conga-TC700 Preview image
  • conga-TC700 Image 1
  • conga-TC700 Image 2
  • conga-TC700 Image 3
  • conga-TC700 Image 4
  • conga-TC700 Image 5

conga-TC700

インテル® Core™ Ultra プロセッサー（コードネーム「Meteor Lake」）を搭載にした COM Express Compact Type 6 モジュール

Virtualization Ready
  • 最大16コア、22スレッドの インテル® パフォーマンス ハイブリッド アーキテクチャー
  • 内蔵 インテル® Arc™ グラフィックス - 最大 128EU のエントリーレベル ディスクリート グラフィックス パフォーマンス
  • インテル® AI Boost – 内蔵 NPU アクセラレーター
  • 最大 96 GB RAM（インバンド ECC 付き）
  • PCI Express Gen 4 | USB 4
Congatec Logo
Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

Value adding ecosystem offerings

Cooling solutions

Memory

Carrierboards

Module services

Specification

Formfactor
COM Express Compact
CPU
Intel® Core™ Ultra 5-125U (2 P-cores 1.3Ghz up to 4.3GHz, 8 E-Cores 0.8GHz up to 3.6GHz, 12MB cache)
Intel® Core™ Ultra 7-155U (2 P-cores 1.7Ghz up to 4.8GHz, 8 E-Cores 1.2GHz up to 3.8GHz, 12MB cache)
Intel® Core™ Ultra 5-125H (4 P-cores 1.2GHz up to 4.5GHz, 8 E-Cores 0.7GHz up to 3.6GHz, 18MB cache)
Intel® Core™ Ultra 7-155H (6 P-cores 1.4Ghz up to 4.8GHz, 8 E-Cores 0.9GHz up to 3.8GHz, 24MB cache)
DRAM
2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |up to 5600 MT/s | in-band ECC
Ethernet
2.5 GbE with TSN support via Intel® i226 Ethernet controller series
I/O Interfaces
Up to 8 PCIe Gen5 PEG (H-Series) or up to 2x4 PCIe Gen4 PEG (U-Series)
up to 8 PCIe Gen4
up to 2x USB4
4x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0
up to 2x SATA
2 x UART
GPIOs
SPI
LPC
SM-Bus
I²C
Mass storage
NVMe x4 SSD (optional) up to 1 TB capacity
Graphics
Intel® Arc™ Graphics architecture | up to 8 Xᵉ Cores with 128 EUs
NPU/AI Acceleration
Integrated NPU accelerator on all part numbers
congatec Board Controller
Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code
embedded BIOS Features
AMI Aptio® UEFI firmware
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
Security
Trusted Platform Module (TPM 2.0)
Power Management
ACPI 6.0 with battery support
Operating Systems
Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows 11
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
Hypervisor
RTS Real-Time Hypervisor
Temperature
Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
Up to 3x DDI (2x shared with USB4)
LVDS or eDP
4 x independent displays up to 8k
Size
95 x 95 mm (3,74" x 3,74")

Documents

All documents found on this page are updated without notification. Always check this page forthe latestversion.

Data Sheet

conga-TC700.pdf
02.04.2024

Product Variants

Product Filter:

    Add Filter:

     - 
     - 
     - 
     - 
     - 
     - 
    There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
    If you don't find the configuration you require contact your congatec Sales representative for further assistance.
    conga-TC700/ultra5-125H (P/N 045701)

    COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 4 P-cores, 8 E-cores and 2 Low Power E-cores  | P-cores 1.2GHz up to 4.5GHz (turbo) | E-cores 0.7GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) | Integrated NPU | 18MB Intel® Smart Cache | Intel® Arc™ graphics with 7 Xe cores (112 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface  | 28W Base-TDP | Intel® code name Meteor Lake-H

    conga-TC700/ultra5-125U (P/N 045711)

    COM Express Type 6 Compact module based on Intel® Core™ Ultra 5 processor with 2 P-cores, 8 E-cores  and 2 Low Power E-cores | P-cores 1.3Ghz up to 4.3GHz (turbo) | E-cores 0.8GHz up to 3.6GHz (turbo) | Low Power E-cores up to 2.1GHz (turbo) |Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) |Dual channel SODIMM DDR5 5600 MT/s memory interface | 15W Base-TDP | Intel® code name Meteor Lake-U

    conga-TC700/ultra7-155H (P/N 045700)

    COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 6 P-cores, 8 E-cores and 2 Low Power E-cores | P-cores 1.4Ghz up to 4.8GHz (turbo) | E-Cores 0.9GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.5GHz (turbo) |Integrated NPU | 24MB Intel® Smart Cache | Intel® Arc™ graphics with 8 Xe cores (128 EU) | Dual channel SODIMM DDR5 5600 MT/s memory interface | 28W Base-TDP |Intel® code name Meteor Lake-H

    conga-TC700/ultra7-155U (P/N 045710)

    COM Express Type 6 Compact module based on Intel® Core™ Ultra 7 processor with 2 P-cores, 8 E-cores and 2 Low Power E-cores  | P-cores 1.7Ghz up to 4.8GHz (turbo) | E-cores 1.2GHz up to 3.8GHz (turbo) | Low Power E-cores up to 2.1GHz (turbo) |Integrated NPU | 12MB Intel® Smart Cache | Intel® Graphics with 4 Xe cores (64 EU) |Dual channel SODIMM DDR5 5600 MT/s memory interface | 15W Base-TDP | Intel® code name Meteor Lake-U

    Ecosystem Details

    Cooling solutions

    conga-TC700/CSA-HP-B (P/N 045750)

    Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

    conga-TC700/CSA-HP-T (P/N 045751)

    Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.

    conga-TC700/CSP-HP-B (P/N 045752)

    Standard passive cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole.

    conga-TC700/CSP-HP-T (P/N 045753)

    Standard passive cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.

    conga-TC700/HSP-HP-B (P/N 045754)

    Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole.

    conga-TC700/HSP-HP-T (P/N 045755)

    Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded.

    Memory

    DDR5-SODIMM-5600 (8GB) (P/N 068930)

    DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (16GB) (P/N 068931)

    DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (32GB) (P/N 068932)

    DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (48GB) (P/N 068933)

    DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C

    DDR5-SODIMM-5600 (8GB) / i-temp (P/N 068934)

    DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, industrial temp -40°C to +85°C

    DDR5-SODIMM-5600 (16GB) / i-temp (P/N 068935)

    DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, industrial temp -40°C to +85°C

    DDR5-SODIMM-5600 (32GB) / i-temp (P/N 068936)

    DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, industrial temp -40°C to +85°C

    Carrierboards

    conga-TEVAL2 (P/N 065810)

    Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.

    Module services

    Design-In Training (P/N 022214)

    Design-Training to develop carrier boards for Computer on Modules

    Conformal Coating COM Express Basic and Compact (P/N )

    HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
    RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.