Cortex-A55
- NXP eIQ® Neutron NPU
- Advanced Security
- Industrial temperature support
- TI processor TDA4VM
- Dual Arm® Cortex®-A72
- Deep learning hardware accelerator
- Arm® Cortex®-R5F MCUs for real-time communication
- Industrial temperature support
- Latest Generation Intel Atom®, Pentium® and Celeron®
- Processor Series
- Up to 8 GByte LPDDR4 memory down
- Triple display support
- Intel Atom® x7000E, x7000RE Series
- Up to 16 GByte LPDDR5 memory down with inband ECC support
- Dual LVDS, HDMI, DP++
- 1x USB 3.2, 6x USB 2.0, eMMC onboard
- Industrial grade temperature
- Intel® Atom®, Pentium® and Celeron® processor series
- Up to 16 GByte LPDDR4 memory down with inband ECC support
- 2x USB 3.0, 4x USB 2.0, 1x SATA, eMMC onboard
- TSN support
- Industrial grade temperature
- Intel® Core™ Ultra processors (Series 3)
- Up to 16 cores and 22 threads
- Intel® Arc™ Graphics Xᵉ3 up to 192 EU
- Integrated NPU with 50 TOPS, 180 TOPS total platform performance
- Up to 128 GB DDR5 SODIMM
- Intel® Core™ Ultra processors (Series 3)
- Up to 16 cores and 22 threads
- Intel® Arc™ Graphics Xᵉ3 up to 192 EU
- Integrated NPU with 50 TOPS, 180 TOPS total platform performance
- LPDDR5x memory with up to 96 GB RAM system capacity
- Intel® Core™ Series 3 processors
- Up to 6 CPU cores
- Optional integrated NPU with up to 18 TOPS
- Up to 64 GB DDR5 memory
- 8th Generation Intel® Core™ SOC processor
- Up to 4 cores at low-power TDP of 15W
- New Intel® Gen 9 HD Graphics
- Optional eMMC 5.1 on board mass storage
- COM Express Compact Type 6 module 95x95 mm²
- 11th Generation Intel® Core™
- Compact design
- Up to 4 cores
- Extended temperature range options
- PCIe Gen 4
- 11th Generation Intel® Core™
- Extremely rugged with soldered memory
- Extended temperature range options
- IEC-60068 certified
- PCIe Gen 4
- 13th Generation Intel® Core™
- Intel® Performance Hybrid Architecture
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
- 13th Generation Intel® Core™
- Soldered memory
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
- Intel® Core™ Ultra processors
- Up to 16 cores
- Up to 96 GB DDR5 with in-band ECC
- Built-in Intel® Arc™ GPU
- Integrated Intel® AI Boost NPU
- Intel® Core™ Ultra processors
- Intel® Arc™ Graphics with up to 128 EUs
- Up to 99 TOPS Edge AI performance
- Up to 128 GB RAM with in-band ECC
- Up to 16 cores / 22 threads
- PCIe Gen 4 & USB 4
conga-TCA5
- Intel Atom® x7-E, Intel® Pentium® and Celeron®
- Size-optimized design
- Low power consumption (12 W)
- Up to 4 cores
- Extended temperature range options
- Intel Atom® x6000E, Intel® Pentium® and Celeron®
- Cost- and power-optimized design
- Up to 4 cores
- Extended temperature range options
- Supports TSN and TCC
- AMD Ryzen Embedded 8000
- Up to 8 Zen 4 cores
- AMD Radeon™ RDNA™ 3 Graphics
- AMD XDNA™ NPU
- Up to 96 GB RAM (optional with ECC)
- TDP Range from 15W to 54W
- Onboard NVMe™ SSD (option)
- AMD Zen5/5c CPU Cores
- AMD Radeon™ RDNA™ 3.5 Graphics
- AMD XDNA™ 2 NPU
- TDP Range from 15W to 54W
- Onboard NVMe™ SSD (option)
- AMD Embedded Ryzen V2000 processor series
- High-performance Zen 2 CPU & VEGA GPU
- Superior cost/performance ratio
- Up to 8 cores
- Wide TDP range from 10-54 W
conga-TR4
- AMD Embedded Ryzen V1000 processor series
- High-performance Vega GPU
- Supports up to 4x 4k
- Up to 4 cores
- Wide TDP range down to 12 W
- 8th Generation Intel® Core™ and Xeon®
- Performance-optimized design
- Up to 6 cores
- Supports USB 3.1 Gen 2 (10 Gbit/s)
- Up to 64 GB ECC memory
- 11th Generation Intel® Core™
- Performance-optimized design
- Up to 8 cores
- Extended temperature range options
- PCIe Gen 4
conga-zones
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