COM Express Type 6 Compact module with Intel® Atom™ X5-E8000 dual core processor with 1.04GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface.
conga-TCA4
COM Express Compact Type 6 module with Intel® Pentium® Quad Core Processor and low power consumption
- 初代 Intel® Pentium® クアッドコア・オン COM Express
- ハイパフォーマンス Intel® 第8世代グラフィックス
- 最大解像度 4000 (3840x2160px)
- 3x 独立ディスプレイ サポート
Specification
Operating: 0 to +60°CStorage: -20 to +80°C
Documents
Data Sheet
Image
Software
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
(core-image-minimal)yocto-2-3_release.170825
(core-image-minimal)yocto-2-5-1_release.180814
(core-image-sato)yocto-2-3_release.170825
(core-image-sato)yocto-2-5-1_release.180814
Product Variants
COM Express Type 6 Compact module with Intel® Celeron® N3010 dual core processor with 1.04GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface.
COM Express Type 6 Compact module with Intel® Celeron® N3060 dual core processor with 1.6GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface.
COM Express Type 6 Compact module with Intel® Celeron® N3160 quad core processor with 1.6GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface.
COM Express Type 6 Compact module with Intel® Pentium® N3710 quad core processor with 1.6GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface.
Ecosystem Details
Cooling solutions
Standard heatspreader for COM Express module conga-TCA3. All standoffs are M2.5 thread.
Standard heatspreader for COM Express module conga-TCA3. All standoffs are 2.7mm bore hole.
Standard passive cooling solution for COM Express module conga-TCA3 with 20mm overall heat sink height.
All standoffs are M2.5mm thread
Standard passive cooling solution for COM Express module conga-TCA3 with 20mm overall heat sink height.
All standoffs are 2.7mm bore hole.
Memory
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
Carrierboards
Evaluation Carrier Board for COM Express Type 6 Modules.
Accessories
conga-TEVAL/COMe 3.0
COM Express Type 6 Rev. 3.0 モジュール用 評価キャリアボード