Designed for high-performance embedded and edge computing applications, our performance-class modules integrate latest multicore CPUs as well as GPUs for immersive graphics and/or accelerating AI inference workloads. They offer extremely high scalability for applications ranging from powerful PLCs, HMIs and shop-floor systems to immersive digital signage systems and high-performance medical equipment.
COM-HPC Client
Is ideal for next-generation high-end embedded and edge computing applications
conga-HPC/cRLS
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
conga-HPC/cRLP
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
conga-HPC/cTLH
- 11th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
COM-HPC Mini
Offers extraordinary performance and I/O density for space- and power-restricted applications
conga-HPC/mRLP
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
COM Express Type 6
Is the most elaborated high-performance ecosystem for the entire range of embedded computing applications
conga-TC675
- 13th Generation Intel® Core™
- Intel® Performance Hybrid Architecture
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
conga-TS570
- 11th Generation Intel® Core™
- Performance-optimized design
- Up to 8 cores
- Extended temperature range options
- PCIe Gen 4
conga-TCV2
- AMD Embedded Ryzen V2000 processor series
- High-performance Vega 7 GPU
- Superior cost/performance ratio
- Up to 8 cores
- Wide TDP range from 10-54 W
